Most cited papers from Semikron (Germany)

Semikron (Germany)

What are the most cited papers from Semikron (Germany)?

The most cited paper from Semikron (Germany) is "Reliability challenges of automotive power electronics" (Uwe Scheuermann, 2009), with 115 citations. Next come "SKiN: Double side sintering technology for new packages" (94) and "Power cycling results for different control strategies" (91).

Published TypeFieldAccess

Showing 50 of 58 papers. Every paper with more than 6 citations is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	Reliability challenges of automotive power electronics Uwe Scheuermann · Microelectronics Reliability	3 Aug 2009	115
2	SKiN: Double side sintering technology for new packages Thomas Stockmeier, Peter Beckedahl, Christian Gobl et al. Conference paper	May 2011	94
3	Power cycling results for different control strategies Uwe Scheuermann, S.C. Schuler · Microelectronics Reliability	15 Aug 2010	91
4	Using the chip as a temperature sensor — The influence of steep lateral temperature gradients on the V ce (T)-measurement Ralf Schmidt, Uwe Scheuermann · European Conference on Power Electronics and Applications Conference paper	6 Oct 2009	84
5	From Packaging to "Un"-Packaging - Trends in Power Semiconductor Modules Thomas Stockmeier Conference paper	May 2008	59
6	Impact of load pulse duration on power cycling lifetime of Al wire bonds Uwe Scheuermann, Ralf Schmidt · Microelectronics Reliability	17 Jul 2013	57
7	Method for electrical detection of bond wire lift-off for power semiconductors J. Lehmann, M. Netzel, R. Herzer et al. Conference paper	Mar 2004	54
8	Separating Failure Modes in Power Cycling Tests Ralf Schmidt, Uwe Scheuermann · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) Conference paper	6 Mar 2012	53
9	Parasitic Capacitive Couplings in Medium Voltage Power Electronic Systems: An Overview Benjamin Futtrup Kjærsgaard, Gao Liu, Morten Rahr Nielsen et al. · IEEE Transactions on Power Electronics Open access	24 Apr 2023	51
10	Impact of absolute junction temperature on power cycling lifetime Ralf Schmidt, Felix Zeyss, Uwe Scheuermann Conference paper	Sep 2013	44
11	Impact of load pulse duration on power cycling lifetime of chip interconnection solder joints M. Junghaenel, Uwe Scheuermann · Microelectronics Reliability	8 Jul 2017	39
12	The Road to the Next Generation Power Module - 100% Solder Free Design Uwe Scheuermann, Peter Beckedahl	11 Mar 2008	39
13	Exact inductive parasitic extraction for analysis of IGBT parallel switching including DCB-backside eddy currents B. Gutsmann, P. Mourick, Dieter Silber Conference paper	8 Nov 2002	36
14	Novel wire bond material for advanced power module packages Ralf Schmidt, Claus König, Peter Prenosil · Microelectronics Reliability	21 Jul 2012	36
15	Packaging and Reliability of Power Devices Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann et al. Book chapter	2010	30
16	Impact of device technology on cosmic ray failures in power modules Uwe Scheuermann, Uwe Schilling · IET Power Electronics	31 May 2016	29
17	600V SOI Gate Driver IC with advanced level shifter concepts for medium and high power applications Matthias Roßberg, Bastian Vogler, R. Herzer Conference paper	2007	28
18	Experimental study and simulations on two different avalanche modes in trench power MOSFETs I. Pawel, Ralf Siemieniec, M. Rösch et al. · IET Circuits Devices & Systems	18 Oct 2007	28
19	Plasma extraction transit time oscillations in bipolar power devices B. Gutsmann, P. Mourick, Dieter Silber · Solid-State Electronics	2002	27
20	Comparison of the Power Cycling Performance of Silicon and Silicon Carbide Power Devices in a Baseplate Less Module Package at Different Temperature Swings Felix Hoffmann, Nando Kaminski, S. Schmitt Conference paper	30 May 2021	25
21	Reliability of Planar SKiN Interconnect Technology Uwe Scheuermann · 2012 7th International Conference on Integrated Power Electronics Systems (CIPS) Conference paper	6 Mar 2012	25
22	Lifetime Modeling of SiC MOSFET Power Modules During Power Cycling Tests at Low Temperature Swings Felix Hoffmann, S. Schmitt, Nando Kaminski Conference paper	28 May 2023	20
23	Characterization of GaN-HEMT in cascode topology and comparison with state of the art-power devices Sven Buetow, R. Herzer Conference paper	May 2018	18
