Most cited papers from Hodges University

Hodges University

What are the most cited papers from Hodges University?

The most cited paper from Hodges University is "Guidelines for the use and interpretation of assays for monitoring autophagy (3rd edition)" (Daniel J. Klionsky et al., 2016), with 6,023 citations. Next come "Red Media, Blue Media: Evidence of Ideological Selectivity in Media Use" (1,975) and "Six cases of reliability study of Pb-free solder joints in electronic packaging technology" (1,367).

Published TypeFieldAccessAuthorsCitations

Showing 50 of 60 papers. Every paper with more than 159 citations is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	Guidelines for the use and interpretation of assays for monitoring autophagy (3rd edition) Daniel J. Klionsky et al. · Autophagy Open access2,467 authors	2 Jan 2016	6,023
2	Red Media, Blue Media: Evidence of Ideological Selectivity in Media Use Shanto Iyengar, Kyu S. Hahn · Journal of Communication	Mar 2009	1,975
3	Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports	Jun 2002	1,367
4	Recent advances on electromigration in very-large-scale-integration of interconnects K. N. Tu · Journal of Applied Physics	24 Oct 2003	1,074
5	Auto-Encoding Variational Bayes Yan-Kun Chen, Jingxuan Liu, Lingyun Peng et al. · Cambridge Explorations in Arts and Sciences Open access	7 Feb 2024	1,022
6	Nanocrystalline materials and coatings S. C. Tjong, Haydn Chen · Materials Science and Engineering R Reports	11 Aug 2004	924
7	FinFET scaling to 10 nm gate length Bin Yu, Leland Chang, Safayet Ahmed et al. Conference paper	26 Jun 2003	597
8	Growth kinetics of planar binary diffusion couples: ’’Thin-film case’’ versus ’’bulk cases’’ U. Gösele, K. N. Tu · Journal of Applied Physics	Apr 1982	575
9	Interdiffusion and reaction in bimetallic Cu-Sn thin films K. N. Tu · Acta Metallurgica	Apr 1973	488
10	Electrical breakdown in thin gate and tunneling oxides Ih-Chin Chen, S. Holland, Chenming Calvin Hu · IEEE Transactions on Electron Devices	Feb 1985	485
11	Live streaming commerce from the sellers’ perspective: implications for online relationship marketing Apiradee Wongkitrungrueng, Nassim Dehouche, Nuttapol Assarut · Journal of Marketing Management	23 Mar 2020	465
12	The Warburg Effect and the Hallmarks of Cancer Laurent Schwartz, Claudiu Trandafir Supuran, Khalid Omer Alfarouk · Anti-Cancer Agents in Medicinal Chemistry	12 Jan 2017	444
13	Metal-dielectric band alignment and its implications for metal gate complementary metal-oxide-semiconductor technology Yee‐Chia Yeo, Tsu-Jae King, Chenming Calvin Hu · Journal of Applied Physics	2 Dec 2002	427
14	Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper Kuan-Chia Chen, Wen‐Wei Wu, Chien‐Neng Liao et al. · Science	21 Aug 2008	413
15	Deep and Superficial Fibers of the Lumbar Multifidus Muscle Are Differentially Active During Voluntary Arm Movements G. Lorimer Moseley, Paul W. Hodges, Simon C. Gandevia · Spine	2002	406
16	Current-crowding-induced electromigration failure in flip chip solder joints Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters	28 Jan 2002	366
17	Physics and materials challenges for lead-free solders K. N. Tu, Andriy M. Gusak, M. Li · Journal of Applied Physics	Feb 2003	361
18	Low Schottky barrier of rare-earth silicide on n-Si K. N. Tu, R. D. Thompson, B-Y. Tsaur · Applied Physics Letters	15 Apr 1981	355
19	Hot-Electron-Induced MOSFET Degradation - Model, Monitor, and Improvement Chenming Hu, Simon C. Tam, Fu-Chieh Hsu et al. · IEEE Journal of Solid-State Circuits	Feb 1985	344
20	An investigation of the properties of cubic GaN grown on GaAs by plasma-assisted molecular-beam epitaxy S. Strite, Juanzhang Ruan, Zixun Li et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena	Jul 1991	329
21	Deactivation of the boron acceptor in silicon by hydrogen Chih‐Tang Sah, Jack Yuan-Chen Sun, Joseph Jeng-Tao Tzou · Applied Physics Letters	15 Jul 1983	324
22	Effect of Top Electrode Material on Resistive Switching Properties of $\hbox{ZrO}_{2}$ Film Memory Devices Chih-Yang Lin, Chenyu Wu, Chung‐Yi Wu et al. · IEEE Electron Device Letters	25 Apr 2007	320
23	Experimental design and primary data analysis methods for comparing adaptive interventions. Inbal Billie Nahum-Shani, Min Qian, Daniel Almirall et al. · Psychological Methods Open access	Oct 2012	305
