Institution · Onto Innovation (United States)

Most cited papers from Onto Innovation (United States)

Onto Innovation (United States)

What are the most cited papers from Onto Innovation (United States)?

The most cited paper from Onto Innovation (United States) is "Science and engineering for non-noble-metal-based electrocatalysts to boost their ORR performance: A critical review" (Sanket D. Bhoyate, Junyoung Kim, Felipe Martins de Souza et al., 2022), with 208 citations. Next come "Development of high-performance zinc-ion batteries: Issues, mitigation strategies, and perspectives" (85) and "Developing practical solid-state rechargeable Li-ion batteries: Concepts, challenges, and improvement strategies" (51).

Published TypeFieldAccess

Showing 50 of 97 papers. Every paper is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	Science and engineering for non-noble-metal-based electrocatalysts to boost their ORR performance: A critical review Sanket D. Bhoyate, Junyoung Kim, Felipe Martins de Souza et al. · Coordination Chemistry Reviews	30 Sep 2022	208
2	Development of high-performance zinc-ion batteries: Issues, mitigation strategies, and perspectives Teddy Mageto, Sanket D. Bhoyate, Kwadwo Mensah‐Darkwa et al. · Journal of Energy Storage	20 Jun 2023	85
3	Developing practical solid-state rechargeable Li-ion batteries: Concepts, challenges, and improvement strategies Teddy Mageto, Sanket D. Bhoyate, Felipe Martins de Souza et al. · Journal of Energy Storage	20 Sep 2022	51
4	Feeding high amounts of almond hulls to lactating cows K.L. Swanson, H.M. Bill, J. Asmus et al. · Journal of Dairy Science Open access	10 May 2021	39
5	Nutritional composition of almond hulls E.J. DePeters, K.L. Swanson, H.M. Bill et al. · Applied Animal Science Open access	Dec 2020	38
6	Controlling the broadband enhanced light chirality with L-shaped dielectric metamaterials Ufuk Kılıç, Matthew Hilfiker, Shawn Wimer et al. · Nature Communications Open access	4 May 2024	32
7	Hydrogen effects on the thermal conductivity of delocalized vibrational modes in amorphous silicon nitride ( a − SiN x : H ) Jeffrey L. Braun, Sean W. King, Eric R. Hoglund et al. · Physical Review Materials Open access	23 Mar 2021	27
8	Solvent-assisted sulfur vacancy engineering method in MoS 2 for a neuromorphic synaptic memristor Jiyeon Kim, Changik Im, Chan Young Lee et al. · Nanoscale Horizons	2023	24
9	Efficient pump-probe sampling with a single-cavity dual-comb laser: Application in ultrafast photoacoustics Justinas Pupeikis, Weisheng Hu, Benjamin Willenberg et al. · Photoacoustics Open access	13 Dec 2022	23
10	Nondestructive characterization of nanoscale subsurface features fabricated by selective etching of multilayered nanowire test structures using Mueller matrix spectroscopic ellipsometry based scatterometry Madhulika S. Korde, Subhadeep Kal, Cheryl Alix et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena	Mar 2020	23
11	MoTe2 Field-Effect Transistors with Low Contact Resistance through Phase Tuning by Laser Irradiation Geun Yeol Bae, Jin Sung Kim, Junyoung Kim et al. · Nanomaterials Open access	22 Oct 2021	16
12	Progress, challenges, and prospects with electrocatalyst (From transition metal oxides to dual-atom catalysts) for oxygen reduction reaction Teddy Mageto, Sanket D. Bhoyate, Anuj Kumar et al. · Molecular Catalysis	7 May 2024	13
13	Metal−Organic Precursors for Transition‐Metal‐Doped Ni2P via Pyrolysis for Efficient Overall Water Splitting and Supercapacitance Syabonga G. Sibiya, Gwaza Eric Ayom, Malik Dilshad Khan et al. · European Journal of Inorganic Chemistry Open access	7 Apr 2023	12
14	Tomato seeds as a novel by-product feed for lactating dairy cows C.A. Cassinerio, James G. Fadel, J. Asmus et al. · Journal of Dairy Science Open access	14 May 2015	12
