Institution · Heraeus (United States)
Most cited papers from Heraeus (United States)
What are the most cited papers from Heraeus (United States)?
The most cited paper from Heraeus (United States) is "Review: liquid phase sintering" (Randall M. German, Pavan Suri, Seong Jin Park, 2008), with 1,449 citations. Next come "Lead‐free alloys" (94) and "High temperature lead-free solder for microelectronics" (72).
Showing 50 of 68 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Review: liquid phase sintering Randall M. German, Pavan Suri, Seong Jin Park · Journal of Materials Science | 10 Dec 2008 | 1,449 |
| 2 | Lead‐free alloys Anton Miric, Angela Grusd · Soldering and Surface Mount Technology | Apr 1998 | 94 |
| 3 | High temperature lead-free solder for microelectronics Frank W. Gayle, G.A. Becka, Ahmer R. Syed et al. · JOM | Jun 2001 | 72 |
| 4 | Master Sintering Curve Formulated from Constitutive Models Seong Jin Park, Pavan Suri, Eugene A. Olevsky et al. · Journal of the American Ceramic Society | 10 Jun 2009 | 41 |
| 5 | Thermal Performance Comparison of Thick-Film Insulated Aluminum Substrates With Metal Core PCBs for High-Power LED Modules Eveliina Juntunen, Aila Sitomaniemi, Olli Tapaninen et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | 29 Aug 2012 | 38 |
| 6 | Development of a Ti-based alloy: Design and experiment Haitham El Kadiri, Liang Wang, H. Özkan Gülsoy et al. · JOM | May 2009 | 35 |
| 7 | Solder paste print qualification using laser triangulation R. Lathrop · IEEE Transactions on Components Packaging and Manufacturing Technology Part C | Jul 1997 | 29 |
| 8 | A simple method for accurate loss tangent measurement of dielectrics using a microwave resonant cavity Daiqing Li, Charles E. Free, K.E.G. Pitt et al. · IEEE Microwave and Wireless Components Letters | Mar 2001 | 20 |
| 9 | Screen-printing simulation study on solar cell front side AG paste Michael R. Neidert, Weimin Zhang, Dong Zhang et al. · Conference record of the IEEE Photovoltaic Specialists Conference | May 2008 | 20 |
| 10 | Influence of mixing and effect of agglomerates on the green and sintered properties of 97W–2.1Ni–0.9Fe heavy alloys Pavan Suri, Randall M. German, Júpiter Palagi de Souza · International Journal of Refractory Metals and Hard Materials | 15 Nov 2008 | 20 |
| 11 | Optical fiber for UV-IR broadband spectroscopy Grant Lu, Gerhard F. Schoetz, Jan Vydra et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 9 Jul 1998 | 18 |
| 12 | Electrical Characterization of LTCC Coplanar Lines up to 110 GHz M. Henry, Charles E. Free, Q. Reynolds et al. | Sep 2006 | 15 |
| 13 | A novel thick film on ceramic MCM technology offering MCM-D performance Peter Barnwell, J. Wood | 22 Nov 2002 | 14 |
| 14 | Novel Approaches to Current BGA Packaging Challenges ChangGyun Ryu, Jackson Hsu, Lito Mendoza et al. | Dec 2008 | 10 |
| 15 | Solder paste printing and stencil design considerations for wafer bumping R. Lathrop | 4 Oct 2004 | 10 |
| 16 | 18,090-km 2-core Fiber Transmission Using Circulatory Directional Fan-in/Fan-out Devices Daiki Soma et al. | 2024 | 9 |
| 17 | Increased Current Efficiency and Reduced Energy Consumption at the TRIMET Smelter Essen Using 9 Box Matrix Control Torsten Rieck, Martin Iffert, Peter R. White et al. | 2016 | 8 |
| 18 | Does Cement Viscosity Impact Antibiotic Elution and In Vitro Efficacy Against Common Prosthetic Joint Infection Pathogens? Matthew J. Dietz, Brian M. McGowan, Dylan D. Thomas et al. · Clinical Orthopaedics and Related Research | 2 Oct 2024 | 7 |
| 19 | Robust commercial diffuse reflector for UV-VIS-NIR applications John D. Mason, Michael T. Cone, Matthew Donelon et al. · Applied Optics | 21 Aug 2015 | 7 |
| 20 | Enabling ceramic circuit technologies for wireless microelectronics packaging Peter Barnwell, Mike O'Neill | 22 Nov 2002 | 7 |
| 21 | Enhancement in Magnetic Anisotropy for hcp-Structured Co Alloy Thin Films Through Pt Addition W. K. Shen, Anindita Das, M. Racine et al. · IEEE Transactions on Magnetics | 29 Sep 2006 | 7 |
| 22 | Understanding the mechanism of light induced plating of silver on screen-printed contacts for high sheet resistance emitters with low surface phosphorus concentration Abasifreke Ebong, D.S. Kim, Ajeet Rohatgi et al. · Conference record of the IEEE Photovoltaic Specialists Conference | May 2008 | 7 |
| 23 | Understanding Interphase Boundary Dynamics by In Situ High-Resolution and Energy-Filtering Transmission Electron Microscopy and Real-Time Image Simulation James M. Howe, Torey Murray, K. T. Moore et al. · Microscopy and Microanalysis | Jun 1998 | 7 |
