Most cited papers from EV Group (Austria)

EV Group (Austria)

What are the most cited papers from EV Group (Austria)?

The most cited paper from EV Group (Austria) is "III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration" (Romain Cariou, Jan Benick, Frank Feldmann et al., 2018), with 336 citations. Next come "Mechanisms for room temperature direct wafer bonding" (197) and "Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g" (116).

Published TypeFieldAccessCitations

Showing 50 of 60 papers. Every paper with more than 16 citations is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	III–V-on-silicon solar cells reaching 33% photoconversion efficiency in two-terminal configuration Romain Cariou, Jan Benick, Frank Feldmann et al. · Nature Energy Open access	29 Mar 2018	336
2	Mechanisms for room temperature direct wafer bonding Thomas Plach, Kurt Hingerl, Sajjad Tollabimazraehno et al. · Journal of Applied Physics	7 Mar 2013	197
3	Monolithic Two-Terminal III–V//Si Triple-Junction Solar Cells With 30.2% Efficiency Under 1-Sun AM1.5g Romain Cariou, Jan Benick, Paul Beutel et al. · IEEE Journal of Photovoltaics Open access	9 Dec 2016	116
4	High resolution lithography with PDMS molds Markus Bender, Ulrich Plachetka, Jianhua Ran et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena	Nov 2004	99
5	Reliable 300 mm Wafer Level Hybrid Bonding for 3D Stacked CMOS Image Sensors S. Lhostis et al. Conference paper	May 2016	95
6	Development of a novel, low-viscosity UV-curable polymer system for UV-nanoimprint lithography Marko Vogler, Sabine Wiedenberg, Michael M. Mühlberger et al. · Microelectronic Engineering	27 Feb 2007	85
7	Physical mechanisms of copper-copper wafer bonding Bernhard Rebhan, Kurt Hingerl · Journal of Applied Physics	Oct 2015	83
8	Integration of a temporary carrier in a TSV process flow Jean Charbonnier, Severine Cheramy, David D. Henry et al. Conference paper	May 2009	60
9	Simultaneous Cu-Cu and Compliant Dielectric Bonding for 3D Stacking of ICs Anne Jourdain, Serguei Stoukatch, Piet De Moor et al. Conference paper	2007	59
10	Annealing temperature effect on the Cu-Cu bonding energy for 3D-IC integration Eun‐Jung Jang, Jaewon Kim, Bioh Kim et al. · Metals and Materials International	Feb 2011	54
11	High-Performance Temporary Adhesives for Wafer Bonding Applications Rama Puligadda, Sunil K. Pillalamarri, Wenbin Hong et al. · MRS Proceedings	2006	52
12	Adhesive wafer bonding for MEMS applications Viorel Drăgoi, Thomas Glinsner, Gerald Mittendorfer et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Conference paper	25 Apr 2003	50
13	Advances in SiCN-SiCN Bonding with High Accuracy Wafer-to-Wafer (W2W) Stacking Technology Lan Peng, S-W Kim, Serena Iacovo et al. Conference paper	Jun 2018	47
14	Temporary Bonding and DeBonding Enabling TSV Formation and 3D Integration for Ultra-thin Wafers Stefan Pargfrieder, Paul Kettner, Mark Privett et al. Conference paper	Dec 2008	45
15	Micro-transfer-printed narrow-linewidth III-V-on-Si double laser structure with a combined 110 nm tuning range Emadreza Soltanian, Grigorij Muliuk, Sarah Uvin et al. · Optics Express Open access	28 Sep 2022	43
16	A Moiré method for high accuracy alignment in nanoimprint lithography Michael M. Mühlberger, Iris Bergmair, Wolfgang Schwinger et al. · Microelectronic Engineering	3 Feb 2007	43
17	UV Nanoimprint Lithography: Geometrical Impact on Filling Properties of Nanoscale Patterns Christine Thanner, Martin Eibelhuber · Nanomaterials Open access	23 Mar 2021	41
18	Facilitating Ultrathin Wafer Handling for TSV Processing A. Jouve, Shelly Fowler, Mark Privett et al. Conference paper	Dec 2008	41
19	Wafer-level plasma activated bonding: new technology for MEMS fabrication Viorel Drăgoi, Gerald Mittendorfer, Christine Thanner et al. · Microsystem Technologies	19 Oct 2007	41
20	Nanoimprint lithography with a commercial 4-in. bond system for hot embossing Nils Roos, Thomas Luxbacher, Thomas Glinsner et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Conference paper	20 Aug 2001	39
21	Uniformity study of wafer-scale InP-to-silicon hybrid integration Di Liang, David C. Chapman, Youli Li et al. · Applied Physics A Open access	20 Aug 2010	38
22	Influence of 2.09-μm pulse duration on through-silicon laser ablation of thin metal coatings Ignas Astrauskas, Boris Považay, Andrius Baltuška et al. · Optics & Laser Technology Open access	28 Aug 2020	34
23	Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach Thomas Wlanis, René Hammer, Werner Ecker et al. · Microelectronics Reliability	15 May 2018	34
24	CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration Viorel Drăgoi, Eric F. Pabo, Jürgen Burggraf et al. · Microsystem Technologies	6 Feb 2012	33