24	SiC MOS Power Module in Direct Pressed Die Technology and some Challenges for Implementation Igor Kasko, Sven E. Berberich, Matthias Spang et al. Conference paper	18 Aug 2020	15
25	High efficient approach to utilize SiC MOSFET potential in power modules Igor Kasko, Sven E. Berberich, Michael J. Gross et al. Conference paper	May 2017	15
26	Surface Modifications of Polyetheretherketone (PEEK): Results from the Literature and Special Studies of Copper-Coated Films Helmut Münstedt, Joern Grossmann · Polymers Open access	8 Nov 2022	14
27	Application of carrier lifetime control by irradiation to 1.2kV NPT IGBTs Ralf Siemieniec, R. Herzer, M. Netzel et al. Conference paper	13 Aug 2004	14
28	Integration of 1200V SOI gate driver ICs into a medium power IGBT module package Bastian Vogler, Matthias Roßberg, R. Herzer et al. · International Symposium on Power Semiconductor Devices and IC's Conference paper	6 Jun 2010	14
29	Differential-mode oscillations between parallel IGBTs in power modules Matthias Spang, Sven Buetow, G. Katzenberger Conference paper	Sep 2015	13
30	Investigation on the Impact of Environmental Stress on the Thermo-Mechanical Reliability of IGBTs by Means of Consecutive H3TRB and PCT Testing Felix Hoffmann, Nando Kaminski, S. Schmitt Conference paper	30 May 2021	12
31	Reliability and Reliability Testing Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann et al. Book chapterOpen access	2018	12
32	IGBT driver chipset for high power applications R. Herzer, S. Pawel, J. Lehmann Conference paper	25 Jun 2003	12
33	Explanation of IGBT Tail Current Oscillations by a Novel "Plasma Extraction Transit Time" Mechanism B. Gutsmann, Dieter Silber, P. Mourick Conference paper	2001	12
34	Reliability of pressure contacted intelligent integrated power modules Uwe Scheuermann Conference paper	25 Jun 2003	12
35	Packaging of Power Devices Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann et al. Book chapter	2018	11
36	Power Module Design without Solder Interfaces - an Ideal Solution for Hybrid Vehicle Traction Applications Uwe Scheuermann Conference paper	Feb 2009	11
37	Physical phenomena in Si power diodes operating at high carrier injection levels and high temperature Leonardo M. Hillkirk, Bo Breitholtz, Josef Lutz Conference paper	7 Nov 2002	11
38	A Novel Power Module Design and Technology for Improved Power Cycling Capability Uwe Scheuermann, E. Herr · Microelectronics Reliability	Sep 2001	11
39	Novel packaging technology for power modules Norbert Pluschke, Peter Beckedahl Conference paper	May 2012	11
40	Advanced power module packaging for increased operation temperature and power density Peter Beckedahl Conference paper	Sep 2012	10
41	Time resolved annealing of interface traps at the silicon oxide-silicon interface Edmund P. Burte · Journal of Applied Physics	15 Nov 1988	10
42	Investigation on the Impact of Thermo-Mechanical Stress on the Humidity Ruggedness of IGBTs by Means of Consecutive PCT and H3TRB Testing Felix Hoffmann, Michael Hanf, Nando Kaminski et al. Conference paper	18 Aug 2020	9
43	Current sharing between parallel IGBTs in power modules during short circuit with unsymmetrically connected load Matthias Spang, G. Katzenberger Conference paper	Sep 2016	9
44	Analysis of dynamic impatt oscillations caused by radiation induced deep centers Ralf Siemieniec, Josef Lutz, R. Herzer Conference paper	2 Mar 2004	9
45	Ultra high frequency oscillations in the reverse recovery current of fast diodes P. Mourick, B. Gutsmann, Dieter Silber Conference paper	25 Jun 2003	9
46	Discovery of Loss Imbalance in SiC Half-Bridge Power Modules – Analysis and Validations Benjamin Futtrup Kjærsgaard, Gao Liu, Thore Stig Aunsborg et al. · IEEE Transactions on Power Electronics Open access	21 Feb 2024	8
47	High power, high frequency SiC-MOSFET system with outstanding performance, power density and reliability Sven Buetow, R. Herzer, Gunter Koenigsmann et al. Conference paper	May 2017	8
48	Advanced SOI gate driver IC with integrated VCE-monitoring and negative turn-off gate voltage for medium power IGBT modules Bastian Vogler, R. Herzer, Sven Buetow et al. Conference paper	Jun 2014	8
49	Semiconductor Properties Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann et al. Book chapter	2018	7
50	Gate Driver Solutions for Modern Power Devices and Topologies R. Herzer Conference paper	Sep 2018	7

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.