Institution · Compass Technology (China)

Most cited papers from Compass Technology (China)

Compass Technology (China)

What are the most cited papers from Compass Technology (China)?

The most cited paper from Compass Technology (China) is "Genome-wide detection of CNVs in Chinese indigenous sheep with different types of tails using ovine high-density 600K SNP arrays" (Caiye Zhu, Hongying Fan, Zehu Yuan et al., 2016), with 85 citations. Next come "Genome‐wide association studies revealed candidate genes for tail fat deposition and body size in the Hulun Buir sheep" (69) and "Identification of novel risk loci with shared effects on alcoholism, heroin, and methamphetamine dependence" (43).

Published TypeFieldAccess

Showing 48 of 48 papers. Every paper is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	Genome-wide detection of CNVs in Chinese indigenous sheep with different types of tails using ovine high-density 600K SNP arrays Caiye Zhu, Hongying Fan, Zehu Yuan et al. · Scientific Reports Open access	10 Jun 2016	85
2	Genome‐wide association studies revealed candidate genes for tail fat deposition and body size in the Hulun Buir sheep Tongyu Zhang, Hongding Gao, Goutam Sahana et al. · Journal of Animal Breeding and Genetics	2 May 2019	69
3	Identification of novel risk loci with shared effects on alcoholism, heroin, and methamphetamine dependence Yan Sun, Suhua Chang, Zhen Liu et al. · Molecular Psychiatry	28 Aug 2019	43
4	SoySNP618K array: A high‐resolution single nucleotide polymorphism platform as a valuable genomic resource for soybean genetics and breeding Yanfei Li, Yinghui Li, Shan‐Shan Su et al. · Journal of Integrative Plant Biology Open access	16 Dec 2021	37
5	Dissection of the practical soybean breeding pipeline by developing ZDX1, a high-throughput functional array Rujian Sun et al. · Theoretical and Applied Genetics Open access	20 Feb 2022	27
6	Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection Kelvin P. L. Pun, Mobinul Islam, Jason Rotanson et al. · Journal of Electronic Materials	31 May 2018	15
7	Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging Kelvin P. L. Pun, Mobinul Islam, Chee Cheung et al. · Journal of Materials Science Materials in Electronics	17 May 2017	9
8	Effect of Ni Layer Thickness on Intermetallic Formation and Mechanical Strength of Sn-Ag-Cu Solder Joint Kelvin Pun, Poh Leng Eu, Mobinul Islam et al. Conference paper	Dec 2008	9
9	User Defined Functions Tony Bain, LOUIS R. DAVIDSON, Robin Dewson et al. · Apress eBooks Book chapter	2003	9
10	Application of fuzzy integrated FMEA with product lifetime consideration for new product development in flexible electronics industry Kelvin P. L. Pun, Jason Rotanson, Cheung Chee-Wah et al. · Journal of Industrial Engineering and Management Open access	15 Mar 2019	8
11	Compact Airborne Image Mapping System (CAIMS) Tim McCarthy, Gearoid O'Rian, A. Stewart Fotheringham · Maynooth University ePrints and eTheses Archive (Maynooth University) Book chapterOpen access	2007	7
12	Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds Kelvin P. L. Pun, Navdeep S. Dhaka, Chee-wah Cheung et al. · Microelectronics Reliability	29 Sep 2017	7
13	Foldable substrates for wearable electronics Kelvin Pun, Mobinul Islam, Tin Wing Ng Conference paper	May 2014	6
14	Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization Kelvin P. L. Pun, Lafir Ali, Makoto Kohtoku et al. · Journal of Materials Science Materials in Electronics	31 Jan 2018	5
15	ENEG and ENEPIG surface finish for long term solderability Kelvin Pun, Mobinul Islam, Tin Wing Ng Conference paper	May 2014	5
16	Identification and Expression Analysis of Rice MYB Family Members in Response to Heat Stress He Zhao, Yaliang Ji, Yaohuang Jiang et al. · Plants Open access	11 Jun 2025	4
17	MEMS gyro sensor using flexible substrate for package size reduction Kelvin Pun, Chun Ning Chan, Siu Lung Ng et al. Conference paper	Aug 2015	4
18	Underfill Selection Against Moisture in Flip Chip BGA Packages Xuejun Fan, Tong Yan Tee, Chengqiang Cui et al. Book chapter	2010	4
19	Dual-Polarized Dipole Array with Controlled Beam Tilt and Wide Radiation Pattern for Multi-Beam Antenna of Base Stations Vyacheslav Rudakov, Zimeng Li, Viktor A. Sledkov et al. · 2021 Radiation and Scattering of Electromagnetic Waves (RSEMW) Conference paper	28 Jun 2021	3
20	Development of two-metal layer flexible substrate for high density IC packaging Chengqiang Cui, Benson Chan, Andy So et al. Conference paper	11 Nov 2002	3
21	Enhancement of TBGA substrate in packing drop test Kelvin Pun, Chengqiang Cui Conference paper	Aug 2009	3
22	Bias-HAST on tape ball grid array (TBGA) test pattern N.H. Yeung, Victor P. Lau, Yan Cheong Chan · Microelectronics Reliability	10 Dec 2003	3
