Institution · Dynex Semiconductor (United Kingdom)
Most cited papers from Dynex Semiconductor (United Kingdom)
What are the most cited papers from Dynex Semiconductor (United Kingdom)?
The most cited paper from Dynex Semiconductor (United Kingdom) is "An Improved Delay-Suppressed Sliding-Mode Observer for Sensorless Vector-Controlled PMSM" (Chao Gong, Yihua Hu, Jinqiu Gao et al., 2019), with 396 citations. Next come "Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics" (167) and "Mechanical properties of graphene oxide reinforced aluminium matrix composites" (150).
Showing 50 of 60 papers. Every paper with more than 21 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | An Improved Delay-Suppressed Sliding-Mode Observer for Sensorless Vector-Controlled PMSM Chao Gong, Yihua Hu, Jinqiu Gao et al. · IEEE Transactions on Industrial Electronics | 15 Nov 2019 | 396 |
| 2 | Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics Mahera Musallam, Chunyan Yin, C. Bailey et al. · IEEE Transactions on Power Electronics | 17 Sep 2014 | 167 |
| 3 | Mechanical properties of graphene oxide reinforced aluminium matrix composites Bhagya Lakshmi Dasari, Muhammad Monzur Morshed, Jamshid Malekmohammadi Nouri et al. · Composites Part B Engineering | 18 Mar 2018 | 150 |
| 4 | Partial discharge control in a power electronic module using high permittivity non-linear dielectrics Ningyan Wang, Ian Cotton, J.A.L. Robertson et al. · IEEE Transactions on Dielectrics and Electrical Insulation | Aug 2010 | 140 |
| 5 | Electrical and Electronic Technologies in More-Electric Aircraft: A Review Kai Ni, Yongjiang Liu, Zhanbo Mei et al. · IEEE Access | 2019 | 124 |
| 6 | An Organic Down‐Converting Material for White‐Light Emission from Hybrid LEDs Neil J. Findlay, Jochen Bruckbauer, Anto R. Inigo et al. · Advanced Materials | 16 Sep 2014 | 123 |
| 7 | Practical classification of different moving targets using automotive radar and deep neural networks Aleksandar Angelov, Andrew Robertson, Roderick Murray‐Smith et al. · IET Radar Sonar & Navigation | 9 Apr 2018 | 118 |
| 8 | Multiobjective Finite Control Set Model Predictive Control Using Novel Delay Compensation Technique for PMSM Yaofei Han, Chao Gong, Liming Yan et al. · IEEE Transactions on Power Electronics | 10 Mar 2020 | 109 |
| 9 | Influence of Paralleling Dies and Paralleling Half-Bridges on Transient Current Distribution in Multichip Power Modules Helong Li, Wei Jia Zhou, Xiongfei Wang et al. · IEEE Transactions on Power Electronics | 24 Jan 2018 | 106 |
| 10 | Review of series and parallel connection of IGBTs N.Y.A. Shammas, Ruchira Withanage, Dinesh Chamund · IEE Proceedings - Circuits Devices and Systems | 2006 | 100 |
| 11 | A Single- and Three-Phase Grid Compatible Converter for Electric Vehicle On-Board Chargers Hui Lin Zhao, Yanfeng Shen, Wucheng Ying et al. · IEEE Transactions on Power Electronics | 28 Nov 2019 | 82 |
| 12 | Power Semiconductor Devices RJ Bassett, P.D. Taylor · Elsevier eBooks | 2003 | 79 |
| 13 | SiC Trench MOSFET With Shielded Fin-Shaped Gate to Reduce Oxide Field and Switching Loss Huaping Jiang, Jin Wei, Xiaoping Dai et al. · IEEE Electron Device Letters | 17 Aug 2016 | 77 |
| 14 | Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for IGBT power module Yiyi Chen, Bo Li, Xin Wang et al. · Thermal Science and Engineering Progress | 8 Jan 2019 | 75 |