15	X-ray critical dimension metrology solution for high aspect ratio semiconductor structures Matthew Wormington, Adam Ginsburg, Israel Reichental et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV Conference paper	19 Feb 2021	11
16	Machine learning driven measurement of high-aspect-ratio nanostructures using Mueller matrix spectroscopic ellipsometry Shiva Mudide, Nick Keller, G. A. Antonelli et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena Open access	2025	9
17	High Aspect Ratio, High Resolution, and Broad Process Window Description of a Low Loss Photodielectric for 5G HS/HF Applications Using High and Low Numerical Aperture Photolithography Tools Colin O. Hayes, Kevin Wang, Rosemary Bell et al. Conference paper	Jun 2020	9
18	Ellipsometric critical dimension metrology employing mid-infrared wavelengths for high-aspect-ratio channel hole module etch processes G. A. Antonelli, Nick Keller, Troy Ribaudo et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV Conference paper	19 Feb 2021	8
19	Nanocolumnar Metamaterial Platforms: Scaling Rules for Structural Parameters Revealed from Optical Anisotropy Ufuk Kılıç, Yousra Traouli, Matthew Hilfiker et al. · Advanced Optical Materials Open access	31 Aug 2024	7
20	Extremely Large Exposure Field With Fine Resolution Lithography Technology To Enable Next Generation Panel Level Advanced Packaging John Chang, Timothy N. Chang, Casey Donaher et al. Conference paper	Jun 2021	7
21	Nano Horizons: Exploring the untapped power of two-Dimensional materials Junyoung Kim, Anuj Kumar, Sanket D. Bhoyate et al. · Materials Science and Engineering B	9 Sep 2024	6
22	A new species of Trimma of the T. taylori species group (Teleostei: Gobiidae) from the Red Sea, Indian Ocean Richard Winterbottom, SERGEY V. BOGORODSKY, Tilman J. Alpermann · Zootaxa Open access	9 Oct 2023	6
23	Adaptive Shot Technology To Address Severe Lithography Challenges For Advanced FOPLP John Chang, Keith Best, Jian John Lu et al. Conference paper	Jun 2020	6
24	Analysis of Pattern Distortion by Panel Deformation and Addressing it by Using Extremely Large Exposure Field Fine-Resolution Lithography John Chang, Corey Shay, James Edric Alan Webb et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Conference paper	May 2022	5
25	In vitro and in sacco digestibility of almond hulls K.L. Swanson, H.M. Bill, J. Asmus et al. · The Journal of Agricultural Science Open access	Sep 2021	5
26	Yield Prediction Technology a Game Changer for Cutting Costs and Reducing Ramp Time in FOPLP Lithography John Chang, Keith Best, Jian John Lu et al. Conference paper	27 May 2025	4
27	Overlay Challenges of Extremely Large Exposure Field, Fine Resolution Lithography Due to Alignment Solution Errors and a Solution Using Early Zone Corrections in Advanced IC Substrates John Chang, Xing Song, Timothy N. Chang et al. Conference paper	28 May 2024	4
28	Nutrient composition and total-tract apparent digestibility of whole tomato seeds by sheep Jennifer M. Heguy, C.A. Cassinerio, J.G. Fadei et al. · The Professional Animal Scientist Open access	Oct 2015	4
29	Superlattice effects and limitations of non-destructive measurement of advanced Si/Si1−xGex superlattice structures using Mueller matrix scatterometry and high-resolution X-ray diffraction Ezra Mel B. Pasikatan, G. A. Antonelli, Nicholas A. Keller et al. · Journal of Micro/Nanopatterning Materials and Metrology Open access	6 Nov 2024	3
30	Characteristic Mueller matrix responses and correlation analysis for vertical GAA nanowire structure manufacturing using RCWA simulated spectra Colin Wadsworth, Ezra Mel B. Pasikatan, Nick Keller et al. Conference paper	18 Apr 2023	3
31	Novel inline on-device measurement of silicon nitride lateral recess post channel hole etch with IRCD metrology Nicholas A. Keller, Wenmei Ming, Zhuo Chen et al. · Metrology, Inspection, and Process Control XXXVI Conference paper	26 May 2022	3
