Institution · FormFactor (United States)

Most cited papers from FormFactor (United States)

FormFactor (United States)

What are the most cited papers from FormFactor (United States)?

The most cited paper from FormFactor (United States) is "Recent developments in high-moment electroplated materials for recording heads" (Emanuel I. Cooper, C. Bonhôte, Juergen Heidmann et al., 2005), with 151 citations. Next come "Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies" (113) and "Wide Range Control of Microstructure and Mechanical Properties of Carbon Nanotube Forests: A Comparison Between Fixed and Floating Catalyst CVD Techniques" (66).

Published TypeFieldAccess

Showing 43 of 43 papers. Every paper is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	Recent developments in high-moment electroplated materials for recording heads Emanuel I. Cooper, C. Bonhôte, Juergen Heidmann et al. · IBM Journal of Research and Development	2005	151
2	Low-Loss 3-D Multilayer Transmission Lines and Interconnects Fabricated by Additive Manufacturing Technologies Fan Cai, Yung-Hang Chang, Kan Wang et al. · IEEE Transactions on Microwave Theory and Techniques	5 Sep 2016	113
3	Wide Range Control of Microstructure and Mechanical Properties of Carbon Nanotube Forests: A Comparison Between Fixed and Floating Catalyst CVD Techniques Onnik Yaglioglu, Anyuan Cao, Anastasios John Hart et al. · Advanced Functional Materials Open access	26 Jul 2012	66
4	Fabrication and Characterization of Graphitic Carbon Nanostructures with Controllable Size, Shape, and Position Rongbing Du, Solomon Ssenyange, Mirwais Aktary et al. · Small	20 Feb 2009	46
5	Reconfigurable Low-Voltage Hexagonal Boron Nitride Nonvolatile Switches for Millimeter-Wave Wireless Communications Sung Jin Yang, Mor Mordechai Dahan, Or Levit et al. · Nano Letters	20 Jan 2023	39
6	RF-MEMS Capacitive Switches Fabricated Using Printed Circuit Processing Techniques Ramesh R. Ramadoss, Simone Lee, Y.C. Lee et al. · Journal of Microelectromechanical Systems	Dec 2006	29
7	Contact Resistance in Flat Thin Films Melissa B. Read, J.H. Lang, Alexander Henry Slocum et al. Conference paper	Sep 2009	27
8	Direct connection and testing of TSV and microbump devices using NanoPierce™ contactor for 3D-IC integration Onnik Yaglioglu, Ben Eldridge Conference paper	Apr 2012	26
9	Direct patterning of vertically aligned carbon nanotube arrays to 20μm pitch using focused laser beam micromachining John W. Elmer, Onnik Yaglioglu, Ronald D. Schaeffer et al. · Carbon	26 Apr 2012	25
10	On-Chip Cryopreservation of Living Cells Sha Li, Wei Liu, Liwei Lin · JALA Journal of the Association for Laboratory Automation Open access	11 Mar 2010	14
11	An investigation of the contact resistance of a commercial elastomer interconnect under thermal and mechanical stresses Weifeng Liu, Mikyoung Lee, MICHAEL G. PECHT et al. · IEEE Transactions on Device and Materials Reliability	Jun 2003	14
12	FormFactor introduces an integrated process for wafer-level packaging, burn-in test, and module level assembly J. Novitsky, David R. Pedersen Conference paper	20 Jan 2003	13
13	A new probe card technology using compliant Microsprings/sup TM/ N. Sporck Conference paper	23 Nov 2002	13
14	Design of iterative learning controller based on frequency domain linear matrix inequality Kiyonori Inaba, Chun‐Chih Wang, Masayoshi Tomizuka et al. Conference paper	2009	12
15	A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards Erik Jan Marinissen, Ferenc Fodor, Bart De Wachter et al. Conference paper	Sep 2017	11
16	Predicting performance measures for Markovian type of manufacturing systems with product failures Salil Pradhan, Purushothaman Damodaran, Krishnaswami Srihari · European Journal of Operational Research	11 Jan 2007	10
17	MEMS capacitive series switch fabricated using PCB technology Ramesh R. Ramadoss, Simone Lee, Y. C. Lee et al. · International Journal of RF and Microwave Computer-Aided Engineering	28 Jun 2007	9
18	Fully Automated Wafer-Level Edge Coupling Measurement System for Silicon Photonics Integrated Circuits Quan Yuan, Anna Pęczek, Joe Frankel et al. · IEEE Transactions on Semiconductor Manufacturing Open access	19 Mar 2025	7
19	Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications Kristof Croes, Veerle Simons, Sofie Beyne et al. Conference paper	Mar 2019	7
20	Sleep-Mask-Type Pulse Wave and Respiration Rate Sensor Using a MEMS-Based Differential Pressure Sensing Element Taisei Kato, Thanh‐Vinh Nguyen, Hidetoshi Takahashi · IEEE Sensors Journal	27 May 2024	6