| 15 | SiC MOSFET with built-in SBD for reduction of reverse recovery charge and switching loss in 10-kV applications Huaping Jiang, Jin Wei, Xiaoping Dai et al. | May 2017 | 67 |
| 16 | Thermal Management of Electrified Propulsion System for Low-Carbon Vehicles Bo Li, Kuo Huang, Xuehui Wang et al. · Automotive Innovation | Dec 2020 | 66 |
| 17 | Direct Phase-Change Cooling of Vapor Chamber Integrated With IGBT Power Electronic Module for Automotive Application Yiyi Chen, Bo Li, Xuehui Wang et al. · IEEE Transactions on Power Electronics | 15 Oct 2020 | 65 |
| 18 | Switching current imbalance mitigation in power modules with parallel connected SiC MOSFETs Szymon Bęczkowski, Asger Bjørn Jørgensen, Helong Li et al. | Sep 2017 | 63 |
| 19 | Numerical Parameterization of Chemical-Vapor-Deposited (CVD) Single-Crystal Diamond for Device Simulation and Analysis S.J. Rashid, Antonella Tajani, Daniel J. Twitchen et al. · IEEE Transactions on Electron Devices | 26 Sep 2008 | 61 |
| 20 | Effects of Auxiliary-Source Connections in Multichip Power Module Helong Li, Stig Munk‐Nielsen, Xiongfei Wang et al. · IEEE Transactions on Power Electronics | 13 Dec 2016 | 59 |
| 21 | Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles Y. Wang, Steve Jones, Andy Dai et al. · Microelectronics Reliability | 10 Aug 2014 | 59 |
| 22 | Silicon carbide split-gate MOSFET with merged Schottky barrier diode and reduced switching loss Huaping Jiang, Jin Wei, Xiaoping Dai et al. | Jun 2016 | 56 |
| 23 | Electrical Performance and Reliability Characterization of a SiC MOSFET Power Module With Embedded Decoupling Capacitors Li Yang, Ke Li, Jingru Dai et al. · IEEE Transactions on Power Electronics | 16 Mar 2018 | 54 |
| 24 | Lifetime Prediction for Power Electronics Module Substrate Mount-down Solder Interconnect Hua Lu, Timothy Tilford, C. Bailey et al. | Jun 2007 | 52 |
| 25 | New Resonant Gate Driver Circuit for High-Frequency Application of Silicon Carbide MOSFETs Jaya Venkata Phani Sekhar Chennu, Ramkrishan Maheshwari, Helong Li · IEEE Transactions on Industrial Electronics | 2 Mar 2017 | 51 |
| 26 | Development of high power SiC devices for rail traction power systems Guoyou Liu, Yibo Wu, Kongjing Li et al. · Journal of Crystal Growth | 23 Oct 2018 | 50 |
| 27 | The integration of simulation and response surface methodology for the optimization of IC processes G.J. Gaston, A.J. Walton · IEEE Transactions on Semiconductor Manufacturing | 1994 | 47 |
| 28 | Recent advances and trend of HEV/EV‐oriented power semiconductors – an overview Guoyou Liu, Kongjing Li, Yangang Wang et al. · IET Power Electronics | 29 Jul 2019 | 45 |
| 29 | An Analysis of the Thermal Interaction Between Components in Power Converter Applications Mohammad Shahjalal, Md Rishad Ahmed, Hua Lu et al. · IEEE Transactions on Power Electronics | 2 Feb 2020 | 44 |
| 30 | The Kinetics of Epitaxial Silicon Deposition by the Hydrogen Reduction of Chlorosilanes† Simon Bradshaw · International Journal of Electronics | Sep 1966 | 42 |
| 31 | The Current Sharing Optimization of Paralleled IGBTs in a Power Module Tile Using a PSpice Frequency Dependent Impedance Model R. Azar, Radu Mihail Udrea, Wai Tung Ng et al. · IEEE Transactions on Power Electronics | 2008 | 39 |
| 32 | In Situ Diagnosis of Multichip IGBT Module Wire Bonding Faults Based on Collector Voltage Undershoot Wuyu Zhang, Kun Tan, Bing Ji et al. · IEEE Transactions on Industrial Electronics | 11 May 2022 | 37 |
