Institution · SPTS Technologies (United Kingdom)
Most cited papers from SPTS Technologies (United Kingdom)
What are the most cited papers from SPTS Technologies (United Kingdom)?
The most cited paper from SPTS Technologies (United Kingdom) is "Electric discharge in water as a source of UV radiation, ozone and hydrogen peroxide" (A. M. Anpilov, É. M. Barkhudarov, Yu B Bark et al., 2001), with 173 citations. Next come "Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery" (138) and "Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process" (92).
Showing 50 of 77 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Electric discharge in water as a source of UV radiation, ozone and hydrogen peroxide A. M. Anpilov, É. M. Barkhudarov, Yu B Bark et al. · Journal of Physics D Applied Physics | 14 Mar 2001 | 173 |
| 2 | Hollow silicon microneedle fabrication using advanced plasma etch technologies for applications in transdermal drug delivery Chris Bolton, Olivia Howells, Gareth J. Blayney et al. · Lab on a Chip | 2020 | 138 |
| 3 | Design, fabrication, and characterisation of a silicon microneedle array for transdermal therapeutic delivery using a single step wet etch process Olivia Howells, Gareth J. Blayney, Benedetta Gualeni et al. · European Journal of Pharmaceutics and Biopharmaceutics | 16 Jun 2021 | 92 |
| 4 | Pulsed high voltage electric discharge disinfection of microbially contaminated liquids A. M. Anpilov, É. M. Barkhudarov, N. Christofi et al. · Letters in Applied Microbiology | Jul 2002 | 71 |
| 5 | Minimally invasive and targeted therapeutic cell delivery to the skin using microneedle devices Benedetta Gualeni, Siôn A. Coulman, D. Shah et al. · British Journal of Dermatology | 2 Sep 2017 | 66 |
| 6 | Extreme Wafer Thinning and nano-TSV processing for 3D Heterogeneous Integration Anne Jourdain, Filip Schleicher, Joeri De Vos et al. | Jun 2020 | 64 |
| 7 | Integrated approach to electrode and AlN depositions for bulk acoustic wave (BAW) devices Rajkumar Jakkaraju, Guido Henn, Cameron James Shearer et al. · Microelectronic Engineering | 7 Jul 2003 | 48 |
| 8 | Low temperature PECVD of dielectric films for TSV applications Daniel Archard, K. Giles, Andrew J. Price et al. | 2010 | 43 |
| 9 | Investigation of the 4H–SiC surface Owen James Guy, Michal Lodzinski, Kar Seng Teng et al. · Applied Surface Science | 24 Mar 2008 | 31 |
| 10 | Deep SiO2etching with Al and AlN masks for MEMS devices Vladimir N. Bliznetsov, Huamao Lin, Yue Jia Zhang et al. · Journal of Micromechanics and Microengineering | 22 Jul 2015 | 30 |
| 11 | Advanced deep reactive‐ion etching technology for hollow microneedles for transdermal blood sampling and drug delivery Yufei Liu, P. F. Eng, Owen James Guy et al. · IET Nanobiotechnology | Jun 2013 | 30 |
| 12 | Characterization of Extreme Si Thinning Process for Wafer-to-Wafer Stacking Fumihiro Inoue, Anne Jourdain, Joeri De Vos et al. | May 2016 | 25 |
| 13 | Parameterization of Metallic Grids on Transparent Conductive Electrodes for the Scaling of Organic Solar Cells Gregory Burwell, Nicholas Burridge, Eloise Bond et al. · Advanced Electronic Materials | 3 May 2021 | 23 |
| 14 | The effectiveness of a multi-spark electric discharge system in the destruction of microorganisms in domestic and industrial wastewaters A. M. Anpilov, É. M. Barkhudarov, N. Christofi et al. · Journal of Water and Health | Dec 2004 | 21 |
| 15 | A new plasma source for next generation MEMS deep Si etching: Minimal tilt, improved profile uniformity and higher etch rates Richard I. Barnett, Dave W. P. Thomas, Yiping Song et al. | 2010 | 20 |
| 16 | Demonstration of a collective hybrid die-to-wafer integration using glass carrier Samuel Suhard, Koen Kennes, Pieter Bex et al. | Jun 2021 | 18 |
| 17 | Extreme wafer thinning optimization for via-last applications Anne Jourdain, Joeri De Vos, Fumihiro Inoue et al. | Nov 2016 | 18 |
| 18 | Metal Grid Structures for Enhancing the Stability and Performance of Solution‐Processed Organic Light‐Emitting Diodes Gregory Burwell, Nicholas Burridge, Oskar J. Sandberg et al. · Advanced Electronic Materials | 9 Nov 2020 | 17 |
| 19 | RIE dynamics for extreme wafer thinning applications Nouredine Rassoul, Anne Jourdain, Nina Tutunjyan et al. · Microelectronic Engineering | 4 Feb 2018 | 17 |
| 20 | Refractive index graded anti-reflection coating for solar cells based on low cost reclaimed silicon Yufei Liu, Owen James Guy, Jash H. Patel et al. · Microelectronic Engineering | 14 Mar 2013 | 17 |
| 21 | Evaluation of Ta and TaN-based Cu diffusion barriers deposited by Advanced Hi-Fill (AHF) sputtering onto blanket wafers and high aspect ratio structures Stephen Burgess, H Donohue, Keith Buchanan et al. · Microelectronic Engineering | Oct 2002 | 15 |
| 22 | Plasma Dicing 300mm Framed Wafers — Analysis of Improvement in Die Strength and Cost Benefits for Thin Die Singulation Richard I. Barnett | May 2017 | 14 |
