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Institution · ASM International (Netherlands)

Most cited papers from ASM International (Netherlands)

ASM International (Netherlands)

What are the most cited papers from ASM International (Netherlands)?

The most cited paper from ASM International (Netherlands) is "Batch ALD: Characteristics, comparison with single wafer ALD, and examples" (Ernst H.A. Granneman, Pamela R. Fischer, Dieter Pierreux et al., 2007), with 122 citations. Next come "Plasma-enhanced growth and composition of silicon oxynitride films" (89) and "Annealing of plasma silicon oxynitride films" (74).

Showing 50 of 68 papers. Every paper is listed.

Most cited papers, sortable by citations and release date
#Paper
1 Batch ALD: Characteristics, comparison with single wafer ALD, and examples Ernst H.A. Granneman, Pamela R. Fischer, Dieter Pierreux et al. · Surface and Coatings Technology 24 May 2007 122
2 Plasma-enhanced growth and composition of silicon oxynitride films C. M. M. Denisse, Kars Troost, J. B. Oude Elferink et al. · Journal of Applied Physics Oct 1986 89
3 Annealing of plasma silicon oxynitride films C. M. M. Denisse, Kars Troost, F.H.P.M. Habraken et al. · Journal of Applied Physics Oct 1986 74
4 Variable-Gain Control for Respiratory Systems Bram Hunnekens, Sjors Kamps, Nathan van de Wouw · IEEE Transactions on Control Systems Technology Open access 10 Oct 2018 57
5 Ultrabright single‐photon emission from germanium‐vacancy zero‐phonon lines: deterministic emitter‐waveguide interfacing at plasmonic hot spots Hamidreza Siampour, Ou Wang, Vladimir A. Zenin et al. · Nanophotonics Open access Feb 2020 45
6 Denticles in thelodonts Wim Van der Brugghen, Philippe Janvier · Nature 8 Jul 1993 45
7 A Comparison of Spike, Flash, SPER and Laser Annealing for 45nm CMOS Richard Lindsay, B. J. Pawlak, J. A. Kittl et al. · MRS Proceedings 2003 42
8 Enhanced boron activation in silicon by high ramp-up rate solid phase epitaxial regrowth Bartek J. Pawlak, Wilfried Vandervorst, A. J. Smith et al. · Applied Physics Letters 3 Mar 2005 34
9 Modeling and control of the wafer temperatures in a diffusion furnace B. J. Van Schravendijk, Willem L. de Koning, W. C. Nuijen · Journal of Applied Physics 15 Feb 1987 33
10 Leakage optimization of ultra-shallow junctions formed by solid phase epitaxial regrowth Richard Lindsay, K. Henson, W. Vandervorst et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena 2004 32
11 New Wet Cleaning Strategies for Obtaining Highly Reliable Thin Oxides Marc Heyns, Steven Verhaverbeke, Marc Meuris et al. · MRS Proceedings 24 Oct 1993 26
12 Modeling of the depletion of the amorphous-silicon surface during hemispherical grained silicon formation J.-M. Sallese, A. Ils, D. Bouvet et al. · Journal of Applied Physics 15 Nov 2000 26
13 Low temperature spike anneal for Ni-silicide formation A. Lauwers, J. A. Kittl, Mark van Dal et al. · Microelectronic Engineering 11 Aug 2004 25
14 Effect of Hydroxyethyl Cellulose Concentration on Surface Qualities of Silicon Wafer after Touch Polishing Process Hee-Sub Hwang, Jae-Hyung Lim, Jin-Hyung Park et al. · Electrochemical and Solid-State Letters 2010 21
15 The mechanism of mobility degradation in MISFETs with Al/sub 2/O/sub 3/ gate dielectric Kazuyoshi Torii, Y. Shimamoto, Shinichi Saito et al. Conference paper 25 Jun 2003 18
16 Pressure and temperature dependence of Zn incorporation in metalorganic chemical vapour deposition grown GaAs and AlGaAs using diethylzinc as precursor Paul R. Hageman, Mart H. J. M. de Croon, Xiao Hong Tang et al. · Journal of Crystal Growth Open access Mar 1993 16
17 Lanthanide-Doped Nanoparticles Anchoring on Metal–Organic Frameworks with Thermally Enhanced Upconversion Luminescence for Sensitive Nanothermometers Wenqian Cao, Zhengluan Liao, Hongxu Chen et al. · ACS Applied Materials & Interfaces 17 Oct 2024 15
18 Optimizing p-type ultra-shallow junctions for the 65 nm CMOS technology node Bartek J. Pawlak, Richard Lindsay, Radu Surdeanu et al. Conference paper 2002 14
19 Laser vs. Blade Dicing for Direct Bonded Heterogeneous Integration (DBHi) Si Bridge Aakrati Jain, Kamal K. Sikka, Juan-Manuel Gomez et al. Conference paper Jun 2021 13
20 In-Line Electrical Metrology for High-K Gate Dielectrics Deposited by Atomic Layer CVD Hartmut Witte, Sophie Passefort, Wim F. A. Besling et al. · Journal of The Electrochemical Society 2003 11
21 The role of hydrogen in the deposition, composition, and structure of semi-insulating polycrystalline silicon films B. Verstegen, F.H.P.M. Habraken, Werner F. van der Weg et al. · Journal of Applied Physics 15 Apr 1985 11
22 NiSi contact formation - process integration advantages with partial Ni conversion Klaus Funk, Xavier Llimona i Pagès, В. И. Кузнецов et al. Conference paper 27 Jul 2005 11
23 Laser-Based Full Cut Dicing Evaluations for Thin Si Wafers Jeroen V. Borkulo, Richard van der Stam Conference paper May 2018 10
