Institution · SUSS MicroTec (Germany)
Most cited papers from SUSS MicroTec (Germany)
What are the most cited papers from SUSS MicroTec (Germany)?
The most cited paper from SUSS MicroTec (Germany) is "VNA calibration" (Andrej Rumiantsev, Nick Ridler, 2008), with 190 citations. Next come "UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing" (146) and "Formation of precise 2D Au particle arrays via thermally induced dewetting on pre-patterned substrates" (113).
Showing 50 of 60 papers. Every paper with more than 6 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | VNA calibration Andrej Rumiantsev, Nick Ridler · IEEE Microwave Magazine | 15 May 2008 | 190 |
| 2 | UV enhanced substrate conformal imprint lithography (UV-SCIL) technique for photonic crystals patterning in LED manufacturing Ran Ji, Michael Hornung, Marc A. Verschuuren et al. · Microelectronic Engineering | 30 Nov 2009 | 146 |
| 3 | Formation of precise 2D Au particle arrays via thermally induced dewetting on pre-patterned substrates Dong Wang, Ran Ji, Peter Schaaf · Beilstein Journal of Nanotechnology | 22 Jun 2011 | 113 |
| 4 | Advanced mask aligner lithography: new illumination system Reinhard Voelkel, Uwe Vogler, A. Bich et al. · Optics Express | 17 Sep 2010 | 92 |
| 5 | Ordered arrays of nanoporous gold nanoparticles Dong Wang, Ran Ji, Arne Albrecht et al. · Beilstein Journal of Nanotechnology | 13 Sep 2012 | 61 |
| 6 | A novel micromachining technology for structuring borosilicate glass substrates Peter W. Merz, Hans-Joachim Quenzer, Helmut Bernt et al. | 2003 | 59 |
| 7 | Comparison of on-wafer multiline TRL and LRM+ calibrations for RF CMOS applications Andrej Rumiantsev, Susan L. Sweeney, Phillip L. Corson | Dec 2008 | 45 |
| 8 | Full wafer microlens replication by UV imprint lithography Holger Schmitt, Mathias Rommel, Anton J. Bauer et al. · Microelectronic Engineering | 19 Nov 2009 | 36 |
| 9 | Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. | 2012 | 35 |
| 10 | Ordered arrays of nanoporous silicon nanopillars and silicon nanopillars with nanoporous shells Dong Wang, Ran Ji, Song Du et al. · Nanoscale Research Letters | 21 Jan 2013 | 33 |
| 11 | Verification of the wafer-level LRM+ calibration technique for GaAs applications up to 110 GHz R. Doemer, Andrej Rumiantsev | 30 Aug 2005 | 30 |
| 12 | High resolution 3D NanoImprint technology: Template fabrication, application in Fabry–Pérot-filter-array-based optical nanospectrometers Xiaolin Wang, Alla Albrecht, Hanh H. Mai et al. · Microelectronic Engineering | 4 May 2013 | 30 |
| 13 | Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer Koen Kennes, Alain Phommahaxay, Alice Guerrero et al. | Jun 2020 | 29 |
| 14 | Applying the calibration comparison technique for verification of transmission line standards on silicon up to 110 GHz Andrej Rumiantsev, Phillip L. Corson, Susan L. Sweeney et al. | Jun 2009 | 25 |
| 15 | The Growing Application Field of Laser Debonding: From Advanced Packaging to Future Nanoelectronics Alain Phommahaxay, Gerald Beyer, Iuliana P. Radu et al. | Oct 2019 | 23 |
| 16 | Low-Temperature Wafer Bonding for MEMS Hermetic Packaging Using Sub-micron Au Particles Hiroyuki Ishida, Toshinori Ogashiwa, Takuya Yazaki et al. · Transactions of The Japan Institute of Electronics Packaging | 2010 | 23 |
| 17 | The influence of calibration substrate boundary conditions on CPW characteristics and calibration accuracy at mm-wave frequencies Andrej Rumiantsev, Ralf Doerner, Edward M. Godshalk | Dec 2008 | 22 |
| 18 | Atmospheric-pressure plasma pretreatment for direct bonding of silicon wafers at low temperatures Marko Eichler, Benedikt Michel, Michael J. K. Thomas et al. · Surface and Coatings Technology | 12 Jun 2008 | 22 |
| 19 | Calibration Standards Verification Procedure Using the Calibration Comparison Technique Andrej Rumiantsev, Ralf Doerner, Steffen Thies | Sep 2006 | 20 |
| 20 | Advanced technique for broadband on-wafer rf device characterization R. Scholz, Falk Korndorfer, Biswanath Senapati et al. | 2004 | 19 |
| 21 | Al-Ge Eutectic Wafer Bonding and Bond Characterization for CMOS Compatible Wafer Packaging Sumant Sood, Shari N. Farrens, Ron Pinker et al. · ECS Transactions | Oct 2010 | 19 |
| 22 | Novel organic polymer for UV-enhanced substrate conformal imprint lithography R. Fader, Holger Schmitt, Mathias Rommel et al. · Microelectronic Engineering | 20 Jul 2012 | 18 |
| 23 | Contact and proximity lithography using 193nm Excimer laser in Mask Aligner Stefan Partel, Sandra Zoppel, Peter Hudek et al. · Microelectronic Engineering | 7 Dec 2009 | 18 |
| 24 | Advanced mask aligner lithography (AMALITH) Reinhard Voelkel, Uwe Vogler, Arianna Bramati et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 20 Feb 2012 | 17 |
