Institution · ASM Pacific Technology (China)
Most cited papers from ASM Pacific Technology (China)
What are the most cited papers from ASM Pacific Technology (China)?
The most cited paper from ASM Pacific Technology (China) is "Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging" (John Hon-Shing Lau et al., 2017), with 167 citations. Next come "Recent Advances and New Trends in Flip Chip Technology" (157) and "Non-steroidal anti-inflammatory drug (NSAID) therapy in patients with hypertension, cardiovascular, renal or gastrointestinal comorbidities: joint APAGE/APLAR/APSDE/APSH/APSN/PoA recommendations" (156).
Showing 50 of 58 papers. Every paper with more than 17 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging John Hon-Shing Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | 13 Jul 2017 | 167 |
| 2 | Recent Advances and New Trends in Flip Chip Technology John Hon-Shing Lau · Journal of Electronic Packaging | 5 Jul 2016 | 157 |
| 3 | Non-steroidal anti-inflammatory drug (NSAID) therapy in patients with hypertension, cardiovascular, renal or gastrointestinal comorbidities: joint APAGE/APLAR/APSDE/APSH/APSN/PoA recommendations Cheuk‐Chun Szeto, Kentaro Sugano, Ji‐Guang Wang et al. · Gut | 14 Jan 2020 | 156 |
| 4 | A Multiple-Goal Reinforcement Learning Method for Complex Vehicle Overtaking Maneuvers Daniel C. K. Ngai, N.H.C. Yung · IEEE Transactions on Intelligent Transportation Systems | 9 Feb 2011 | 131 |
| 5 | Recent Advances and Trends in Fan-Out Wafer/Panel-Level Packaging John Hon-Shing Lau · Journal of Electronic Packaging | 29 Mar 2019 | 127 |
| 6 | Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration John Hon-Shing Lau · Journal of Electronic Packaging | 23 Sep 2014 | 109 |
| 7 | Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging John Hon-Shing Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | May 2018 | 99 |
| 8 | Fan-Out Wafer-Level Packaging for Heterogeneous Integration John Hon-Shing Lau et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | 12 Jul 2018 | 91 |
| 9 | GM-PHD-Based Multi-Target Visual Tracking Using Entropy Distribution and Game Theory Xiaolong Zhou, Youfu Li, Bingwei He et al. · IEEE Transactions on Industrial Informatics | 31 Jan 2014 | 86 |
| 10 | Novel Modeling and Damping Technique for Hybrid Stepper Motor Kenneth W. H. Tsui, N.C. Cheung, K.C.-W. Yuen · IEEE Transactions on Industrial Electronics | 12 Nov 2008 | 66 |
| 11 | Numerical investigation of the inertial cavitation threshold by dual-frequency excitation in the fluid and tissue Mingjun Wang, Yufeng Zhou · Ultrasonics Sonochemistry | Dec 2017 | 58 |
| 12 | Mortality and Technique Failure in Peritoneal Dialysis Patients Using Advanced Peritoneal Dialysis Solutions Seung Hyeok Han, Song Vogue Ahn, Jee Young Yun et al. · American Journal of Kidney Diseases | 20 Jul 2009 | 58 |
| 13 | Numerical study of complex fracture geometry effect on two-phase performance of shale-gas wells using the fast EDFM method Mohammad Altwaijri, Zhaohui Xia, Wei Yu et al. · Journal of Petroleum Science and Engineering | 4 Jan 2018 | 56 |
| 14 | Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers John Hon-Shing Lau, Ming Li, Lei Yang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | 11 Jul 2018 | 55 |
