Most cited papers from Tezzaron Semiconductor (United States)
What are the most cited papers from Tezzaron Semiconductor (United States)?
The most cited paper from Tezzaron Semiconductor (United States) is "Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs" (Robert Patti, 2006), with 604 citations. Next come "Exploring DRAM organizations for energy-efficient and resilient exascale memories" (59) and "Fully 3-D Integrated Pixel Detectors for X-Rays" (34).
Showing 17 of 17 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs Robert Patti · Proceedings of the IEEE | Jun 2006 | 604 |
| 2 | Exploring DRAM organizations for energy-efficient and resilient exascale memories Bharan Giridhar, Michael Cieslak, Deepankar Duggal et al. | 30 Oct 2013 | 59 |
| 3 | Fully 3-D Integrated Pixel Detectors for X-Rays Grzegorz W. Deptuch, Gabriella A. Carini, P.M. Enquist et al. · IEEE Transactions on Electron Devices | 27 Jul 2015 | 34 |
| 4 | Interconnect design and analysis for Through Silicon Interposers (TSIs) Joseph Romen Cubillo, Roshan Weerasekera, Zaw Zaw Oo et al. | 2012 | 28 |
| 5 | A novel chip-to-wafer (C2W) three-dimensional (3D) integration approach using a template for precise alignment Qianwen Chen, Dingyou Zhang, Zheng Guang Xu et al. · Microelectronic Engineering | 24 Apr 2011 | 18 |
| 6 | Homogeneous 3D Integration Robert Patti | 17 Nov 2010 | 10 |
| 7 | Q-band InP/CMOS receiver and transmitter beamformer channels fabricated by 3D heterogeneous integration A.D. Carter, Miguel E. Urteaga, Zach Griffith et al. | Jun 2017 | 7 |
| 8 | Through-Silicon Interposer (TSI) co-design optimization for high performance systems Joseph Romen Cubillo, Roshan Weerasekera, Guruprasad Katti et al. | Dec 2012 | 6 |
| 9 | Through-Silicon-Vias (TSVs) for 3D readout of ASIC for nearly gapless CdZnTe detector arrays Jaesub Hong, Branden E. Allen, J. E. Grindlay et al. | 15 Sep 2017 | 4 |
| 10 | Advances in 3D Memory and Logic Devices Robert Patti · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | 2010 | 4 |
| 11 | Advances in 3D integrated circuits Robert Patti | 22 Mar 2011 | 3 |
| 12 | New Advances in 3D/2.5D Integration Robert Patti · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | 2012 | 2 |
| 13 | 2.5D and 3D Integration Technology Update Robert Patti · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | 2014 | 2 |
| 14 | 3D integrated circuits: Designing in a new dimension: Designer track Robert Patti · International Conference on Computer Aided Design | 24 Dec 2012 | 2 |
| 15 | High density backside tungsten TSV for 3D stacked ICs Reynard Blasa, Brian A. Mattis, Dave Martini et al. | Nov 2016 | 1 |
| 16 | 3D Memory Robert Patti · Integrated circuits and systems | 2008 | 0 |
| 17 | Lessons Learned from 3D-IC MPW Runs Robert Patti · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) | 2011 | 0 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.