| 25 | Extremely Low-Force Debonding of Thinned CMOS Substrate by Laser Release of a Temporary Bonding Material Alain Phommahaxay, Goedele Potoms, Greet Verbinnen et al. | May 2016 | 17 |
| 26 | Permanent Wafer Bonding and Temporary Wafer Bonding / De-Bonding Technology Using Temperature Resistant Polymers Hiroyuki Ishida, Stefan Lutter · Journal of Photopolymer Science and Technology | 2014 | 17 |
| 27 | Acoustic modulation during laser debonding of collective hybrid bonded dies Koen Kennes, Alain Phommahaxay, Alice Guerrero et al. | Jun 2021 | 16 |
| 28 | Wafer direct bonding with ambient pressure plasma activation Markus Gabriel, Brad Johnson, Ralf Suss et al. · Microsystem Technologies | 2 Mar 2006 | 16 |
| 29 | W2W permanent stacking for 3D system integration Lan Peng, Soon-Wook Kim, Michael R. Soules et al. | Dec 2014 | 16 |
| 30 | Evaluation of Ta-Co alloys as novel high-k extreme ultraviolet mask absorber Devesh Thakare, Meiyi Wu, Karl Opsomer et al. · Journal of Micro/Nanopatterning Materials and Metrology | 21 Jun 2023 | 14 |
| 31 | Carrier Systems for Collective Die-to-Wafer Bonding Koen Kennes, Alain Phommahaxay, Alice Guerrero et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) | May 2022 | 14 |
| 32 | Low-Temperature Direct Bonding of Borosilicate, Fused Silica, and Functional Coatings Marko Eichler, Benedikt Michel, Philipp Hennecke et al. · ECS Transactions | Oct 2010 | 14 |
| 33 | Mask aligner lithography simulation – From lithography simulation to process validation Kristian Motzek, Stefan Partel, Arianna Bramati et al. · Microelectronic Engineering | 27 Jul 2012 | 13 |
| 34 | Detection of Interfacial Gas Bubbles in Wafer Bonded Silicon with Different Surface Treatments Gavin P. Horn, Markus Gabriel, Jon R. Lesniak et al. · Journal of The Electrochemical Society | 25 Nov 2008 | 12 |
| 35 | Accuracy of wafer level alignment with substrate conformal imprint lithography R. Fader, Mathias Rommel, Anton J. Bauer et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena | 4 Oct 2013 | 12 |
| 36 | Optimization of illumination pupils and mask structures for proximity printing Kristian Motzek, A. Bich, Andreas A. Erdmann et al. · Microelectronic Engineering | 3 Nov 2009 | 11 |
| 37 | Full wafer integration of NEMS on CMOS by nanostencil lithography Julien Arcamone, Marc A. F. van den Boogaart, Francisco Serra-Graells et al. | 2006 | 10 |
| 38 | Thin Wafer Handling Challenges and Emerging Solutions Shari N. Farrens, Peter Bisson, Sumant Sood et al. · ECS Transactions | 9 Mar 2010 | 10 |
| 39 | Computational algorithms for optimizing mask layouts in proximity printing Kristian Motzek, Uwe Vogler, Marc Hennemeyer et al. · Microelectronic Engineering | 6 Dec 2010 | 10 |
| 40 | C4NP Technology for Lead Free Solder Bumping Eric Laine, Eric D. Perfecto, Barrie Campbell et al. | 2007 | 10 |
| 41 | High quality diffractive optical elements (DOEs) using SMILE imprint technique Simon Drieschner, Fabian Kloiber, Marc Hennemeyer et al. · Advanced Optical Technologies | 25 Jan 2021 | 9 |
| 42 | Spray coating - a solution for resist film deposition across severe topography Karl F. Fischer, Roméo Suss | 4 Oct 2004 | 9 |
| 43 | Process characterization of thin wafer debonding with thermoplastic materials Alain Phommahaxay, Anne Jourdain, Greet Verbinnen et al. · 2012 4th Electronic System-Integration Technology Conference | Sep 2012 | 9 |
| 44 | Advanced on-wafer multiport calibration methods for mono- and mixed-mode device characterization Holger Heuermann, Andrej Rumiantsev, Steffen Schott | 2004 | 9 |
| 45 | Verification of wafer-level calibration accuracy at cryogenic temperatures Andrej Rumiantsev, Ralf Doerner, P. Sakalas | Nov 2006 | 8 |
| 46 | Investigation of EUVL reticle capping layer peeling under wet cleaning Sherjang Singh, Davide Dattilo, Uwe U. Dietze et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 3 Oct 2013 | 8 |
| 47 | Efficient ozone, sulfate, and ammonium free resist stripping process Davide Dattilo, Uwe U. Dietze · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 28 Jul 2014 | 8 |
| 48 | Ruthenium capping layer preservation for 100X clean through pH driven effects Davide Dattilo, Uwe U. Dietze, Jyh-Wei Hsu · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE | 23 Oct 2015 | 8 |
| 49 | ZnO/porous-Si and TiO2/porous-Si nanocomposite nanopillars Dong Wang, Yong Gang Yan, Peter Schaaf et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films | 25 Jul 2014 | 8 |
| 50 | Full Field Nanoimprint on Mask Aligners Using Substrate Conformal Imprint Lithography Technique Ran Ji, Andreas Jørstad Krüger, Michael Hornung et al. · Acta Physica Polonica A | Dec 2009 | 8 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.