| 15 | Effects of icodextrin on patient survival and technique success in patients undergoing peritoneal dialysis Seung Hyeok Han, Song Vogue Ahn, J. Y. Yun et al. · Nephrology Dialysis Transplantation | 3 Oct 2011 | 55 |
| 16 | Polynucleotides in Aesthetic Medicine: A Review of Current Practices and Perceived Effectiveness K Lee, K Chan, Angela Y. Lee et al. · International Journal of Molecular Sciences | 27 Jul 2024 | 51 |
| 17 | Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration Cheng-Ta Ko et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | 12 Jul 2018 | 51 |
| 18 | Energy loss and mechanical efficiency forecasting model for aero-engine bevel gear power transmission Han Ding, Hongping Li, Siyu Chen et al. · International Journal of Mechanical Sciences | 25 Jul 2022 | 48 |
| 19 | Water-induced degradation in lead zirconate titanate piezoelectric ceramics W. P. Chen, H.L.W. Chan, F. C. H. Yiu et al. · Applied Physics Letters | 13 May 2002 | 48 |
| 20 | Fuzzy-based rate control for real-time MPEG video Danny H. K. Tsang, Brahim Bensaou, S.T.C. Lam · IEEE Transactions on Fuzzy Systems | 1998 | 46 |
| 21 | Cyber—physical systems development for construction applications Chinemelu J. Anumba, Abiola Abosede Akanmu, Xiao Yuan et al. · Frontiers of Engineering Management | 11 Sep 2020 | 45 |
| 22 | Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs) John Hon-Shing Lau et al. · Journal of Microelectronics and Electronic Packaging | Oct 2017 | 41 |
| 23 | Simultaneous determination of 58 pesticides and relevant metabolites in eggs with a multi-functional filter by ultra-high performance liquid chromatography-tandem mass spectrometry Xining Zhang, Yue Song, Qi Jia et al. · Journal of Chromatography A | 30 Jan 2019 | 38 |
| 24 | Thermo-Compression Bonding for fine-pitch copper-pillar flip-chip interconnect - tool features as enablers of unique technology Amram Eitan, Kin-Yik Hung | May 2015 | 34 |
| 25 | Design, Materials, Process, and Fabrication of Fan-Out Panel-Level Heterogeneous Integration Cheng-Ta Ko et al. · Journal of Microelectronics and Electronic Packaging | Oct 2018 | 31 |
| 26 | A Novel Planar Switched Reluctance Motor for Industrial Applications Jianfei Pan, N.C. Cheung, Wai-Chuen Gan et al. · IEEE Transactions on Magnetics | 29 Sep 2006 | 31 |
| 27 | Pedestrian Behavior Prediction based on Motion Patterns for Vehicle-to-Pedestrian Collision Avoidance Zhuo Chen, Daniel C. K. Ngai, N.H.C. Yung | Oct 2008 | 30 |
| 28 | An employee involvement strategy for ISO 9000 registration and maintenance: a case study for Hong Kong and China companies Shiyuan Cheng, V.M. Rao Tummala · International Journal of Quality & Reliability Management | Dec 1998 | 30 |
| 29 | Original Application of Stop-Band Negative Group Delay Microwave Passive Circuit for Two-Step Stair Phase Shifter Designing Blaise Ravelo, Glauco Filho Fontgalland, Hugerles S. Silva et al. · IEEE Access | 24 Dec 2021 | 28 |
| 30 | High-pass NGD characterization of resistive-inductive network based low-frequency circuit Mathieu Guérin, Fayu Wan, Konstantin Gorshkov et al. · COMPEL The International Journal for Computation and Mathematics in Electrical and Electronic Engineering | 24 Sep 2021 | 28 |
| 31 | A rapid competitive ELISA assay of Okadaic acid level based on epoxy-functionalized magnetic beads Linjiang Pang, Haoran Quan, Ying Xin Sun et al. · Food and Agricultural Immunology | 2019 | 28 |