| 23 | An investigation of spark discharge parameters for material processing with high power ultrasound Mark P. Wilson, L. Balmer, M.J. Given et al. · Minerals Engineering | 7 Jun 2007 | 14 |
| 24 | Dielectric stack engineering for via-reveal passivation Kath Crook, Mark Carruthers, Daniel Archard et al. | May 2013 | 13 |
| 25 | Considerations and benefits of plasma etch based wafer dicing Richard I. Barnett, Oliver Ansell, Dave W. P. Thomas | Dec 2013 | 12 |
| 26 | Texture and hillocking in sputter-deposited copper thin films Rajkumar Jakkaraju, Alan Lindsay Greer · Journal of Materials Science Materials in Electronics | May 2002 | 12 |
| 27 | Integration of fine-pitched Through-Silicon Vias and Integrated Passive Devices Dzafir Shariff, Pandi Chelvam Marimuthu, Ken Hsiao et al. | May 2011 | 9 |
| 28 | Low resistivity α-tantalum in Cu/CVD low-k (Orion™) integration H Donohue, J.C. Yeoh, K. Giles et al. · Microelectronic Engineering | Oct 2002 | 9 |
| 29 | Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications Anne Jourdain, Joeri De Vos, Nouredine Rassoul et al. | May 2018 | 8 |
| 30 | Plasma etch and low temperature PECVD processes for via reveal applications Dave W. P. Thomas, Keith Buchanan, Hefin Griffiths et al. | May 2012 | 8 |
| 31 | A Rapid Graphene Sensor Platform for the Detection of Viral Proteins in Low Volume Samples Ffion Walters, Gregory Burwell, Jacob John Mitchell et al. · Advanced NanoBiomed Research | 22 Mar 2022 | 7 |
| 32 | Dicing Tape Performance in a Plasma Dicing Environment Stewart Fulton, Oliver Ansell, Janet Hopkins et al. | Dec 2018 | 7 |
| 33 | High Precision Etching of Si/SiO[sub 2] on a High-Density Helicon Etcher for Nanoscale Devices L. Dreeskornfeld, J. Hartwich, Johannes Kretz et al. · Journal of The Electrochemical Society | 2003 | 7 |
| 34 | Improvements in TiWN barrier technology for devices using Au metallisation S. H. Hong, Jacintha N O'Sullivan, Magnus Jönsson et al. · Microelectronic Engineering | Oct 2002 | 7 |
| 35 | Electrical Characterization of Low Temperature PECVD Oxides for TSV Applications Piotr Mackowiak, Rachid Abdallah, Martin Wilke et al. · IMAPSource Proceedings | Oct 2018 | 6 |
| 36 | Etch, dielectrics and metal barrier-seed for low temperature through-silicon via processing Keith Buchanan, Stephen Burgess, K. Giles et al. | Sep 2009 | 6 |
| 37 | Room temperature magnetoresistance in CoFeB/SrTiO3/CoFeB magnetic tunnel junctions deposited by ion beam sputtering E. M. J. Hassen, B. Viala, M. C. Cyrille et al. · Journal of Applied Physics | 15 Mar 2012 | 6 |
| 38 | 300mm Full Thickness Si-Based IC Singulation Using Plasma Dicing for Advanced Packaging Technologies R. Surapaneni, B. S. Hamlin, Julia J. Chiu et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) | May 2022 | 5 |
| 39 | Water Washable Coatings for Plasma Dicing Processes Matthew Day, Larry Sirois, Stuart Erickson et al. | Dec 2019 | 5 |
| 40 | Metal lift-off using physical vapour deposition J. B. O’Sullivan, Stephen Burgess, N. Rimmer · Microelectronic Engineering | Oct 2002 | 5 |
| 41 | WAFER-LEVEL HIGH-ASPECT-RATIO DEEP REACTIVE ION ETCHING OF 4H-SILICON CARBIDE ON INSULATOR SUBSTRATES Ardalan Lotfi, Micheal Hardin, Zhenming Liu et al. | 5 Jun 2022 | 4 |
| 42 | Fan-Out Wafer Processing In The High Density Packaging Era David Butler, Christopher J. Jones, Steve Burgess et al. | Oct 2018 | 4 |
| 43 | Advanced Hi-Fill® for interconnect liner applications Norbert Urbansky, Stephen Burgess, Sven Schmidbauer et al. · Microelectronic Engineering | Oct 2002 | 4 |
| 44 | Productivity challenges in PVD processing in 300mm pilot lines for power semiconductors A. Rastogi, Norman J. Morin, Christopher J. Jones et al. | May 2015 | 4 |
| 45 | A comparative study of long short-term memory based long-term electrical load forecasting techniques with hyperparameter optimization Geetha Mani, Suresh Seetharaman, Jothinathan Kandasamy et al. · International Journal of Power Electronics and Drive Systems/International Journal of Electrical and Computer Engineering | 3 Oct 2024 | 3 |
| 46 | A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind Roland Mumford, Janet Hopkins, Owen James Guy · IEEE Transactions on Semiconductor Manufacturing | 13 Mar 2023 | 3 |
| 47 | Improved Semiconductor Device Reliability from Plasma Dicing Richard I. Barnett, Janet Hopkins, Stewart Fulton et al. | Oct 2019 | 3 |
| 48 | UBM/RDL Deposition by PVD for FOWLP in High Volume Production Christopher J. Jones, Steve Burgess, Tony Wilby et al. | May 2018 | 3 |
| 49 | Novel end-point solution for improvement in die strength and yields with plasma dicing after grind in volume production Richard I. Barnett, Oliver Ansell, Martin Hanicenic et al. | Dec 2017 | 3 |
| 50 | Impact of backside processing on C-V characteristics of TSV capacitors in 3D stacked IC process flows Joeri De Vos, Michele Stucchi, Anne Jourdain et al. | Dec 2015 | 3 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.