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Institution · Atotech (Germany)

Most cited papers from Atotech (Germany)

Atotech (Germany)

What are the most cited papers from Atotech (Germany)?

The most cited paper from Atotech (Germany) is "Gaia Data Release 2" (Dafydd Wyn Evans et al., 2018), with 762 citations. Next come "36th International Symposium on Intensive Care and Emergency Medicine" (531) and "Cu2ZnSnS4 thin film solar cells from electroplated precursors: Novel low-cost perspective" (426).

Showing 50 of 61 papers. Every paper with more than 24 citations is listed.

Most cited papers, sortable by citations and release date
#Paper
1 Gaia Data Release 2 Dafydd Wyn Evans et al. · Astronomy and Astrophysics Open access 24 Apr 2018 762
2 36th International Symposium on Intensive Care and Emergency Medicine R. M. Bateman et al. · Critical Care Open access2,440 authors Apr 2016 531
3 Cu2ZnSnS4 thin film solar cells from electroplated precursors: Novel low-cost perspective A. Ennaoui, Martha Ch. Lux‐Steiner, A. Weber et al. · Thin Solid Films 15 Nov 2008 426
4 Nanostructuring Titania: Control over Nanocrystal Structure, Size, Shape, and Organization Abdelkrim Chemseddine, Thomas Möritz · European Journal of Inorganic Chemistry 2 Feb 1999 386
5 MOF‐FF – A flexible first‐principles derived force field for metal‐organic frameworks Sareeya Bureekaew, Saeed Amirjalayer, Maxim A. Tafipolsky et al. · physica status solidi (b) Mar 2013 225
6 The crystallisation of Cu2ZnSnS4 thin film solar cell absorbers from co-electroplated Cu–Zn–Sn precursors Roland Schurr, Astrid Hölzing, Stefan Jost et al. · Thin Solid Films 9 Nov 2008 207
7 The mammalian retromer regulates transcytosis of the polymeric immunoglobulin receptor Marcel Vergés, Frédéric Luton, Carmen Gruber‐Traub et al. · Nature Cell Biology 11 Jul 2004 140
8 High aspect ratio TSV copper filling with different seed layers M. Jürgen Wolf, Thomas Dretschkow, Bernhard Wunderle et al. Conference paper May 2008 110
9 PKN3 is required for malignant prostate cell growth downstream of activated PI 3‐kinase Frauke Leenders, Kristin Möpert, Anett Schmiedeknecht et al. · The EMBO Journal Open access 29 Jul 2004 110
10 A chip-based platform for the in vitro generation of tissues in three-dimensional organization Eric Gottwald, Stefan Giselbrecht, Caroline Augspurger et al. · Lab on a Chip 2007 107
11 Adsorption of Thymine on Gold Single-Crystal Electrodes Bernd Roelfs, Elke Bunge, Clemens J. Schröter et al. · The Journal of Physical Chemistry B 1997 103
12 Tumor Suppressor Activity of Profilin Requires a Functional Actin Binding Site Nina Wittenmayer, Burkhard Jandrig, Martin Rothkegel et al. · Molecular Biology of the Cell Open access 10 Feb 2004 90
13 Flexible fluidic microchips based on thermoformed and locally modified thin polymer films Roman K. Truckenmüller, Stefan Giselbrecht, Clemens van Blitterswijk et al. · Lab on a Chip 2008 89
14 Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins Luhua Xu, Pradeep Dixit, Jianmin Miao et al. · Applied Physics Letters 15 Jan 2007 84
15 ST18 is a breast cancer tumor suppressor gene at human chromosome 8q11.2 Burkhard Jandrig, Susanne Seitz, Bernd Hinzmann et al. · Oncogene 18 Oct 2004 80
16 The world in 2025 - predictions for the next ten years Robin Taylor, David A. Baron, Daniel J. Schmidt Conference paper Oct 2015 75