24	Residual stress measurement in textured thin film by grazing-incidence X-ray diffraction Cheng-Hsin Ma, Jia‐Hong Huang, Haydn Chen · Thin Solid Films	Oct 2002	288
25	Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology Jihun Jang, P. G. Kim, K. N. Tu et al. · Journal of Applied Physics	15 Jun 1999	284
26	Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples H. Gan, K. N. Tu · Journal of Applied Physics	7 Mar 2005	272
27	Implanted noble gas atoms as diffusion markers in silicide formation W.K. Chu, S.S. Lau, J. W. Mayer et al. · Thin Solid Films	Feb 1975	267
28	Roles of the peroxisome proliferator-activated receptors (PPARs) in the pathogenesis of nonalcoholic fatty liver disease (NAFLD) Yuan-ye Qiu, Jing Zhang, Fanyi Zeng et al. · Pharmacological Research Open access	3 May 2023	262
29	Selective growth of metal-rich silicide of near-noble metals K. N. Tu · Applied Physics Letters	15 Aug 1975	250
30	A comparative study of advanced MOSFET concepts Clement H. Wann, Kenji Noda, Tetsu Tanaka et al. · IEEE Transactions on Electron Devices Open access	1996	240
31	The Computational Limits of Deep Learning Neil Thompson, Kristjan H. Greenewald, Keeheon Lee et al. Conference paperOpen access	5 Jun 2023	239
32	Robust filtering for jumping systems with mode-dependent delays Peng Shi, Magdi S. Mahmoud, Sing Kiong Nguang et al. · Signal Processing	5 Jun 2005	239
33	An extended UTAUT model to explain the adoption of mobile banking Veera Bhatiasevi · Information Development	11 Mar 2015	238
34	Ultrathin-body SOI MOSFET for deep-sub-tenth micron era Yang‐Kyu Choi, Kuniji ASANO, N. Lindert et al. · IEEE Electron Device Letters	May 2000	238
35	Hollow nanostructures based on the Kirkendall effect: Design and stability considerations K. N. Tu, U. Gösele · Applied Physics Letters	25 Feb 2005	237
36	Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics	24 Oct 2003	232
37	Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization T. Y. Lee, K. N. Tu, D. R. Frear · Journal of Applied Physics	Nov 2001	227
38	Mycobacterium massiliense is differentiated from Mycobacterium abscessus and Mycobacterium bolletii by erythromycin ribosome methyltransferase gene (erm) and clarithromycin susceptibility patterns Hee-Youn Kim, Byoung Jun Kim, Yoonwon Kook et al. · Microbiology and Immunology Open access	8 Mar 2010	216
39	Direct tunneling leakage current and scalability of alternative gate dielectrics Yee‐Chia Yeo, Tsu-Jae King, Chenming Calvin Hu · Applied Physics Letters	9 Sep 2002	213
40	Morphology of cellular precipitation of tin from lead-tin bicrystals-ii K. N. Tu, David Turnbull · Acta Metallurgica	Aug 1967	213
41	Parallel silicide contacts Iwao Ohdomari, K. N. Tu · Journal of Applied Physics	Jul 1980	211
42	Substrate hole current and oxide breakdown I. C. Chen, S. Holland, Konrad K.-L. Young et al. · Applied Physics Letters	15 Sep 1986	204
43	Metabolic potential of uncultured bacteria and archaea associated with petroleum seepage in deep-sea sediments Xiyang Dong, Chris Greening, Jayne E. Rattray et al. · Nature Communications Open access	18 Apr 2019	203
44	Dendrimer‐based nanocarriers: a versatile platform for drug delivery Hao‐Jui Hsu, Jason Bugno, Seung‐ri Lee et al. · Wiley Interdisciplinary Reviews Nanomedicine and Nanobiotechnology	29 Apr 2016	203
45	Interactions in the Co/Si thin-film system. I. Kinetics S.S. Lau, J. W. Mayer, K. N. Tu · Journal of Applied Physics	Jul 1978	197
46	A simple method to characterize substrate current in MOSFET's T.Y. Chan, P.K. Ko, Chenming Calvin Hu · IEEE Electron Device Letters	Dec 1984	193
47	Three-dimensional morphology of a very rough interface formed in the soldering reaction between eutectic SnPb and Cu H. K. Kim, H. K. Liou, K. N. Tu · Applied Physics Letters	May 1995	193
48	Switch-induced error voltage on a switched capacitor B.J. Sheu, Chenming Calvin Hu · IEEE Journal of Solid-State Circuits	Aug 1984	184
49	The effectiveness of supervisor support in lessening perceived uncertainties and emotional exhaustion of university employees during the COVID-19 crisis: the constraining role of organizational intransigence Peerayuth Charoensukmongkol, Tipnuch Phungsoonthorn · The Journal of General Psychology	21 Jul 2020	183
50	Electromigration of eutectic SnPb solder interconnects for flip chip technology T. Y. Lee, K. N. Tu, S.-M. Kuo et al. · Journal of Applied Physics	15 Mar 2001	182

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.