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Most cited papers from Arkansas Power Electronics International

What are the most cited papers from Arkansas Power Electronics International?

The most cited paper from Arkansas Power Electronics International is "A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices" (Bret Whitaker, Adam Barkley, Zach Cole et al., 2013), with 438 citations. Next come "Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments" (170) and "A Harsh Environment Wireless Pressure Sensing Solution Utilizing High Temperature Electronics" (69).

Showing 50 of 61 papers. Every paper with more than 7 citations is listed.

Most cited papers, sortable by citations and release date
#Paper
1 A High-Density, High-Efficiency, Isolated On-Board Vehicle Battery Charger Utilizing Silicon Carbide Power Devices Bret Whitaker, Adam Barkley, Zach Cole et al. · IEEE Transactions on Power Electronics 28 Aug 2013 438
2 Silicon-carbide (SiC) semiconductor power electronics for extreme high-temperature environments Jared Homberger, Alexander B. Lostetter, Kraig J. Olejniczak et al. Conference paper 23 Dec 2004 170
3 A Harsh Environment Wireless Pressure Sensing Solution Utilizing High Temperature Electronics Jie Yang · Sensors Open access 27 Feb 2013 69
4 A wide bandgap silicon carbide (SiC) gate driver for high-temperature and high-voltage applications Ranjan Lamichhane, Nance Ericsson, Shane S. Frank et al. Conference paper Jun 2014 61
5 High-Temperature Silicon-on-Insulator Gate Driver for SiC-FET Power Modules Javier Valle-Mayorga, Caleb P. Gutshall, Khoa M. Phan et al. · IEEE Transactions on Power Electronics 12 Jan 2012 57
6 Wide bandwidth system identification of AC system impedances by applying pertubations to an existing converter Daniel Martin, Enrico Santi, Adam Barkley Conference paper Sep 2011 50
7 High-temperature silicon carbide and silicon on insulator based integrated power modules Alexander B. Lostetter, Jared Hornberger, Brice R. McPherson et al. Conference paper Sep 2009 46
8 A high-temperature multichip power module (MCPM) inverter utilizing silicon carbide (SiC) and silicon on insulator (SOI) electronics Jared Homberger, Edgar Cilio, Roberto M. Schupbach et al. Conference paper Jun 2006 42
9 A Silicon Carbide Wireless Temperature Sensing System for High Temperature Applications Jie Yang · Sensors Open access Feb 2013 41
10 A 4H Silicon Carbide Gate Buffer for Integrated Power Systems Nance Ericson, Shane S. Frank, C.L. Britton et al. · IEEE Transactions on Power Electronics 9 Jul 2013 41
11 Power-CAD: A novel methodology for design, analysis and optimization of Power Electronic Module layouts Naveed Hingora, Xiangyu Liu, Yongfeng Feng et al. Conference paper Sep 2010 40
12 A 650 V/150 A enhancement mode GaN-based half-bridge power module for high frequency power conversion systems Brandon Passmore, S. Storkov, B. McGee et al. Conference paper Sep 2015 40
13 Evaluation of gold and aluminum wire bond performance for high temperature (500 °C) silicon carbide (SiC) power modules Habib A. Mustain, Alexander B. Lostetter, Warren D. Brown Conference paper 27 Jul 2005 36
14 Screening of Commercial and Pecan Shell-Extracted Liquid Smoke Agents as Natural Antimicrobials against Foodborne Pathogens Ellen J. Van Loo, Dinesh Babu, Philip G. Crandall et al. · Journal of Food Protection Open access Jun 2012 35
15 A Fully Integrated 300°C, 4 kW, 3-Phase, SiC Motor Drive Module Jared Hornberger, Edgar Cilio, Brice R. McPherson et al. Conference paper 2007 35
16 A Novel High Density 100kW Three-Phase Silicon Carbide (SIC) Multichip Power Module (MCPM) Inverter Edgar Cilio, Jared Homberger, Brice R. McPherson et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition Conference paper Feb 2007 32
17 Ultra-Lightweight, High Efficiency SiC Based Power Electronic Converters for Extreme Environments S. Mounce, Brice R. McPherson, Roberto M. Schupbach et al. Conference paper 2 Aug 2006 30
18 Wide bandwidth three-phase impedance identification using existing power electronics inverter Daniel Martin, Isaac Nam, Jonathan Siegers et al. Conference paper Mar 2013 27
19 High-temperature SiC power module with integrated SiC gate drivers for future high-density power electronics applications Bret Whitaker, Zach Cole, Brandon Passmore et al. Conference paper Oct 2014 27
20 High-temperature silicon carbide (SiC) power switches in multichip power module (MCPM) applications Jared Hornberger, S. Mounce, Roberto M. Schupbach et al. Conference paper 24 Oct 2005 22
21 High-temperature integration of silicon carbide (SiC) and silicon-on-insulator (SOI) electronics in multichip power modules (MCPMs) Jared Hornberger, S. Mounce, Roberto M. Schupbach et al. Conference paper 2005 21
22 Delay-insensitive asynchronous ALU for cryogenic temperature environments Brent Hollosi, Matthew Barlow, Guoyuan Fu et al. Conference paper Aug 2008 21
23 Ultra-Wide Temperature (-230°C to 130°C) DC-Motor Drive with SiGe Asynchronous Controller Jack Bourne, Roberto M. Schupbach, Brent Hollosi et al. Conference paper Mar 2008 20
24 A high-frequency, high-efficiency silicon carbide based phase-shifted full-bridge converter as a core component for a high-density on-board vehicle battery charging system Bret Whitaker, Adam Barkley, Zach Cole et al. Conference paper Jun 2013 19