32	Non-destructive measurement of bottom width in deep trench isolation structures using IRCD metrology Nick Keller, Marc Poulingue, Ross Grynko et al. Conference paper	10 Apr 2024	2
33	3D NAND Oxide/Nitride Tier Stack Thickness Measurements with Infrared Metrology Youcheng Wang, Zhuo Chen, Cong Wang et al. Conference paper	May 2023	2
34	Characterization of asymmetries in 3D NAND memory devices Jie Li, Shashank Srivastava, Joyce Li et al. Conference paper	27 Apr 2023	2
35	Decorrelation of optical critical dimensions in mid-infrared ellipsometric spectroscopy of high aspect ratio etch profiles Ahmad K. Fumani, Bin Yan, Nick Keller et al. · Journal of Micro/Nanopatterning Materials and Metrology	4 Apr 2022	2
36	Advanced Outlier Die Control Technology in Fan-Out Panel Level Packaging Using Feedforward Lithography John Chang, Jian John Lu, Burhan Ali Conference paper	Jun 2021	2
37	Scatterometry of nanowire/ nanosheet FETs for advanced technology nodes Madhulika S. Korde, Subhadeep Kal, Cheryl Alix et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV Conference paper	19 Feb 2021	2
38	The Adoption of Machine Learning in the Measurement of Copper Contact on the Main Chip in Advanced 3D NAND Technology Nodes Michael Meng, Albert P. Li, J. Andrew Zhang et al. Conference paper	Aug 2020	2
39	OO process and metrics for effort estimation Dennis de Champeaux, Simon Horner, Granville G. Miller Conference paper	Oct 1995	2
40	DBDesigner Shuguang Hong, Joshua Duhl, Craig R. Harris · Journal of Database Management	Jul 1992	2
41	From Pilot To HVM: A Practical Overlay Yield Prediction Workflow For FOPLP Lithography John Chang, Jian Lu, Timothy Chang Conference paper	14 Apr 2026	1
42	Frequency stabilization and referencing of a mid-infrared dual-comb spectrometer Chu C. Teng, Yifeng Chen, Jie Liu et al. · Applied Physics B Open access	13 Feb 2026	1
43	Non-destructive lateral cavity etch measurements of 8-superlattice layer nanowire test structures using optical Mueller matrix spectroscopic ellipsometry, x-ray diffraction, and x-ray fluorescence Ezra Mel B. Pasikatan, G. A. Antonelli, Nicholas A. Keller et al. · Journal of Applied Physics Open access	27 Oct 2025	1
44	Advanced Post Overlay Compensation for Enhanced Lithography Overlay Accuracy for Next-Generation AICS Packaging John Chang, Keith Best, Xin Song et al. Conference paper	15 Apr 2025	1
45	3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology Youcheng Wang, Zhuo Chen, Cong Wang et al. · IEEE Transactions on Semiconductor Manufacturing	3 Jun 2024	1
46	Superlattice effects and limitations of non-destructive measurement of advanced Si/Si(1-x)Ge(x) superlattice structures using Mueller matrix scatterometry (MMSE) and high-resolution x-ray diffraction (XRD) Ezra Mel B. Pasikatan, G. A. Antonelli, Nicholas A. Keller et al. Conference paper	10 Apr 2024	1
47	Using deep learning ADC for defect classification for automatic defect inspection HuaChiang Chi, Andy Chen, Jay Chen et al. Conference paper	23 Feb 2024	1
48	Applications of Picosecond Laser Acoustics to Power Semiconductor Device: IGBT and MOSFET Johnny Dai, Cheolkyu Kim, Priya Mukundhan Conference paper	26 Jun 2023	1
49	In situ spectroscopic ellipsometry and rigorous coupled wave analysis for real time profile evolution of atomic layer deposited films inside SiO2 nanotrenches S. Novia Berriel, Corbin Feit, Nick Keller et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films	30 Sep 2022	1
50	Methods to overcome limited labeled data sets in machine learning-based optical critical dimension metrology Franklin J. Wong, Yudong Hao, Wenmei Ming et al. · Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV Conference paper	19 Feb 2021	1

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.