Most cited papers from Nanopolis Suzhou (China)
What are the most cited papers from Nanopolis Suzhou (China)?
The most cited paper from Nanopolis Suzhou (China) is "Recent Advances in GaN‐Based Power HEMT Devices" (Jiaqi He, Wei‐Chih Cheng, Qing Wang et al., 2021), with 258 citations. Next come "p-Channel GaN Transistor Based on p-GaN/AlGaN/GaN on Si" (157) and "Regrowth-Free GaN-Based Complementary Logic on a Si Substrate" (145).
Showing 50 of 60 papers. Every paper with more than 9 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Recent Advances in GaN‐Based Power HEMT Devices Jiaqi He, Wei‐Chih Cheng, Qing Wang et al. · Advanced Electronic Materials | 29 Jan 2021 | 258 |
| 2 | p-Channel GaN Transistor Based on p-GaN/AlGaN/GaN on Si Nadim Chowdhury, Jori Lemettinen, Qingyun Xie et al. · IEEE Electron Device Letters | 13 May 2019 | 157 |
| 3 | Regrowth-Free GaN-Based Complementary Logic on a Si Substrate Nadim Chowdhury, Qingyun Xie, Mengyang Yuan et al. · IEEE Electron Device Letters | 9 Apr 2020 | 145 |
| 4 | Gate leakage mechanisms in normally off p-GaN/AlGaN/GaN high electron mobility transistors Ning Xu, Ronghui Hao, Fu Chen et al. · Applied Physics Letters | 8 Oct 2018 | 122 |
| 5 | 10 kV, 39 mΩ·cm2 Multi-Channel AlGaN/GaN Schottky Barrier Diodes Ming Xiao, Yunwei Ma, Kai Liu et al. · IEEE Electron Device Letters | 30 Apr 2021 | 116 |
| 6 | 3.3 kV Multi-Channel AlGaN/GaN Schottky Barrier Diodes With P-GaN Termination Ming Xiao, Yunwei Ma, Kai Cheng et al. · IEEE Electron Device Letters | 30 Jun 2020 | 104 |
| 7 | Multi-channel nanowire devices for efficient power conversion Luca Nela, Jun Ma, C. Erine et al. · Nature Electronics | 25 Mar 2021 | 103 |
| 8 | 720-V/0.35-m $\Omega \cdot$ cm2Fully Vertical GaN-on-Si Power Diodes by Selective Removal of Si Substrates and Buffer Layers Yuhao Zhang, Mengyang Yuan, Nadim Chowdhury et al. · IEEE Electron Device Letters | 26 Mar 2018 | 102 |
| 9 | 1300 V Normally-OFF p-GaN Gate HEMTs on Si With High ON-State Drain Current Huaxing Jiang, Qifeng Lyu, Renqiang Zhu et al. · IEEE Transactions on Electron Devices | 22 Dec 2020 | 91 |
| 10 | 820-V GaN-on-Si Quasi-Vertical p-i-n Diodes With BFOM of 2.0 GW/cm2 Riyaz Abdul Khadar, Chao Liu, Liyang Zhang et al. · IEEE Electron Device Letters | 15 Jan 2018 | 87 |
| 11 | AlN/GaN/InGaN Coupling-Channel HEMTs for Improved g m and Gain Linearity Hao Lu, Bin Hou, Ling Yang et al. · IEEE Transactions on Electron Devices | 31 May 2021 | 70 |
| 12 | A GaN HEMT Structure Allowing Self-Terminated, Plasma-Free Etching for High-Uniformity, High-Mobility Enhancement-Mode Devices Shuxun Lin, Maojun Wang, Fei Sang et al. · IEEE Electron Device Letters | 25 Feb 2016 | 70 |
| 13 | Multi-channel tri-gate normally-on/off AlGaN/GaN MOSHEMTs on Si substrate with high breakdown voltage and low ON-resistance Jun Ma, Catherine Erine, Xiang Fang Peng et al. · Applied Physics Letters | 10 Dec 2018 | 68 |
| 14 | Quercetin Loaded Nanostructured Lipid Carrier for Food Fortification: Preparation, Characterization and in vitro Study Shilei Ni, Rui Sun, Guodong Zhao et al. · Journal of Food Process Engineering | 15 Sep 2014 | 64 |
| 15 | Multi-Channel Monolithic-Cascode HEMT (MC2-HEMT): A New GaN Power Switch up to 10 kV Ming Xiao, Yunwei Ma, Zhonghao Du et al. | 11 Dec 2021 | 60 |
