Institution · Nscrypt (United States)
Most cited papers from Nscrypt (United States)
What are the most cited papers from Nscrypt (United States)?
The most cited paper from Nscrypt (United States) is "Tissue Engineering by Self-Assembly of Cells Printed into Topologically Defined Structures" (Károly Jakab, Cyrille Norotte, Brook J. Damon et al., 2008), with 380 citations. Next come "Determinants of Microvascular Network Topologies in Implanted Neovasculatures" (73) and "Encapsulation of Adipose Stromal Vascular Fraction Cells in Alginate Hydrogel Spheroids Using a Direct-Write Three-Dimensional Printing System" (62).
Showing 38 of 38 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Tissue Engineering by Self-Assembly of Cells Printed into Topologically Defined Structures Károly Jakab, Cyrille Norotte, Brook J. Damon et al. · Tissue Engineering Part A | Mar 2008 | 380 |
| 2 | Determinants of Microvascular Network Topologies in Implanted Neovasculatures Carlos C. Chang, Laxminarayanan Krishnan, Sara Santana Nunes et al. · Arteriosclerosis Thrombosis and Vascular Biology | 4 Nov 2011 | 73 |
| 3 | Encapsulation of Adipose Stromal Vascular Fraction Cells in Alginate Hydrogel Spheroids Using a Direct-Write Three-Dimensional Printing System Stuart K. Williams, Jeremy S. Touroo, Kenneth Church et al. · BioResearch open access | Dec 2013 | 62 |
| 4 | Robust Direct-Write Dispensing Tool and Solutions for Micro/Meso-Scale Manufacturing and Packaging B. Li, Patrick A. Clark, Kenneth Church | 2007 | 48 |
| 5 | Manufacturing electrochemical platforms: Direct-write dispensing versus screen printing Rashid O. Kadara, Norman Jenkinson, Bo Li et al. · Electrochemistry Communications | 12 Aug 2008 | 47 |
| 6 | High speed non-contact printing for solar cell front side metallization Xudong Chen, Kenneth Church, Haixin Yang | Jun 2010 | 33 |
| 7 | Improved front side metallization for silicon solar cells by direct printing Xudong Chen, Kenneth Church, Haixin Yang et al. | Jun 2011 | 31 |
| 8 | CubeSat Fabrication through Additive Manufacturing and Micro-Dispensing Cassie Denise Gutierrez, Rudy Salas, Gustavo Correa Hernández et al. · IMAPSource Proceedings | 2011 | 28 |
| 9 | Engineering a Titanium and Polycaprolactone Construct for a Biocompatible Interface Between the Body and Artificial Limb Cynthia M. Smith, Tithi Dutta Roy, Abhijeet Bhalkikar et al. · Tissue Engineering Part A | 21 Sep 2009 | 27 |
| 10 | Fully 3D Printed 2.4 GHz Bluetooth/Wi-Fi Antenna Paul I. Deffenbaugh, Kenneth Church, Josh Goldfarb et al. · IMAPSource Proceedings | 2013 | 26 |
| 11 | Printed electronic processes for flexible hybrid circuits and antennas Kenneth Church, Eric W. MacDonald, Patrick A. Clark et al. | Feb 2009 | 23 |
| 12 | Structural Electronics through Additive Manufacturing and Micro-Dispensing Richard Olivas, Rudy Salas, Dan Muse et al. · IMAPSource Proceedings | 2010 | 13 |
| 13 | Additive Manufacturing for Fabrication of Point-of-Care Therapies in Austere Environments Jason C. Barnhill, Joel D. Gaston, Paul I. Deffenbaugh et al. · Military Medicine | 3 Feb 2023 | 12 |
| 14 | Robust Printing and Dispensing Solutions with Three Sigma Volumetric Control for 21st Century Manufacturing and Packaging Bo Li, Patrick A. Clark, Kenneth Hail · MRS Proceedings | 2007 | 9 |
| 15 | High efficiency screen printed low-medium concentrator silicon solar cells with direct printed 50µm wide fingers Chia‐Wei Chen, Xu dong Chen, Kenneth Church et al. | Jun 2012 | 9 |
| 16 | A Robust True Direct-Print Technology for Tissue Engineering B. Li, Tithi Dutta Roy, Cynthia M. Smith et al. | 2007 | 9 |