21	Contact Resistance in Flat-on-Flat and Sphere-on-Flat Thin Films Melissa B. Read, J.H. Lang, Alex Slocum et al. Conference paper	Oct 2010	6
22	Design of Piezoresistive Cantilevers for Low Force Electrical Contact Measurements Beth L. Pruitt, Aaron Partridge, Michael S. Bartsch et al. · Micro-Electro-Mechanical Systems (MEMS) Conference paper	5 Nov 2000	5
23	Low Force Electrical Contact Measurements Using Piezoresistive MEMS Cantilevers to Characterize Thin-Film Metallization Beth L. Pruitt, Daehan Choi, J.N. Florando et al. Book chapter	2001	5
24	Wearable, broadband auscultation patch with cantilever pressure transducer for remote healthcare monitoring Tran Bach Dang, Chi Cong Nguyen, Seung Yun Heo et al. · Nature Communications Open access	4 Jun 2026	3
25	High-Performance HBM Known-Good-Stack Testing Marc Loranger, Onnik Yaglioglu, John Oonk · IEEE Design and Test	2 Nov 2016	3
26	Contact testing of copper micro-pillars with very low damage for 3D IC assembly Onnik Yaglioglu, Ben Eldridge Conference paper	Oct 2013	3
27	Automatic 4 K Cryogenic Probe Station for DC and Microwave Measurements on 150-mm and 200-mm Wafers Joshua T. West, A. Kurlej, Alex Wynn et al. · 2022 IEEE/MTT-S International Microwave Symposium - IMS 2022 Conference paper	19 Jun 2022	2
28	PRESSURE ENHANCED AIR DAMPING IN ENCLOSED LATERALLY OSCILLATING MICROSTRUCTURES Kotaro Yasumura, Hal Jerman Conference paperOpen access	4 Jun 2006	2
29	Investigation of the effects of Pulsed Direct Current at low frequencies on the Electromigration Lifetime : Student Paper Jennifer M. Passage, Sophia Rogalskyj, Nabihah Azhari et al. Conference paper	Oct 2018	2
30	Wireless and contactless biomechanic well plate for monitoring cardiac organoid and 3D-tissue contraction Chi Cong Nguyen, Jordan Thorpe, Tran Bach Dang et al. · Nature Sensors Open access	26 Jun 2026	1
31	Cryogenic RF MEMS Switch With Electronic Calibration Capability Lafe Spietz, Chris Giovanniello, Brandon Takaki et al. · IEEE Journal of Microwaves Open access	2026	1
32	High Capacitive Ratio Molybdenum-based RF MEMS Capacitive Shunt Switch using Reduced Fabrication Steps Nihaika Narang, Piyush Kumar, Pranav Kumar Shrivastava et al. Conference paper	3 Mar 2024	1
33	D-band frequency memristor switch based on monolayer boron nitride Sung Jin Yang, Frank Makal, Paul Peterson et al. Conference paper	26 Jun 2022	1
34	Demonstrating the Potential of a Novel Model to Improve Open-Loop Control of Electrostatic Comb-Drive Actuators in Electrolytes Ohiremen L Dibua, Vikram Mukundan, Beth L. Pruitt et al. Conference paper	3 Nov 2017	1
35	Electroless silver plating and in-situ SEM characterization of CNT-metal hybrid contactors Onnik Yaglioglu, Treliant Fang, Rod Martens et al. Conference paper	Oct 2014	1
36	Fully Automated Wafer-Level Grating and Edge Coupling Measurement System for Silicon Photonics Integrated Circuits Quan Yuan, Joe Frankel, Divya Pratap Conference paper	2026	0
37	Multiplexed, Wireless, and Contactless Biomechanic Well Plate for Monitoring Cardiac Organoid and 3D-Tissue Contraction Hoang‐Phuong Phan, Chi Cong Nguyen, Jordan Thorpe et al. · Research Square PreprintOpen access	27 Apr 2026	0
38	Wearable, Broadband Auscultation Patch with Cantilever Pressure Transducer for Remote Healthcare Monitoring Hoang‐Phuong Phan, Tran Bach Dang, Chi Cong Nguyen et al. · Research Square PreprintOpen access	21 Apr 2026	0
39	AI-Driven Capacitor Optimization for Advanced Power Integrity Analysis in Semiconductor Circuit Designs Priya Boopalan, GopiChandran Annadurai Pandian · Advances in computational intelligence and robotics book series Book chapter	14 Apr 2026	0
40	Four-Port Probe Stations and SOLR Calibration Standard Design up to 125 GHz on 28 nm CMOS Dipankar Shakya, Theodore S. Rappaport, Ethan Shieh et al. Conference paper	2 Dec 2025	0
41	High-Precision Photonic Testing for Cryogenic Applications Using Advanced Micro Lens Technology and Probe Station System Quan Yuan, J. Phoenix Dai, Brandon Boiko et al. Conference paper	2025	0
42	Developing silicon photonics technologies with a wafer-level test station Jeroen De Coster, Erik Jan Marinissen, Joris Van Campenhout et al. · TU/e Research Portal Open access	5 Feb 2018	0
43	Automotive IC probing challenges –FFI MEMS Technology meets and exceeds expectation Ashish Bhardwaj, Amy Leong · IMAPSource Proceedings Conference paper	Oct 2017	0

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.