23	TBGA substrate for lead-free and halogen-free applications Chengqiang Cui, Kong‐Pang Pun Conference paper	6 May 2004	3
24	An Approach for Measuring Spatial Accessibility to Services/Facilities by Urban Community Aged Population Ju Bai, Chen Chen, Yu Gao et al. · The international archives of the photogrammetry, remote sensing and spatial information sciences/International archives of the photogrammetry, remote sensing and spatial information sciences Open access	21 Oct 2024	2
25	Wideband Design of Dual-Polarized Planar Dipole for Base Station Antenna Application K. V. Kobrin, Zimeng Li, Viktor A. Sledkov et al. Conference paper	23 Nov 2022	2
26	COASTAL CHANGE DETECTION ALONG THE FIRE ISLAND, US UNDER THE IMPACT OF HURRICANE SANDY BASED ON LIDAR DATA Yujie Zhou, Shuai Tian, Hao Wang et al. · ISPRS annals of the photogrammetry, remote sensing and spatial information sciences Open access	17 May 2022	2
27	Cu Fully Filled Ultra-Fine Blind Via on Flexible Substrate for High Density Interconnect Chengqiang Cui, Kelvin Pun · IEEE/CPMT International Electronics Manufacturing Technology Symposium Conference paper	Nov 2006	2
28	Miniaturization of system in package for wearable devices using copper pillar solder flip chip interconnects Kelvin Pun, Amandeep Singh, Mobinul Islam Conference paper	Mar 2016	2
29	Ultra-fine via pitch on flexible substrate for high density interconnect (HDI) Kelvin Pun, Chengqiang Cui, Ting‐Fung Chung Conference paper	Jul 2008	2
30	Wide band dual-polarized antenna array of planar dipoles for base stations of mobile communication K. V. Kobrin, Zhanzhi Li, Viktor A. Sledkov et al. · Journal of Radio Electronics Open access	2024	1
31	Compact Over-Octave Horn Antenna with Stable Radiation Pattern Vyacheslav Rudakov, Viktor A. Sledkov, Mikhail B. Manuilov Conference paper	23 Nov 2022	1
32	Synthesis of a Wideband Diplexer Based on Interdigital Resonators for the Antennas Of Mobile-Communication Base Stations K. V. Kobrin, Vyacheslav Rudakov, Viktor A. Sledkov et al. · Radiophysics and Quantum Electronics	Dec 2021	1
33	Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables Kelvin P. L. Pun, Jason Rotanson, Yuen Yung Chan et al. · 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Conference paper	7 Dec 2021	1
34	Comparison between ENA and ENEPIG surface finish for high density TBGA package Kelvin Pun, Mobinul Islam, Tin Wing Ng Conference paper	Sep 2014	1
35	High reliability underfill encapsulated fine pitch system on flex packages Kelvin Pun, Anupam Sharma, Amandeep Singh et al. Conference paper	Aug 2013	1
36	Study of fine pitch copper pillar solder joint on HDI flexible substrate for wearable devices Kelvin Pun, Amandeep Singh, Mobinul Islam et al. Conference paper	Aug 2015	1
37	Wideband Dual Polarized All-Metal Dipole Array for Base Stations of Mobile Communications K. V. Kobrin, Zimeng Li, Viktor A. Sledkov et al. Conference paper	26 Jun 2023	0
38	Demonstration of Ni-free Surface Finishing with IGEPIG for Solid-State Diffusion Bonding on Ultra-fine Pitch Chip-on-Film (COF) Kelvin P. L. Pun, Jason Rotanson, Navdeep S. Dhaka et al. Conference paper	Dec 2018	0
39	A German Court holds lawful ban of sales through online auction platforms by retailer (School bags manufacturer) Dennis Beling · e-Competitions Bulletin	13 Mar 2008	0
40	The German Federal Cartel Office clears merger between book suppliers despite high market shares in a local market (Karlsruher Buchmarkt) Dennis Beling · e-Competitions Bulletin	30 Apr 2008	0
41	The Effect of Ni Thickness on Mechanical Strength of Pb-free BGA Spheres on Selectively Plated Ni/Au Finish Eu Poh Leng, Min Ju Ding, Joah Rayos et al. · IEEE/CPMT International Electronics Manufacturing Technology Symposium Conference paper	Oct 2007	0
42	Coal Saving Effect of Special Nanostructured Combustion Catalyzer Using in Pulverized Coal Boiler of Coal-fired Power Plant Shuzhi Zhao	2006	0
43	Development of void free, high reliability underfill encapsulated fine pitch system on flex packages Kelvin Pun, Anupam Sharma, Amandeep Singh et al. Conference paper	Sep 2014	0
44	System Stored Procedures Tony Bain, LOUIS R. DAVIDSON, Robin Dewson et al. · Apress eBooks Book chapter	2003	0
45	Stored Procedures Overview Tony Bain, LOUIS R. DAVIDSON, Robin Dewson et al. · Apress eBooks Book chapter	2003	0
46	Concurrency, Cursors, and Transactions Tony Bain, LOUIS R. DAVIDSON, Robin Dewson et al. · Apress eBooks Book chapter	2003	0
47	Common Practices with Stored Procedures Tony Bain, LOUIS R. DAVIDSON, Robin Dewson et al. · Apress eBooks Book chapter	2003	0
48	Optimizing and Debugging Tony Bain, LOUIS R. DAVIDSON, Robin Dewson et al. · Apress eBooks Book chapter	2003	0

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.