| 1 |
Single-shot velocity-map imaging of attosecond light-field control at kilohertz rate
Frederik Süßmann, Sergey V. Zherebtsov, J. Plenge et al. · Review of Scientific Instruments
Open access |
Sep 2011 |
43 |
| 2 |
Mercury-free high pressure discharge lamps dominated by molecular radiation
M. Käning, L. Hitzschke, B Schalk et al. · Journal of Physics D Applied Physics
|
12 May 2011 |
16 |
| 3 |
A Parametric Simulative Study for Lifetime Prediction of Sintered Silver Die Attach Under Different Accelerated Testing Conditions
Freerik Forndran, Jens Heilmann, Martin Metzler et al.
Conference paper |
19 Apr 2021 |
9 |
| 4 |
Weld Classification With Feature Extraction by FRESH Algorithm Based on Surface Topographical Optical Coherence Tomography Data for Laser Welding of Copper
Thomas Will, Jannis Kohl, Silvana Burger et al. · IEEE Access
Open access |
2022 |
6 |
| 5 |
Determination of Rate- and Temperature Dependent Inelastic Material Data for Sintered Silver Die Attach and Simulative Implementation
Freerik Forndran, Jens Heilmann, Martin Metzler et al.
Conference paper |
20 Apr 2022 |
6 |
| 6 |
Hard encapsulation of automotive power modules by epoxy potting – encapsulant selection assisted by thermo-mechanical simulation
Mario Sprenger, Freerik Forndran, Brigitte Ottinger et al.
Conference paper |
20 Apr 2022 |
5 |
| 7 |
Cost Effective Fabrication of Large Diameter High Strength Titanium Catenary Riser
Agnes Marie Horn, Mons Hauge, Per-Arne Ro̸stadsand et al.
Conference paper |
2002 |
5 |
| 8 |
A Parametric Simulative Study for Si and SiC Semiconductor Devices Under Various Accelerated Testing Conditions Using Rate- and Temperature Dependent Inelastic Material Data
Freerik Forndran, Jens Heilmann, Martin Metzler et al.
Conference paper |
23 Sep 2021 |
4 |
| 9 |
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver
Freerik Forndran, Jens Heilmann, Markus Leicht et al. · Microelectronics Reliability
Open access |
21 Nov 2024 |
3 |
| 10 |
Parametric study on relevant design and material parameters for reliable hard encapsulation of automotive power modules
Mario Sprenger, Niklas Noll, Christoph Hecht et al. · 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)
Conference paper |
7 Dec 2022 |
3 |
| 11 |
Automotive Application Relevant Failure Mechanisms Under Cyclic Thermo-Mechanical Load
Matthias Hammerl, Freerik Forndran, Markus Leicht et al.
Conference paper |
2 Jun 2024 |
2 |
| 12 |
Modelling Warpage Behavior of Molded Power Modules for Electric Vehicles
Freerik Forndran, Mario Sprenger, Juan Ricardo Barrera et al.
Conference paper |
7 Apr 2024 |
2 |
| 13 |
Determination of Temperature Dependent Young’s Modulus of Sintered Silver (SAG) by Vibration Tests
Jens Heilmann, P. Türk, Freerik Forndran et al.
Conference paper |
7 Apr 2024 |
1 |
| 14 |
Warpage of transfer-molded automotive power modules – experimental characterization, numerical simulation and optimization
Mario Sprenger, M Krämer, E Tolyschew et al.
Conference paper |
17 Apr 2023 |
1 |
| 15 |
Reliability and Lifetime Estimation of Sintered Silver Die Attach for Different Accelerated Testing Conditions
Freerik Forndran, Jens Heilmann, Martin Metzler et al. · 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC)
Conference paper |
13 Sep 2022 |
1 |
| 16 |
Mikrovyučování jako prostor pro implementaci vrstevnického hodnocení do přípravy studentů učitelství
Lukáš Rokos · Pedagogická orientace
Open access |
11 Nov 2020 |
1 |
| 17 |
Modelling Creep Behaviour in Sintered Silver using User-Programmable Features in ANSYS
Freerik Forndran, Jens Heilmann, Martin Metzler et al.
Conference paper |
17 Apr 2023 |
0 |