| 24 | The influence of materials properties on the design of MCM and microstrip structures K.E.G. Pitt, Charles E. Free, D. Li et al. · Journal of Materials Science Materials in Electronics | Sep 1999 | 7 |
| 25 | Record length of 2000 km weakly-coupled 7-core MCF produced from a single large-scale MCF preform Tobias Tieß, Michael Lorenz, Jongwon Lee et al. | 2024 | 6 |
| 26 | Metallization contributions, requirements, and effects related to pattern transfer printing (PTP™) on crystalline silicon solar cells Ryan W. Mayberry, Vinodh Chandrasekaran · AIP conference proceedings | 2019 | 5 |
| 27 | Silver Pastes Capable of Narrow Line, High Aspect Ratio and High Pastes Transferability for Knotless High Mesh Screen Printing Haixin Yang, Colin S. Davis | Jun 2018 | 5 |
| 28 | Fabrication of low cost microwave circuits and structures using an advanced thick film technology Peter Barnwell, J. Wood | 27 Nov 2002 | 5 |
| 29 | Perturbation method for dielectric constant measurementof thick-film dielectric materials at microwave frequencies D. Li, Charles E. Free, K.E.G. Pitt et al. · Electronics Letters | 15 Oct 1998 | 5 |
| 30 | Integrated microwave structures using an advanced thick-film technology Peter Barnwell, Mike O'Neill, Charles E. Free | 20 Jan 2003 | 5 |
| 31 | Two-material/two-color powder metal injection molding (2C-PIM) Pavan Suri · Elsevier eBooks | 2012 | 5 |
| 32 | Fused silica challenges in sensitive space applications Josephine Criddle, F. Nürnberg, Robert J. Sawyer et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 22 Jul 2016 | 4 |
| 33 | Thermal stability and recording characteristics of thin film media with a CoCr based non-magnetic interlayer Lan Zhang, B. B. Lal, Michael A. Russak et al. · IEEE Transactions on Magnetics | 1999 | 4 |
| 34 | Advanced Thick‐film Technology — The New Generation Peter Barnwell, J. Wood · Microelectronics International | Dec 1997 | 4 |
| 35 | Parameters Affecting the Incidence of Pad Bridging in Surface Mounted Device Attachment B.L. Roos-Kozel · Hybrid Circuits | Feb 1985 | 4 |
| 36 | Industrial Realization Of Low-Emittance Oxide/Metal/Oxide Films On Glass Klaus Hartig, W.‐D. Münz, Michael Scherer et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | Dec 1983 | 3 |
| 37 | Conformal window for the airborne laser aircraft David N. Gritz, Ronald R. Mazzuca, Mary Jane C. Edwards et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 3 Aug 1999 | 3 |
| 38 | A new LTCC fabrication technology for planar millimeter-wave circuits Charles E. Free, Zhongliang Tian, Peter Barnwell et al. | 22 Jan 2003 | 3 |
| 39 | Evaluation of a Lead-Free Ultra Low Temperature Co-Fire Ceramic (ULTCC) Tape Designed for Lamination on Aluminum Substrates and a Compatible Co-Fireable Silver Conductor Steven Grabey, Samson Shahbazi, Ryan Persons et al. · IMAPSource Proceedings | Oct 2016 | 2 |
| 40 | Print Copper on Ceramic for High Reliability Electronics Ryan Persons, Paul Gundel · IMAPSource Proceedings | Oct 2015 | 2 |
| 41 | LTCC Technology at High Millimetre Wave Frequencies M. Henry, Charles E. Free, Q. Reynolds et al. · 2006 1st Electronic Systemintegration Technology Conference | 2006 | 2 |
| 42 | 126-Tb/s C+L-Band 2-Core Fiber Transmission Over 114.6 km × 5 Spans Kosuke Komatsu, Shohei Beppu, Daiki Soma et al. · Journal of Lightwave Technology | 6 Jun 2025 | 1 |
| 43 | Large Scale MCF production for future SDM networks Martin Böttcher, Tobias Tieß, Michael Lorenz et al. | 15 Jul 2024 | 1 |
| 44 | Bone Cement Fumes Generated in Laminar Airflow Versus Conventionally Ventilated Operating Rooms Matthew P. Jamison, Emily R. Hunt, Mary Catherine West et al. · Journal of Bone and Joint Surgery | 28 Aug 2023 | 1 |
| 45 | Optimized fused silica used in new astronomical applications Wolfgang Schlichting, Bodo Kühn, F. Nürnberg · Advances in Optical and Mechanical Technologies for Telescopes and Instrumentation V | 29 Aug 2022 | 1 |
| 46 | Trends in specialty fiber optic materials: characterization and applications Andreas Langner, Peter Bauer, Dörte Schönfeld et al. | 3 Mar 2021 | 1 |
| 47 | Low activity tabbing pastes for passivated surface Yi Yang, Guang yu Zhai, Zhuping Xi et al. · Energy Procedia | Sep 2017 | 1 |
| 48 | Silver flake interactions with organics in photovoltaic backside tabbing paste Cerise Baker, Lindsey Karpowich, Weimin Zhang | Jun 2015 | 1 |
| 49 | Magnetic Anisotropy Enhancement for hcp Structured Co Alloy Thin Films through Pt Doping Wanqing Shen, Arijit Das, M. Racine et al. | May 2006 | 1 |
| 50 | Development of a Novel Resistor System for Nitrogen Firing Applications D. Hankey, Craig A. Fisher · IEEE Transactions on Components Hybrids and Manufacturing Technology | Dec 1984 | 1 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.