17 Nickel–palladium bond pads for copper wire bonding Horst Clauberg, Petra Backus, Bob Chylak · Microelectronics Reliability 10 Jun 2010 72
18 Modern Thermoelectrochemistry Peter Gründler, Andreas Kirbs, Lothar Dunsch · ChemPhysChem 24 Jul 2009 68
19 3-Mercapto-1-Propanesulfonate for Cu Electrodeposition Studied by in Situ Shell-Isolated Nanoparticle-Enhanced Raman Spectroscopy, Density Functional Theory Calculations, and Cyclic Voltammetry Kevin Gary Schmitt, Ralf Schmidt, H. Frank von-Horsten et al. · The Journal of Physical Chemistry C 22 Sep 2015 62
20 Effect of brighteners on hydrogen evolution during zinc electroplating from zincate electrolytes M. Monev, Lidia Mirkova, I. Krastev et al. · Journal of Applied Electrochemistry Oct 1998 57
21 Raman and QCM Studies of PPG and PEG Adsorption on Cu Electrode Surfaces Ryan T. Rooney, Kevin Gary Schmitt, Hermann Frank von Horsten et al. · Journal of The Electrochemical Society Open access 2018 56
22 The Effect of Three Organic Additives on the Structure and Growth of Electrodeposited Copper: An In‐Situ Scanning Probe Microscopy Study Richard John Nichols, Claudia E. Bach, Heinrich Meyer · Berichte der Bunsengesellschaft für physikalische Chemie Aug 1993 54
23 An in situ scanning probe microscopy study of copper electrodeposition on conductive polypyrrole Richard John Nichols, D. Schröer, Heinrich Meyer · Electrochimica Acta Jul 1995 52
24 Interfacial Leveler-Accelerator Interactions in Cu Electrodeposition Christopher D. Bandas, Ryan T. Rooney, Andreas Kirbs et al. · Journal of The Electrochemical Society 12 Mar 2021 51
25 Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects Pradeep Dixit, Luhua Xu, Jianmin Miao et al. · Journal of Micromechanics and Microengineering 3 Aug 2007 48
26 Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating Pradeep Dixit, Chee Wee Tan, Luhua Xu et al. · Journal of Micromechanics and Microengineering 24 Apr 2007 48
27 Study of surface treatment processes for improvement in the wettability of silicon-based materials used in high aspect ratio through-via copper electroplating Pradeep Dixit, Xiaofeng Chen, Jianmin Miao et al. · Applied Surface Science 4 May 2007 48
28 High-speed imaging of ultrasound driven cavitation bubbles in blind and through holes Markus Kauer, Valentina Belova, Carlos Cairós et al. · Ultrasonics Sonochemistry Open access 30 Apr 2018 47
29 Adsorption of mercaptopropionic acid onto Au(1 1 1) Marc Petri, Dieter M. Kolb, Ulrich Memmert et al. · Electrochimica Acta 22 Oct 2003 47
30 Phosphopeptide Screening Using Nanocrystalline Titanium Dioxide Films as Affinity Matrix-Assisted Laser Desorption Ionization Targets in Mass Spectrometry Marie-Luise Niklew, Ulrike Hochkirch, Anna V. Melikyan et al. · Analytical Chemistry 12 Jan 2010 46
31 Fabrication of High Aspect Ratio 35 μm Pitch Through-Wafer Copper Interconnects by Electroplating for 3-D Wafer Stacking Pradeep Dixit, Jianmin Miao, Robert Preisser · Electrochemical and Solid-State Letters 2006 43
32 Kinetic regimes in the curing process of epoxy-phenol composites Lérys Granado, Stefan Kempa, Laurence John Gregoriades et al. · Thermochimica Acta 26 Jul 2018 42
33 Flight Test Results of a Thermoelectric Energy Harvester for Aircraft D. Samson, Martin Kluge, T. Fuss et al. · Journal of Electronic Materials 23 Feb 2012 42
