Institution · Henkel (United States)
Most cited papers from Henkel (United States)
What are the most cited papers from Henkel (United States)?
The most cited paper from Henkel (United States) is "Artificial Receptors for the Recognition of Phosphorylated Molecules" (Amanda E. Hargrove, Sonia Nieto, Tianzhi Zhang et al., 2011), with 647 citations. Next come "The fracture and fatigue behaviour of nano-modified epoxy polymers" (179) and "Informational Orthogonality of Two-Dimensional Chromatographic Separations" (175).
Showing 50 of 61 papers. Every paper with more than 10 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Artificial Receptors for the Recognition of Phosphorylated Molecules Amanda E. Hargrove, Sonia Nieto, Tianzhi Zhang et al. · Chemical Reviews | 12 Sep 2011 | 647 |
| 2 | The fracture and fatigue behaviour of nano-modified epoxy polymers Bamber R.K. Blackman, Anthony J. Kinloch, J. Sohn Lee et al. · Journal of Materials Science | 8 Jun 2007 | 179 |
| 3 | Informational Orthogonality of Two-Dimensional Chromatographic Separations Patrick J. Slonecker, Xiaodong Li, Thomas H. Ridgway et al. · Analytical Chemistry | 1996 | 175 |
| 4 | GUAR, LOCUST BEAN, TARA, AND FENUGREEK GUMS Helmut Maier, Mark Anderson, CURT KARL et al. · Elsevier eBooks | 1993 | 160 |
| 5 | Differentiation of Competitive vs. Non-competitive Mechanisms Mediating Disruption of Moth Sexual Communication by Point Sources of Sex Pheromone (Part I): Theory1 James R. Miller, Larry J. Gut, Frédérique M. De Lame et al. · Journal of Chemical Ecology | Oct 2006 | 150 |
| 6 | Hexafluorozirconic acid based surface pretreatments: Characterization and performance assessment Saikat Adhikari, Kinga A. Unocic, Ying Zhai et al. · Electrochimica Acta | 23 Jul 2010 | 141 |
| 7 | Moulded pulp fibers for disposable food packaging: A state-of-the-art review Katherine E. Semple, Chenli Zhou, Orlando José Rojas et al. · Food Packaging and Shelf Life | 14 Jul 2022 | 136 |
| 8 | Differentiation of Competitive vs. Non-competitive Mechanisms Mediating Disruption of Moth Sexual Communication by Point Sources of Sex Pheromone (Part 2): Case Studies James R. Miller, Larry J. Gut, Frédérique M. De Lame et al. · Journal of Chemical Ecology | Oct 2006 | 92 |
| 9 | Re-usable thermally reversible crosslinked adhesives from robust polyester and poly(ester urethane) Diels–Alder networks Laxmisha M. Sridhar, Murielle Oster, Donald Herr et al. · Green Chemistry | 2020 | 88 |
| 10 | Influence of metallurgy on the protective mechanism of chromium‐based conversion coatings on aluminum–copper alloys Patrick L. Hagans, Christina M. Haas · Surface and Interface Analysis | Feb 1994 | 81 |
| 11 | Advances in anaerobic and cyanoacrylate adhesives Philip T. Klemarczyk, J. D. Guthrie · Elsevier eBooks | 2010 | 80 |
| 12 | Rheology of guar solutions Patrick J. Whitcomb, John Gutowski, Warren W. Howland · Journal of Applied Polymer Science | Dec 1980 | 72 |
| 13 | The effect of reflow profile on SnPb and SnAgCu solder joint shear strength Jianbiao Pan, Brian J. Toleno, Tzu‐Chien Chou et al. · Soldering and Surface Mount Technology | Oct 2006 | 62 |
| 14 | Enhanced mechanical properties of polyurethane composite coatings through nanosilica addition Suraj Maganty, Maria Penafrancia C. Roma, Stephan J. Meschter et al. · Progress in Organic Coatings | 7 Nov 2015 | 60 |