| 32 | Robust learning control of a high precision planar parallel manipulator Jacob W.F. Cheung, Y.S. Hung · Mechatronics | Sep 2008 | 28 |
| 33 | A Novel Flux Linkage Measurement Method for Linear Switched Reluctance Motors Shi Wei Zhao, N.C. Cheung, Wai-Chuen Gan et al. · IEEE Transactions on Instrumentation and Measurement | 9 Sep 2009 | 27 |
| 34 | Reliability of Fan-Out Wafer-Level Heterogeneous Integration John Hon-Shing Lau et al. · Journal of Microelectronics and Electronic Packaging | Oct 2018 | 26 |
| 35 | An Interpolation-Based Calibration Architecture for Pipeline ADC With Nonlinear Error Jie George Yuan, Sheung Wai Fung, Kai Yin Chan et al. · IEEE Transactions on Instrumentation and Measurement | 15 Sep 2011 | 26 |
| 36 | Comparative effectiveness of anti‐IL5 and anti‐IgE biologic classes in patients with severe asthma eligible for both Paul Pfeffer et al. · Allergy | 17 Mar 2023 | 25 |
| 37 | Combined endo-laparoscopic surgery for difficult benign colorectal polyps Zhonghui Liu, Jiang Li, Fion Siu‐Yin Chan et al. · Journal of Gastrointestinal Oncology | Jun 2020 | 24 |
| 38 | Patent issues of embedded fan-out wafer/panel level packaging John Hon-Shing Lau | Mar 2016 | 24 |
| 39 | Robust Visual Tracking Using Flexible Structured Sparse Representation Tianxiang Bai, Youfu Li · IEEE Transactions on Industrial Informatics | 3 Jul 2013 | 24 |
| 40 | Voids-free Die-level Cu/ILD Hybrid bonding Katsuyuki Sakuma, Roy Yu, Nicholas Alexander Polomoff et al. | May 2023 | 23 |
| 41 | A Novel Double Redundant Brake-by-Wire System for High Automation Driving Safety: Design, Optimization and Experimental Validation Chao Li, Junzhi Zhang, Xiaohui Hou et al. · Actuators | 26 Oct 2021 | 23 |
| 42 | 2.3D Hybrid Substrate with Ajinomoto Build-Up Film for Heterogeneous Integration Gary Chang-Fu Chen, John Hon-Shing Lau, Channing Cheng-Lin Yang et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) | May 2022 | 22 |
| 43 | A Novel Planar Switched Reluctance Motor for Industrial Applications N. Cheung, J. Pan, Wai-Chuen Gan | May 2006 | 21 |
| 44 | Top-Rem grinding tool modification considering loaded edge contact for spiral bevel gears Kaibin Rong, Han Ding, Siyu Chen et al. · Advanced Engineering Informatics | 19 Jul 2022 | 20 |
| 45 | Development of chip-first and die-up fan-out wafer level packaging Xuan Hua, Hong Xu, Li Zhang et al. | Dec 2017 | 20 |
| 46 | Data-driven bending fatigue life forecasting and optimization via grinding Top-Rem tool parameters for spiral bevel gears Han Ding, Yuntai Zhang, Xiannian Kong et al. · Advanced Engineering Informatics | Aug 2022 | 19 |
| 47 | Robust algorithm of indirect tyre pressure monitoring system based on tyre torsional resonance frequency analysis Liqiang Jin, Xianglong Peng, Jia Liu et al. · Journal of Sound and Vibration | 18 Jul 2022 | 19 |
| 48 | Design and Synthesis of Inductorless Passive Cell Operating as Stop-Band Negative Group Delay Function Mathieu Guérin, Yang Liu, Alexandre Douyère et al. · IEEE Access | 2021 | 19 |
| 49 | Bandpass NGD TAN of Symmetric H-Tree With Resistorless Lumped-Network Blaise Ravelo, Fayu Wan, Jamel Nebhen et al. · IEEE Access | 2021 | 19 |
| 50 | Simultaneous determination of the residues of anesthetics and sedatives in fish using LC-QLIT-MS/MS combined with DSPE Qin Huang, Hua Zhou, Xianglun Wu et al. · Food Chemistry | 24 Sep 2022 | 18 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.