| 16 | Characterization of 880 V Normally Off GaN MOSHEMT on Silicon Substrate Fabricated With a Plasma-Free, Self-Terminated Gate Recess Process Ming Tao, Shaofei Liu, Bing Lei Xie et al. · IEEE Transactions on Electron Devices | 5 Mar 2018 | 59 |
| 17 | Activity regulation and applications of metal–organic framework‐based nanozymes Fang Ge, Shouxin Bao, Gen-Xiu Zhou et al. · Rare Metals | 7 Sep 2023 | 58 |
| 18 | Lateral p-GaN/2DEG junction diodes by selective-area p-GaN trench-filling-regrowth in AlGaN/GaN Ming Xiao, Zhonghao Du, Jinqiao Xie et al. · Applied Physics Letters | 3 Feb 2020 | 55 |
| 19 | Multi-Channel Tri-Gate GaN Power Schottky Diodes With Low ON-Resistance Jun Ma, Georgios E. Kampitsis, Xiang Fang Peng et al. · IEEE Electron Device Letters | 18 Dec 2018 | 55 |
| 20 | Tri-gate GaN junction HEMT Yunwei Ma, Ming Xiao, Zhonghao Du et al. · Applied Physics Letters | 5 Oct 2020 | 48 |
| 21 | Strain Release in GaN Epitaxy on 4° Off‐Axis 4H‐SiC Sirui Feng, Zheyang Zheng, Yan Cheng et al. · Advanced Materials | 2 Apr 2022 | 47 |
| 22 | First Demonstration of a Self-Aligned GaN p-FET Nadim Chowdhury, Qingyun Xie, Mengyang Yuan et al. | Dec 2019 | 47 |
| 23 | Wafer-scale organic-on-III-V monolithic heterogeneous integration for active-matrix micro-LED displays Lei Han, Simon Ogier, Jun Li et al. · Nature Communications | Nov 2023 | 46 |
| 24 | 3.4-kV AlGaN/GaN Schottky Barrier Diode on Silicon Substrate With Engineered Anode Structure Ru Xu, Peng Chen, Menghan Liu et al. · IEEE Electron Device Letters | 4 Jan 2021 | 44 |
| 25 | Field-induced Acceptor Ionization in Enhancement-mode GaN p-MOSFETs Nadim Chowdhury, Qingyun Xie, John Niroula et al. | 12 Dec 2020 | 41 |
| 26 | 5 kV Multi-Channel AlGaN/GaN Power Schottky Barrier Diodes with Junction-Fin-Anode Ming Xiao, Yunwei Ma, Zhonghao Du et al. | 12 Dec 2020 | 38 |
| 27 | p-GaN Gate HEMTs With 10.6 V Maximum Gate Drive Voltages by Mg Doping Engineering Guangnan Zhou, Fanming Zeng, Rongyu Gao et al. · IEEE Transactions on Electron Devices | 17 Mar 2022 | 37 |
| 28 | Studies on Fabrication and Reliability of GaN High-Resistivity-Cap-Layer HEMT Ronghui Hao, Ning Xu, Guohao Yu et al. · IEEE Transactions on Electron Devices | 26 Feb 2018 | 34 |
| 29 | Robust Avalanche in 1.7 kV Vertical GaN Diodes With a Single-Implant Bevel Edge Termination Ming Xiao, Yifan Wang, Ruizhe Zhang et al. · IEEE Electron Device Letters | 14 Aug 2023 | 33 |
| 30 | First Demonstration of Vertical Superjunction Diode in GaN Ming Xiao, Yunwei Ma, Zhonghao Du et al. · 2022 International Electron Devices Meeting (IEDM) | 3 Dec 2022 | 33 |
| 31 | High-Voltage E-Mode p-GaN Gate HEMT on Sapphire With Gate Termination Extension Jiawei Cui, Yanlin Wu, Junjie Yang et al. · IEEE Transactions on Electron Devices | 7 Feb 2024 | 31 |
| 32 | Enhancement-Mode GaN Monolithic Bidirectional Switch With Breakdown Voltage Over 3.3 kV Yijin Guo, Yuan Qin, Ming Xiao et al. · IEEE Electron Device Letters | 4 Feb 2025 | 28 |
| 33 | 1200 V Multi-Channel Power Devices with 2.8 Ω•mm ON-Resistance Jun Ma, Catherine Erine, Minghua Zhu et al. | Dec 2019 | 28 |