| 15 | Gold solvent extraction from typical cyanide leach solutions Gary Kordosky, J.M. Sierakoski, Michael Virnig et al. · Hydrometallurgy | Jun 1992 | 56 |
| 16 | Copper solvent extraction: The state of the art Gary Kordosky · JOM | May 1992 | 55 |
| 17 | Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints Jianbiao Pan, Tzu‐Chien Chou, Jasbir Bath et al. · Soldering and Surface Mount Technology | 18 Sep 2009 | 43 |
| 18 | Environmentally Friendly Zr-Based Conversion Nanocoatings for Corrosion Inhibition of Metal Surfaces Evaluated by Multimodal X-ray Analysis Xiaoyang Liu, Donald Vonk, Hua Jiang et al. · ACS Applied Nano Materials | 14 Mar 2019 | 41 |
| 19 | Oleochemical products as building blocks for polymers Andreas Heidbreder, Rainer Höfer, Roland Grützmacher et al. · Fette Seifen Anstrichmittel | Nov 1999 | 41 |
| 20 | Improving the performance of pressure sensitive adhesives by tuning the crosslinking density and locations Kai Jin, Diego López Barreiro, Francisco J. Martín‐Martínez et al. · Polymer | 28 Aug 2018 | 39 |
| 21 | The over-bump applied resin wafer-level underfill process: Process, material and reliability Claudius Feger, N. LaBianca, Michael A. Gaynes et al. | May 2009 | 37 |
| 22 | Migration studies and chemical characterization of low molecular weight cyclic polyester oligomers from food packaging lamination adhesives Nan Zhang, Grant B. Kenion, Dennis Bankmann et al. · Packaging Technology and Science | 22 Jan 2018 | 33 |
| 23 | An analysis of the role of wax in hot melt adhesives Jeffrey P. Kalish, Suriyakala Ramalingam, Huimin Bao et al. · International Journal of Adhesion and Adhesives | 6 Apr 2015 | 32 |
| 24 | Photopolymerization Behavior of Thiol−Acrylate Monomers in Clay Nanocomposites Kwame Owusu-Adom, Joel Schall, C. Allan Guymon · Macromolecules | 14 Apr 2009 | 30 |
| 25 | Dispersion of titanium dioxide pigments by alkyl polyglycoside surfactants in aqueous solution George A. Smith, Allison L. Zulli, Merlin D. Grieser et al. · Colloids and Surfaces A Physicochemical and Engineering Aspects | Aug 1994 | 29 |
| 26 | Pressure-Sensitive Adhesives (PSAs) Charles W. Paul | 2011 | 28 |
| 27 | Unraveling the Mechanism of Electrically Induced Adhesive Debonding: A Spectro‐Microscopic Study Clara Anduix‐Canto, Daniel Peral, Víctor Pérez‐Padilla et al. · Advanced Materials Interfaces | 2 Dec 2021 | 28 |
| 28 | Drop test reliability of lead-free chip scale packages Andrew Farris, Jianbiao Pan, Albert A. Liddicoat et al. | May 2008 | 28 |
| 29 | Reaction Kinetic Model of Dilute Acid-Catalyzed Hemicellulose Hydrolysis of Corn Stover under High-Solid Conditions Suan Shi, Wenjian Guan, Kang Cong Li et al. · Industrial & Engineering Chemistry Research | 13 Sep 2017 | 27 |
| 30 | Mitigation of Staphylococcus aureus‐Mediated Surgical Site Infections with IR Photoactivated TiO2 coatings on Ti Implants Asem F. Aboelzahab, Abdul‐Majeed Azad, Shawn E. Dolan et al. · Advanced Healthcare Materials | 29 Mar 2012 | 26 |
| 31 | Structural Dynamics in UV Curable Resins Resolved by In Situ 3D Printing X-ray Photon Correlation Spectroscopy Benjamin M. Yavitt, Lutz Wiegart, Daniel Salatto et al. · ACS Applied Polymer Materials | 27 Jul 2020 | 23 |
| 32 | Nanoceramic-based conversion coating Patrick Droniou, William E. Fristad, Jeng‐Li Liang · Metal Finishing | Dec 2005 | 23 |