| 17 | Large-area ∼20% efficient silicon solar cells using fine line direct printing Jiun-Hong Lai, Ian B. Cooper, Xudong Chen et al. | Jun 2012 | 4 |
| 18 | Heterogeneous Process Development for Electronic Device Packaging with Direct Printed Additive Manufacturing Ricardo Xavier Rodriguez, Kenneth Church, X. Chen · IMAPSource Proceedings | 2012 | 3 |
| 19 | Print-and-play: a new paradigm for the nearly-instant aerospace system Kenneth Church, CH Newton, Albert J. Marsh et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 22 Apr 2010 | 3 |
| 20 | Direct Printing/Micro-dispensing Solution for 3D Coating Applications Xudong Chen, Kenneth Church · IMAPSource Proceedings | 2010 | 2 |
| 21 | Direct Printing for Next Generation High Density Packaging Xudong Chen, Kenneth Church · IMAPSource Proceedings | 2011 | 2 |
| 22 | Micro-Dispense Direct Printing for Thermal Management Structure Using LTCC Xudong Chen, Kenneth Church, Ali Karbasi et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | Sep 2013 | 2 |
| 23 | Direct Digital Manufacturing for Laser-Drilled Vias in Multilayer Glass Printed Circuit Structures Bryce Gray, Jason Benoit, Sam LeBlanc et al. | 27 May 2025 | 1 |
| 24 | Direct Digital Manufacturing (DDM) Workflow for Printed Circuit Structures (PCS) Cortney Newton, Anand V. Kulkarni, J Benoît et al. · IMAPSource Proceedings | 13 Dec 2023 | 1 |
| 25 | Microdispensing Processes Kenneth Church · ASM International eBooks | 15 Jun 2020 | 1 |
| 26 | High Speed Dispensing Solutions for Packaging and Manufacturing B. Li, P.A. Clark, K.M. Stone et al. · IMAPSource Proceedings | 10 Jul 2026 | 0 |
| 27 | Study of Precise Micro-Dispensing for Adhesive Deposition Xudong Chen, Jacob Denkins, Kenneth Church · SMTA International | Sep 2014 | 0 |
| 28 | 3D Packaging and Interconnecting of Bare Die Chips by Direct-Print Technology Vladimir Pelekhaty, Bo Li, Kenneth Church · Wafer-Level Packaging Symposium | Sep 2007 | 0 |
| 29 | Turning Printed Circuit Boards into Printed Circuit Structures using 3D Printing Kenneth Church, Xudong Chen, Paul I. Deffenbaugh et al. · SMTA International | Sep 2014 | 0 |
| 30 | Direct Digital Manufacturing for 3D Electronic Packaging Sam LeBlanc, Casey P. Perkowski, Dasan E. Costandi et al. · SMTA International | Oct 2018 | 0 |
| 31 | Process Development for Micro-Electronics Packaging with Direct Printed Additive Manufacturing Ricardo Xavier Rodriguez, Kenneth Church, X. Chen · SMTA International | Oct 2012 | 0 |
| 32 | Multi-axis Process integration for Wafer Scale and Substrate-Like Printed Electronics Cortney Newton, Rudy Ghosh, Grant Wachtel et al. · IMAPSource Proceedings | 14 Jan 2025 | 0 |
| 33 | Direct Print Technology for Fabricating Mechanical Sensors Xudong Chen, Kenneth Church, Dan Muse et al. · IMAPSource Proceedings | 28 Apr 2026 | 0 |
| 34 | Improvement of Adhesion and Reliability of Conductive Inks on Flexible Liquid Crystal Polymer Substrates D. Muse, Stephen C. Pritchard, Eric W. MacDonald et al. · IMAPSource Proceedings | 28 Apr 2026 | 0 |
| 35 | p3D Micro Dispensing & Photonic Curing of Silver Nanoparticle Inks on Low Thermal Stability Molded Plastic Parts Michael Mastropietro, Ian Rawson, Vahid A. Akhavan et al. · IMAPSource Proceedings | Oct 2014 | 0 |
| 36 | Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor Xudong Chen, W. Kinzy Jones · IMAPSource Proceedings | 2010 | 0 |
| 37 | Reliable and Cost-Effective Dispensing Technology for Large-Area Patterning Bo Li, Patrick A. Clark, Kenneth Church · MRS Proceedings | 2007 | 0 |
| 38 | CAD/CAM for MEMS and BioMEMS Brian Hargrave, Bryan Irwin, Robert L. Parkhill et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 29 Jul 2004 | 0 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.