25	Development of nanoimprint processes for photovoltaic applications Hubert Hauser, Nico Tucher, Katharina Tokai et al. · Journal of Micro/Nanolithography MEMS and MOEMS Open access	29 Jul 2015	32
26	0.5 ¼m Pitch Wafer-to-wafer Hybrid Bonding with SiCN Bonding Interface for Advanced Memory Kai Ma, Nikolaos Bekiaris, Sesh Ramaswami et al. Conference paper	May 2023	31
27	Cyclo-Olefin polymer direct bonding using low temperature plasma activation bonding J.R. Mizuno, Hiroyasu Ishida, Shari N. Farrens et al. Conference paper	24 Aug 2005	29
28	Pre-storage of gelified reagents in a lab-on-a-foil system for rapid nucleic acid analysis Yi Sun, Jonas Høgberg, Christine Thanner et al. · Lab on a Chip Open access	2013	28
29	A Study of SiCN Wafer-to-Wafer Bonding and Impact of Wafer Warpage Serena Iacovo, Koen D’havé, Oguzhan Orkut Okudur et al. Conference paper	May 2023	27
30	Characterization of bonding activation sequences to enable ultra-low Cu/SiCN wafer level hybrid bonding Serena Iacovo, Lan Peng, Fuya Nagano et al. Conference paper	Jun 2021	27
31	A simple fabrication process for disposable interdigitated electrode arrays with nanogaps for lab-on-a-chip applications Stefan Partel, Stephan Kasemann, Volha A. Matylitskaya et al. · Microelectronic Engineering	31 Mar 2017	27
32	Spray coating of PMMA for pattern transfer via electron beam lithography on surfaces with high topography J.L. Linden, Ch. Thanner, Benjamin Schaaf et al. · Microelectronic Engineering	5 Jan 2011	27
33	Metal Thermocompression Wafer Bonding for 3D Integration and MEMS Applications Viorel Drăgoi, Gerald Mittendorfer, Jürgen Burggraf et al. · ECS Transactions Conference paperOpen access	Oct 2010	26
34	Aggressive Pitch Scaling (sub-0.5 μm) of W2W Hybrid Bonding Through Process Innovations Tyler Sherwood, R. Patlolla, Joe Salfelder et al. Conference paper	May 2023	25
35	Heterogeneous Integration by Collective Die-To-Wafer Bonding Thomas Uhrmann, Jürgen Burggraf, Martin Eibelhuber Conference paper	Oct 2018	25
36	New Results on Plasma Activated Bonding of Imprinted Polymer Features for Bio MEMS Applications Paul Kettner, R. Pelzer, Thomas Glinsner et al. · Journal of Physics Conference Series Conference paperOpen access	Apr 2006	25
37	Fabrication of 3D-photonic crystals via UV-nanoimprint lithography Thomas Glinsner, Paul F. Lindner, Michael M. Mühlberger et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena	Nov 2007	25
38	Achieving low-temperature wafer level bonding with Cu-Sn-In ternary at 150 °C Obert Golim, Vesa Vuorinen, Glenn Ross et al. · Scripta Materialia Open access	Sep 2022	23
39	Making a good impression Gerald Kreindl, Thomas Glinsner, R. A. Miller · Nature Photonics	24 Dec 2009	23
40	Real-time isothermal RNA amplification of toxic marine microalgae using preserved reagents on an integrated microfluidic platform Maria‐Nefeli Tsaloglou, Florian Laouenan, Christos-Moritz Loukas et al. · The Analyst Open access	5 Nov 2012	22
41	Comparison of multilayer stamp concepts in UV–NIL Ulrich Plachetka, Markus Bender, Andreas Fuchs et al. · Microelectronic Engineering	4 Feb 2006	21
42	Integration of Edge-Emitting Quantum Dot Lasers with Different Waveguide Platforms using Micro-Transfer Printing Ali Uzun, Fatih Bilge Atar, Simone Iadanza et al. · IEEE Journal of Selected Topics in Quantum Electronics Open access	2023	20
43	3D interconnect through aligned wafer level bonding Paul F. Lindner, Viorel Drăgoi, Thomas Glinsner et al. Conference paper	25 Jun 2003	20
44	Investigation of Distortion in Wafer-to-wafer Bonding with Highly Bowed Wafers Shuo Kang, Serena Iacovo, Koen D’havé et al. Conference paper	28 May 2024	19
45	Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes Viorel Drăgoi, Paul F. Lindner · ECS Transactions Conference paper	20 Oct 2006	19
46	200 nm Wafer-to-wafer overlay accuracy in wafer level Cu/SiO2 hybrid bonding for BSI CIS Bernhard Rebhan, M. Bernauer, Thomas Wagenleitner et al. Conference paper	Dec 2015	19
47	3D Die-to-wafer Cu/Sn Microconnects Formed Simultaneously with an Adhesive Dielectric Bond Using Thermal Compression Bonding Scott Pozder, Ankur Jain, Ritwik Chatterjee et al. Conference paper	Jun 2008	19
48	Influence of the acetic acid concentration on the growth of zinc oxide thin films prepared by spray pyrolysis of aqueous solutions Stefan Edinger, Justyna Bekacz, Moses Richter et al. · Thin Solid Films	18 Apr 2015	19
49	Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation Bernhard Rebhan, Sajjad Tollabimazraehno, Günter Hesser et al. · Microsystem Technologies	10 Feb 2015	19
50	Micro-transfer printing InP C-band SOAs on advanced silicon photonics platform for lossless MZI switch fabrics and high-speed integrated transmitters Jing Zhang, Laurens Bogaert, Clemens J. Krückel et al. · Optics Express Open access	26 Oct 2023	18

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.