| 33 | Early science commissioning results of the sub-micron resolution X-ray spectroscopy beamline (SRX) in the field of materials science and engineering Yu‐chen Karen Chen‐Wiegart, Garth J. Williams, Chonghang Zhao et al. · AIP conference proceedings | 2016 | 22 |
| 34 | Combining sulfate electrowinning with chloride leaching A. W. Fletcher, R. B. Sudderth, S. M. Olafson · JOM | Aug 1991 | 22 |
| 35 | High performance liquid chromatography of phospholipids with flame ionization detection Merlin D. Grieser, Jerome N. Geske · Journal of the American Oil Chemists Society | Oct 1989 | 22 |
| 36 | A State-of-the-Art Discussion on the Solvent Extraction Reagents Used for the Recovery of Copper from Dilute Sulfuric Acid Leach Solutions Gary Kordosky, S. M. Olafson, Roy G. Lewis et al. · Separation Science and Technology | Feb 1987 | 22 |
| 37 | Unraveling the Formation Mechanism of a Hybrid Zr-Based Chemical Conversion Coating with Organic and Copper Compounds for Corrosion Inhibition Xiaoyang Liu, Donald Vonk, Kim Kisslinger et al. · ACS Applied Materials & Interfaces | 19 Jan 2021 | 21 |
| 38 | Drilling and Well Completions F. E. Beck, Daniel E. Boone, Robert Desbrandes et al. · Elsevier eBooks | 1996 | 21 |
| 39 | Revealing nanoscale dynamics during an epoxy curing reaction with x-ray photon correlation spectroscopy Benjamin M. Yavitt, Daniel Salatto, Zhixing Huang et al. · Journal of Applied Physics | 17 Mar 2020 | 20 |
| 40 | Low Warpage Molding Compound Development for Array Packages K Y. Chien, Jack Zhang, L. P. Rector et al. · 2006 1st Electronic Systemintegration Technology Conference | 2006 | 18 |
| 41 | N-Cyanoimides via the Cyanation of Imides Randall W. Stephens, Linda A. Domeier · Synthetic Communications | Oct 1991 | 17 |
| 42 | Characterization of compositional heterogeneity in copolymers and coatings systems by GPC/FTIR Theodore Provder, Michele Whited, David H. Huddleston et al. · Progress in Organic Coatings | Dec 1997 | 16 |
| 43 | Processing and reliability of corner bonded CSPs Brian J. Toleno, Joachim Schneider | 6 May 2004 | 15 |
| 44 | The role of lubricants in rigid PVC foam processing Robert W. Decker · Journal of Vinyl and Additive Technology | Jun 1996 | 15 |
| 45 | Liquid optically clear adhesives for display applications Dunjie Lu, Jiaying Wang, Chengzhuo Li et al. | Aug 2012 | 15 |
| 46 | Unveiling 3D Morphology of Multiscale Micro‐Nanosilver Sintering for Advanced Electronics Manufacturing by Ptychographic X‐ray Nanotomography Yu‐Chung Lin, Xiaoyang Liu, Kang Wei Chou et al. · Advanced Engineering Materials | 7 Feb 2020 | 14 |
| 47 | Amorphous ceramics as the particulate phase in electrorheological materials systems Daniel R. Gamota, Adam W. Schubring, Brian L. Mueller et al. · Journal of materials research/Pratt's guide to venture capital sources | 1996 | 14 |
| 48 | Role of n-alkane-based additives in hot melt adhesives Jeffrey P. Kalish, Suriyakala Ramalingam, Onyenkachi Wamuo et al. · International Journal of Adhesion and Adhesives | Aug 2014 | 14 |
| 49 | Wafer-Applied Underfill: Flip-Chip Assembly and Reliability Wayne R. Johnson, Qing Wang, Fei Ding et al. · IEEE Transactions on Electronics Packaging Manufacturing | Apr 2004 | 13 |
| 50 | Low Warpage Flip-Chip Under-Fill Curing Robert L. Hubbard, Pierino Zappella · IEEE Transactions on Components Packaging and Manufacturing Technology | 29 Jun 2011 | 13 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.