34 Bioactive adrenomedullin, proenkephalin A and clinical outcomes in an acute heart failure setting John Molvin, Amra Jujić, Silvia Navarin et al. · Open Heart Open access Jul 2019 41
35 Next Generation Nickel-Based Bond Pads Enable Copper Wire Bonding Bob Chylak, Jamin Ling, Horst Clauberg et al. · ECS Transactions Conference paper 6 Mar 2009 41
36 Classification of growth behaviour for copper on various substrates with in-situ scanning probe microscopy Richard John Nichols, Elke Bunge, Heinrich Meyer et al. · Surface Science Jul 1995 40
37 Structure and Dynamics of Tetramethylthiourea Adsorption on Au(111) Studied by in Situ Scanning Tunneling Microscopy Elke Bunge, Richard John Nichols, Bernd Roelfs et al. · Langmuir 1996 39
38 Improvements of the Epoxy–Copper Adhesion for Microelectronic Applications Lérys Granado, Stefan Kempa, Laurence John Gregoriades et al. · ACS Applied Electronic Materials 3 Jul 2019 38
39 Low-Temperature Dip-Based All-Copper Interconnects Formed by Pressure-Assisted Sintering of Copper Nanoparticles Luca Del Carro, Jonas Zürcher, Ute Drechsler et al. · IEEE Transactions on Components Packaging and Manufacturing Technology 9 Jan 2019 35
40 Visualization and optimization of cavitation activity at a solid surface in high frequency ultrasound fields Markus Kauer, Valentina Belova, Carlos Cairós et al. · Ultrasonics Sonochemistry 11 Jun 2016 35
41 Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering Bernhard Robert Gollas, Jörg Albering, Katharina Schmut et al. · Intermetallics 14 Jun 2008 35
42 Adsorption of the Additives MPA, MPSA, and SPS onto Cu(111) from Sulfuric Acid Solutions Corina Täubert, D.M. Kolb, Ulrich Memmert et al. · Journal of The Electrochemical Society Open access 2007 35
43 Chain length variation to probe the mechanism of accelerator additives in copper electrodeposition Kevin Gary Schmitt, Ralf Schmidt, Josef Gaida et al. · Physical Chemistry Chemical Physics 2019 34
44 Styrylsulfonates and ‐Sulfonamides through Pd‐Catalysed Matsuda–Heck Reactions of Vinylsulfonic Acid Derivatives and Arenediazonium Salts Bernd Schmidt, Felix Wolf, Heiko Brunner · European Journal of Organic Chemistry 25 May 2016 34
45 Autocatalysis during Electroless Copper Deposition using Glyoxylic Acid as Reducing Agent Lu Yu, Lian Guo, Robert Preisser et al. · Journal of The Electrochemical Society 2013 34
46 The use of conducting polymers and colloids in the through hole plating of printed circuit boards Heinrich Meyer, Richard John Nichols, D. Schröer et al. · Electrochimica Acta Jun 1994 34
47 Filling through holes and blind microvias with copper using reverse pulse plating and insoluble anodes Bernd Roelfs, Nina Dambrowsky, Christof Erben et al. · Circuit World 17 Aug 2012 34
48 Pretreatment of polymer surfaces—the crucial step prior to metal deposition D. Schröer, Richard John Nichols, Heinrich Meyer · Electrochimica Acta Jul 1995 31
49 Genetic background of different cancer cell lines influences the gene set involved in chromosome 8 mediated breast tumor suppression Susanne Seitz, Eberhard Korsching, Jörg Paul Weimer et al. · Genes Chromosomes and Cancer 21 Mar 2006 30
50 Adsorption of PEG on Au(111) Single-Crystal Electrodes and Its Influence on Copper Deposition Marc Petri, Dieter M. Kolb, Ulrich Memmert et al. · Journal of The Electrochemical Society 2004 29

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.