| 34 | Demonstration of a 2 kV Al0.85Ga0.15N Schottky Barrier Diode With Improved On-Current and Ideality Factor Yanni Zhang, Jincheng Zhang, Zhihong Liu et al. · IEEE Electron Device Letters | 21 Jan 2020 | 26 |
| 35 | An energy-band modulated p-GaN/InGaN/AlN p-channel MESFET with high ION / IOFF ratio and steep subthreshold swing Huake Su, Tao Zhang, Shengrui Xu et al. · Applied Physics Letters | 15 Apr 2024 | 25 |
| 36 | Tri-Gate Normally-Off AlN/GaN HEMTs With 2.36 W/mm of Power Density and 67.5% Power-Added-Efficiency at V d = 12 V Jingshu Guo, Jiejie Zhu, Siyu Liu et al. · IEEE Electron Device Letters | 23 Feb 2023 | 25 |
| 37 | Au-Free Al₀.₄Ga₀.₆N/Al₀.₁Ga₀.₉N HEMTs on Silicon Substrate With High Reverse Blocking Voltage of 2 kV Yinhe Wu, Weihang Zhang, Jincheng Zhang et al. · IEEE Transactions on Electron Devices | 12 Jul 2021 | 23 |
| 38 | Conformal Passivation of Multi-Channel GaN Power Transistors for Reduced Current Collapse Luca Nela, Halil Kerim Yildirim, Catherine Erine et al. · IEEE Electron Device Letters | 17 Nov 2020 | 23 |
| 39 | Dislocation-assisted electron and hole transport in GaN epitaxial layers Yixu Yao et al. · Nature Communications | 12 Jul 2025 | 22 |
| 40 | Demonstration of 1200-V E-Mode GaN-on-Sapphire Power Transistor With Low Dynamic ON-Resistance Based on Active Passivation Technique Jiawei Cui, Maojun Wang, Yanlin Wu et al. · IEEE Electron Device Letters | 8 Dec 2023 | 22 |
| 41 | Implanted Guard Ring Edge Termination With Avalanche Capability for Vertical GaN Devices Yifan Wang, Matthew Porter, Ming Xiao et al. · IEEE Transactions on Electron Devices | 13 Oct 2023 | 21 |
| 42 | Self-Align-Gated GaN Field Emitter Arrays Sharpened by a Digital Etching Process Pao-Chuan Shih, Girish Rughoobur, Kai Cheng et al. · IEEE Electron Device Letters | 24 Feb 2021 | 21 |
| 43 | Improved Breakdown Voltage and Low Damage E-Mode Operation of AlON/AlN/GaN HEMTs Using Plasma Oxidation Treatment Siyu Liu, Jiejie Zhu, Jingshu Guo et al. · IEEE Electron Device Letters | 31 Aug 2022 | 19 |
| 44 | Investigation on the Influence of Ohmic Structure on Channel-to-Channel Coupling Effect in InAlN/GaN Double Channel HEMTs Ling Yang, Hao Lu, Meng Zhang et al. · IEEE Journal of the Electron Devices Society | 2022 | 18 |
| 45 | 5.3A/400V normally‐off AlGaN/GaN‐on‐Si MOS‐HEMT with high threshold voltage and large gate swing Zhihua Dong, Shuxin Tan, Yong Kui Cai et al. · Electronics Letters | 2013 | 17 |
| 46 | Performance Estimation of GaN CMOS Technology Nadim Chowdhury, Jaeyoung Jung, Qingyun Xie et al. | 20 Jun 2021 | 16 |
| 47 | 10 kV E-mode GaN HEMT: Physics for breakdown voltage upscaling Yijin Guo, Yuan Qin, Matthew Porter et al. · Applied Physics Letters | 28 Jul 2025 | 15 |
| 48 | HyFET—A GaN/SiC Hybrid Field-Effect Transistor Sirui Feng, Zheyang Zheng, Yuru Wang et al. | 9 Dec 2023 | 15 |
| 49 | Fully-Vertical GaN-on-SiC Schottky Barrier Diode: Role of Conductive Buffer Structure Yanjun Li, Shu Yang, Kai Liu et al. · IEEE Transactions on Electron Devices | 19 Dec 2022 | 15 |
| 50 | Trap behaviours characterization of AlGaN/GaN high electron mobility transistors by room-temperature transient capacitance measurement Bin Dong, Jie Lin, Ning Wang et al. · AIP Advances | Sep 2016 | 15 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.