Institution · NHanced Semiconductors (United States)
Most cited papers from NHanced Semiconductors (United States)
What are the most cited papers from NHanced Semiconductors (United States)?
The most cited paper from NHanced Semiconductors (United States) is "A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits" (Po-Hsuan Chang, Anirban Samanta, Peng Yan et al., 2023), with 40 citations. Next come "Si/InP Heterogeneous Integration Techniques from the Wafer-Scale (Hybrid Wafer Bonding) to the Discrete Transistor (Micro-Transfer Printing)" (11) and "Design, Fabrication, and Testing of a Liquid Cooling Platform for High Power 3D-ICs" (7).
Showing 28 of 28 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | A 3D Integrated Energy-Efficient Transceiver Realized by Direct Bond Interconnect of Co-Designed 12 nm FinFET and Silicon Photonic Integrated Circuits Po-Hsuan Chang, Anirban Samanta, Peng Yan et al. · Journal of Lightwave Technology | 3 Jul 2023 | 40 |
| 2 | Si/InP Heterogeneous Integration Techniques from the Wafer-Scale (Hybrid Wafer Bonding) to the Discrete Transistor (Micro-Transfer Printing) Andrew D. Carter, Miguel E. Urteaga, Zachary M. Griffith et al. | Oct 2018 | 11 |
| 3 | Design, Fabrication, and Testing of a Liquid Cooling Platform for High Power 3D-ICs Chandrasekhar Mandalapu, Ibrahim Abdel‐Motaleb, Sangki Hong et al. | Oct 2019 | 7 |
| 4 | Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning Theodros Nigussie, Joshua Schabel, Steve Lipa et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems | 13 Jun 2022 | 6 |
| 5 | Motivating automated multimodal failure analysis for heterogeneously integrated devices Patrick R. Craig, Nitin Varshney, Antika Roy et al. | 14 Aug 2024 | 5 |
| 6 | A 25-Gb/s 3-D Direct Bond Silicon Photonic Receiver in 12-nm FinFET Peng Yan, Po-Hsuan Chang, Anirban Samanta et al. · IEEE Solid-State Circuits Letters | 20 Dec 2023 | 5 |
| 7 | A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with -20.3dBm OMA Sensitivity and 691fJ/bit Anirban Samanta, Po-Hsuan Chang, Peng Yan et al. | 2023 | 4 |
| 8 | Revitalizing Advanced Packaging in America Pavanbabu Arjunamahanthi, Himanandhan Reddy Kottur, Navid Asadizanjani et al. | 27 Jan 2025 | 3 |
| 9 | Optimizing the segment anything model for PCB component segmentation in x-ray images through few-shot parameter-efficient fine-tuning Antika Roy, Md Mahfuz Al Hasan, Shajib Ghosh et al. | 3 Oct 2024 | 3 |
| 10 | Energy-Efficient Optical Transceiver Circuits Enabled by 3D Heterogeneous Integration Po-Hsuan Chang, Peng Yan, Anirban Samanta et al. | 15 Apr 2024 | 2 |
| 11 | Wafer-scale integration of antimonide-based MWIR FPAs Alex Gurga, Yan Tang, Sevag Terterian et al. | 9 Apr 2021 | 2 |
| 12 | The Future of Electronics Packaging is Chiplet Architecture Pavanbabu Arjunamahanthi, Himanandhan Reddy Kottur, Shajib Ghosh et al. · SMTA International | Oct 2025 | 1 |
| 13 | Development of Si-Interposers for 3D Heterogeneous Integration Charles Woychik, John A. Allgair, Chris Nichols et al. · Journal of Surface Mount Technology | Apr 2025 | 1 |
| 14 | A Sub-500fJ/bit 3D Direct Bond Silicon Photonic Transceiver in 12nm FinFET Po-Hsuan Chang, Anirban Samanta, Peng Yan et al. | 11 Jun 2023 | 1 |
| 15 | Scaling the $3^{\text {rd}}$ Dimension: High-Density Component Development for 3D Photonic Integrated Circuits E. Shin, A. Abdur Rahman Akib, M. Rabbani et al. | Jul 2026 | 0 |
| 16 | Predictive Reliability Modeling of Hybrid Bonding Through Warpage and Interfacial Defect Correlation Liton Kumar Biswas, Himanandhan Reddy Kottur, Istiaq Firoz Shiam et al. | 26 May 2026 | 0 |
| 17 | An Update on the Global View versus a U.S. Focus of Outsourced Assembly and Test (OSAT) Facilities to Support Wafer Levl Packaging Himanandhan Reddy Kottur, Pavanbabu Arjunamahanthi, Nusra Akte Takia et al. · Wafer-Level Packaging Symposium | Feb 2026 | 0 |
| 18 | Chiplet Packaging and AI Defect Inspection Himanandhan Reddy Kottur, Pratyush Shukla, Katayoon Yahyaei et al. · Pan Pacific Symposium | Feb 2026 | 0 |
| 19 | The Next Generation of Advanced Packaging: Heterogeneous Integration Charles Woychik · Wafer-Level Packaging Symposium | Feb 2024 | 0 |
| 20 | A Global View Versus a U.S. Focus on Outsourced Assembly and Test (OSAT) Facilities to Support Wafer Level Packaging Pavanbabu Arjunamahanthi, Himanandhan Reddy Kottur, Antika Roy et al. · Wafer-Level Packaging Symposium | Feb 2025 | 0 |
| 21 | Building Advanced 3D Devices with Hybrid Bonding Robert Patti · Wafer-Level Packaging Symposium | Feb 2023 | 0 |
| 22 | The Renaissance of Electronics Packaging in the United States Himanandhan Reddy Kottur, Nitin Varshney, M Shafkat M Khan et al. · SMTA International | Oct 2024 | 0 |
| 23 | The Next Generation of Si-Interposers Himanandhan Reddy Kottur, Nitin Varshney, M Shafkat M Khan et al. · SMTA International | Oct 2024 | 0 |
| 24 | Advanced Packaging, Heterogeneous Integration, and Foundry 2.0 Robert Patti | 11 Aug 2024 | 0 |
| 25 | New Radiation Tolerant LGAD for High Energy Physics Julie D. Segal, Christopher J. Kenney, Robert Patti et al. | 31 Oct 2020 | 0 |
| 26 | Novel 8-inch wafer scale process for low cost production of back side illuminated (BSI) imaging sensors Atul B. Joshi, David J. Chiaverini, Sachin Kashyap et al. | 9 Apr 2021 | 0 |
| 27 | 200 mm sensor development using bonded wafers Maral Alyari, Robyn L. Bradford, Mauro Campanella et al. · Journal of Instrumentation | 11 Feb 2021 | 0 |
| 28 | High density integrated isolated deep silicon vias in silicon for 3D-ROIC FPA architectures A. Kar-Roy, Sangki Hong, Yasir Qamar et al. | 26 May 2020 | 0 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.