25 High voltage, high power density bi-directional multi-level converters utilizing silicon and silicon carbide (SiC) switches Bradley A. Reese, Marcelo Schupbach, Alex Lostetter et al. · Conference proceedings/Conference proceedings - IEEE Applied Power Electronics Conference and Exposition Conference paper Feb 2008 19
26 A UVLO Circuit in SiC Compatible With Power MOSFET Integration Michael D. Glover, Paul Shepherd, Anthony Matt Francis et al. · IEEE Journal of Emerging and Selected Topics in Power Electronics 21 Mar 2014 19
27 High-Performance, Wide-Bandgap Power Electronics Ty R. McNutt, Brandon Passmore, John R. Fraley et al. · Journal of Electronic Materials 15 Sep 2014 19
28 High temperature ceramic capacitors E.F. Alberta, Wesley S. Hackenberger, Craig J. Stringer et al. Dec 2006 18
29 HIGH TEMPERATURE (250 °C) SIC POWER MODULE FOR MILITARY HYBRID ELECTRICAL VEHICLE APPLICATIONS Roberto M. Schupbach, Brice R. McPherson, Ty R. McNutt et al. · SAE technical papers on CD-ROM/SAE technical paper series Conference paper 9 Aug 2011 16
30 Temperature Effects on the Antimicrobial Efficacy of Condensed Smoke and Lauric Arginate against Listeria and Salmonella Jody M. Lingbeck, Paola Cordero, Corliss A. O’Bryan et al. · Journal of Food Protection Open access 21 May 2014 15
31 Development of a DC Motor Drive for Extreme Cold Environments John Garrett, Roberto M. Schupbach, Alexander B. Lostetter et al. Conference paper Mar 2007 15
32 High-frequency AC-DC conversion with a silicon carbide power module to achieve high-efficiency and greatly improved power density Bret Whitaker, Adam Barkley, Zach Cole et al. Conference paper Jul 2013 15
33 Sweetgum: a new look JP Adams, JM Lingbeck, Philip G. Crandall et al. · iForest - Biogeosciences and Forestry Open access 23 Jun 2015 15
34 Design and Fabrication of a High Temperature (250 °C Baseplate), High Power Density Silicon Carbide (SiC) Multichip Power Module (MCPM) Inverter Edgar Cilio, Jared Hornberger, Brice R. McPherson et al. · Proceedings of the Annual Conference of the IEEE Industrial Electronics Society Conference paper Nov 2006 14
35 Impact of solid-state fault current limiters on protection equipment in transmission and distribution systems Yucheng Feng, Erik D. Johnson, Osama S. Saadeh et al. Conference paper Apr 2010 13
36 1200-V, 50-A, Silicon Carbide Vertical Junction Field Effect Transistors for Power Switching Applications Victor Veliadis, Ty R. McNutt, Megan McCoy et al. · Materials science forum Open access 26 Sep 2008 13
37 VJFET Based All-SiC Normally-Off Cascode Switch for High Temperature Power Handling Applications Victor Veliadis, Harold Hearne, Ty R. McNutt et al. · Materials science forum 2 Mar 2009 13
38 Extending the operational limits of the push-pull converter with SiC devices and an active energy recovery clamp circuit Bret Whitaker, Daniel Martin, Edgar Cilio Conference paper Mar 2015 13
39 High Temperature (250 °C) Silicon Carbide Power Modules With Integrated Gate Drive Boards Bradley A. Reese, Brice R. McPherson, Robert Shaw et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) Conference paper 2010 12
40 A pFET-access radiation-hardened SRAM for extreme environments Matthew Barlow, Guoyuan Fu, Brent Hollosi et al. Conference paper Aug 2008 12
41 Solid-state fault current limiters: Silicon versus silicon carbide Homer Alan Mantooth, Osama S. Saadeh, Erik D. Johnson et al. Conference paper Jul 2008 11
42 Development and Testing of Harsh Environment, Wireless Sensor Systems for Industrial Gas Turbines David G. M. Mitchell, Anand V. Kulkarni, Alex Lostetter et al. Conference paper 2009 11
43 Spray Cooling Development Effort for Microgravity Environments Brian L. Rowden · AIP conference proceedings Conference paper 2006 11
44 Effects of smoking and marination on the sensory characteristics of cold-cut chicken breast filets: A pilot study Shilpa S. Samant, Philip G. Crandall, Corliss A. O’Bryan et al. · Food Science and Biotechnology Open access Dec 2016 10
45 An investigation of low voltage arc flash exposure A. M. Smoak, A. J. Keeth Conference paper Mar 2013 10
46 An integrated gate driver in 4H-SiC for power converter applications M.N. Ericson, Shane S. Frank, C.L. Britton et al. Conference paper Oct 2014 10
47 The Design and Development of a 15 kV SiC Half-Bridge Multi-Chip Power Module for Medium Voltage Applications Zach Cole, Jennifer Stabach, G. Falling et al. · IMAPSource Proceedings Conference paper Oct 2014 9
48 SiC intelligent multi module DC/DC converter system for space applications Edgar Cilio, Gavin Mitchell, Marcelo Schupbach et al. Conference paper Mar 2009 9
49 Initial development of a solid-state fault current limiter for naval power systems protection Jack Bourne, Marcelo Schupbach, Joe Carr et al. Conference paper Apr 2009 9
50 Development and F-Class Industrial Gas Turbine Engine Testing of Smart Components With Direct-Write Embedded Sensors and High Temperature Wireless Telemetry David G. M. Mitchell, Anand V. Kulkarni, E. Roesch et al. Conference paper 2008 9

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.