| 33 | Nanocathodoluminescence Reveals Mitigation of the Stark Shift in InGaN Quantum Wells by Si Doping James T. Griffiths, Siyuan Zhang, Bertrand Rouet‐Leduc et al. · Nano Letters | 21 Oct 2015 | 37 |
| 34 | Cubic GaN and InGaN/GaN quantum wells David J. Binks, P. Dawson, Rachel A. Oliver et al. · Applied Physics Reviews | 15 Nov 2022 | 36 |
| 35 | A Novel Distributed Linear-Spatial-Array Sensing System Based on Multichannel LPWAN for Large-Scale Blast Wave Monitoring Shang Gao, Gui Yun Tian, Xuewu Dai et al. · IEEE Internet of Things Journal | 19 Sep 2019 | 36 |
| 36 | Improved Duty-Ratio-Based Direct Torque Control for Dual Three-Phase Permanent Magnet Synchronous Machine Drives Yuan Ren, Z. Q. Zhu, James E. Green et al. · IEEE Transactions on Industry Applications | 30 Aug 2019 | 36 |
| 37 | Modelling of single-crystal diamond Schottky diodes for high-voltage applications S.J. Rashid, Antonella Tajani, Lee Coulbeck et al. · Diamond and Related Materials | 9 Aug 2005 | 36 |
| 38 | Cool to warm white light emission from hybrid inorganic/organic light-emitting diodes Elaine Taylor-Shaw, Enrico Angioni, Neil J. Findlay et al. · Journal of Materials Chemistry C | 2016 | 34 |
| 39 | Advanced SPICE Modeling of Large Power IGBT Modules R. Azar, Florin Udrea, M. DeSilva et al. · IEEE Transactions on Industry Applications | May 2004 | 34 |
| 40 | Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles Xiaoping Dai, Yangang Wang, Yibo Wu et al. · Microelectronics Reliability | Sep 2016 | 32 |
| 41 | Cascaded multilevel inverter based power and signal multiplex transmission for electric vehicles Yixuan Zhang, Guipeng Chen, Yihua Hu et al. · CES Transactions on Electrical Machines and Systems | Jun 2020 | 31 |
| 42 | A Three-Switch-Based Single-Input Dual-Output Converter With Simultaneous Boost & Buck Voltage Conversion Sen Nan Song, Guipeng Chen, Yuwei Liu et al. · IEEE Transactions on Industrial Informatics | Oct 2019 | 29 |
| 43 | GaAs planar doped barrier diodes for millimetre-wave detector applications M.J. Kearney, Angus Condie, Ian Dale · Electronics Letters | 25 Apr 1991 | 29 |
| 44 | The improvement of Mo/4H-SiC Schottky diodes via a P2O5 surface passivation treatment Arne Benjamin Renz, Vishal Ajit Shah, Oliver James Vavasour et al. · Journal of Applied Physics | 10 Jan 2020 | 28 |
| 45 | High-Voltage Hybrid IGBT Power Modules for Miniaturization of Rolling Stock Traction Inverters Xiang Li, Daohui Li, Guiqin Chang et al. · IEEE Transactions on Industrial Electronics | Mar 2021 | 27 |
| 46 | Silver sintering die attach process for IGBT power module production Yimin Zhao, Paul Mumby-Croft, Steve Jones et al. | Mar 2017 | 27 |
| 47 | Power Cycling Testing for Power Semiconductor Switches: Methods, Standards, Limitations, and Outlooks Yi Zhang, Patrick Heimler, James Opondo Abuogo et al. · IEEE Transactions on Power Electronics | 4 Aug 2025 | 26 |
| 48 | Characterization of a bi-directional double-side double-gate IGBT fabricated by wafer bonding Karl D. Hobart, Fritz J. Kub, Mario G. Ancona et al. | 13 Nov 2002 | 26 |
| 49 | Silicon MCM-D technology for RF integration R.G. Arnold, Colm C. Faulkner, D.J. Pedder | 22 Nov 2002 | 26 |
| 50 | Comparison of Trench Gate IGBT and CIGBT Devices for Increasing the Power Density From High Power Modules N. Luther-King, E.M. Sankara Narayanan, Lee Coulbeck et al. · IEEE Transactions on Power Electronics | 21 Aug 2009 | 25 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.