24 An electron-spin resonance study of the structure of plasma-deposited silicon-oxynitride films C. M. M. Denisse, Joep Janssen, F.H.P.M. Habraken et al. · Journal of Applied Physics Aug 1987 9
25 Cycle time advantages of mini batch manufacturing and integrated metrology in a 300 mm vertical furnace R. Noben, Roel van Driel, T. Claasen-Vujcic Conference paper 13 Nov 2002 9
26 A More Than Moore Enabling Wafer Dicing Technology Jeroen V. Borkulo, Rogier Evertsen, Richard van der Stam Conference paper May 2019 7
27 LPCVD of aluminium in a batch-type load-locked multi-chamber processing system H.W. Piekaar, L.F.Tz. Kwakman, E.H.A. Granneman Conference paper 13 Jan 2003 7
28 Simulation and validation of SiO2LPCVD from TEOS in a vertical 300 mm multi-wafer reactor G. J. Schoof, Chris R. Kleijn, Harry E.A. Van den Akker et al. · Journal de Physique IV (Proceedings) Jun 2002 7
29 Advanced PMOS Device Architecture for Highly-Doped Ultra-Shallow Junctions Radu Surdeanu, B. J. Pawlak, Richard Lindsay et al. · Japanese Journal of Applied Physics Apr 2004 7
30 Multi Beam Full Cut Dicing of Thin Si IC Wafers Jeroen V. Borkulo, Paul Verburg, Richard van der Stam Conference paper May 2017 6
31 Analysis of plasma enhanced chemical vapour deposition‐grown Borophosphosilicate glass with a combination of Rutherford backscattering and elastic recoil detection J. B. Oude Elferink, K. Dunselman, Eiko Evers et al. · Surface and Interface Analysis Jul 1986 6
32 Pattern-Dependent Heating of 3D Structures E.H.A. Granneman, Xavier Llimona i Pagès, Herbert Terhorst et al. Conference paper Oct 2007 6
33 Pattern forming instabilities driven by non-diffusive interactions I. Primi, ,Advanced Semiconductor Materials Lithography, ASML B.V., Office 06.C.006, 5500A, Angela Stevens et al. · Networks and Heterogeneous Media Open access 2013 6
34 Film interface control in integrated processing systems* E.H.A. Granneman · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena Jul 1994 6
35 Intensive and Persistent Chemiluminescence from Orderly Arranged Ligands within Metal–Organic Frameworks for Inflammation Imaging Hongxu Chen, Wenqian Cao, Yuanjing Cui et al. · Inorganic Chemistry 28 Jan 2025 4
36 Application of a cluster tool for interface engineering of polysilicon emitters Reuss, Werkhoven, Granneman et al. Conference paper 1993 4
37 Moiré Engineering of Interlayer Coupling in WS2/MoS2 Monolayers Linglong Zhang, Masab Rafique, Jian Kang et al. · Nano Letters 6 Jun 2025 3
38 Enhanced Emission in Erbium- and Ytterbium-Doped Gallium Oxide Devices with Constrained Energy Band on Silicon Substrates Houwei Pang, Lei Yang, Dongsheng Li et al. · ACS Applied Electronic Materials 11 Mar 2025 3
39 Diffusion and activation of Boron and Phosphorus in preamorphized and crystalline Germanium using ultra fast spike anneal V. Mazzocchi, Xavier Llimona i Pagès, M. Py et al. Conference paper Sep 2009 3
40 Continuity in the development of ultra shallow junctions for 130-45 nm CMOS: the tool and annealing methods В. И. Кузнецов, A.J.M.M. van Zutphen, Harald R. Kerp et al. Conference paper 22 Mar 2004 3
41 Scaling of Floating Gate electrode for sub-40nm flash technologies Joeri De Vos, Dirk Wellekens, Ingrid Debusschere et al. Conference paper 2008 3
42 A Laser Dicing Method for Plus-Shaped Dies for Heterogenous Integration Applications Aakrati Jain, Kamal K. Sikka, Shidong Li et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Conference paper May 2022 2
43 Laser-Based Full Cut Dicing Evaluations for Thin Si wafers Peter Dijkstra, Jeroen V. Borkulo, Richard van der Stam Conference paper 26 Jun 2020 2
44 Insight into the benefits of ESA Education activities: an overview of the next European space-related workforce Federica Angeletti, Francesco Latini, Cameron Willett et al. Conference paperOpen access 2020 2
45 Switching Behavior of HfO2-Based Resistive RAM with Vertical CNT Bottom Electrode Naga Sruti Avasarala, Dirk J. Wouters, Małgorzata Jurczak et al. Conference paper May 2017 2
46 In-Situ Multiprocessing of Ultrathin Silicon Nitride Capacitors for Advanced Dram Cells Randhir P. S. Thakur, R. Hawthorne, V.K. Mathews et al. · MRS Proceedings 1994 2
47 Cluster-Tool Integrated HF Vapor Etching for Native Oxide Free Processing Chris J. Werkhoven, Ernst H.A. Granneman, Loek F.Tz. Kwakman et al. · MRS Proceedings 24 Oct 1993 2
48 C-V test structures for metal gate CMOS R.G. Bankras, M.P.J. Tiggelman, Muhammad Adi Negara et al. Conference paperOpen access 2006 2
49 Thermal Stability of Pt and C-Doped NiSi Films Vladimir Machkaoutsan, Xavier Llimona i Pagès, Matthias Bauer et al. Conference paper Oct 2007 2
50 Interface engineering in silicon semiconductor processing using a vacuum cluster tool M. Hendriks · Microelectronic Engineering Aug 1994 2

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.