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Institution · ASM (Japan)

Most cited papers from ASM (Japan)

What are the most cited papers from ASM (Japan)?

The most cited paper from ASM (Japan) is "EUV Lithography Technology for High-volume Production of Semiconductor Devices" (Junji Miyazaki, Anthony Yen, 2019), with 55 citations. Next come "Impacts of UV cure for reliable porous PECVD SiOC integration [IC interconnect applications]" (8) and "Selective Hemispherical Grained Polysilicon Transformation for 256 MB, 1 GB Dynamic Random Access Memory and Beyond" (5).

Showing 9 of 9 papers. Every paper is listed.

Most cited papers, sortable by citations and release date
#Paper
1 EUV Lithography Technology for High-volume Production of Semiconductor Devices Junji Miyazaki, Anthony Yen · Journal of Photopolymer Science and Technology Open access 24 Jun 2019 55
2 Impacts of UV cure for reliable porous PECVD SiOC integration [IC interconnect applications] Katsumi Yoneda, Muneharu Kato, Susumu Kondo et al. Conference paper 30 Aug 2005 8
3 Selective Hemispherical Grained Polysilicon Transformation for 256 MB, 1 GB Dynamic Random Access Memory and Beyond Majid Mansoori, Aritra Banerjee, Akito Shimizu et al. · Journal of The Electrochemical Society Oct 1999 5
4 Bottom-ARC optimization methodology for 0.25-μm lithography and beyond Maaike Op de Beeck, Geert Vandenberghe, Patrick Jaenen et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE Conference paper 29 Jun 1998 3
5 Growing low-temperature, high-quality silicon-dioxide films by neutral-beam enhanced atomic-layer deposition Yi-Ho Chen, Susumu Toko, Daisuke Ohori et al. · Journal of Physics D Applied Physics 26 Sep 2019 2
6 Evaluation of TiN hardmask films to prevent line wiggling due to plasma-induced film stress Amelia Turnquist, Naoyuki Kofuji, Joseph Sebastian et al. Conference paper May 2023 1
7 Low-k properties and integration processes enabling reliable interconnect scaling to the 32 nm technology node Atsushi Ikeda et al. Conference paper 2006 1
8 Optimization of pitch walking for Ti-based spacer integration in semi-damascene double patterning at MP18 Vincent Renaud, M.A. Neto, Sungdae Woo et al. Conference paper 9 Apr 2026 0
9 Scaled-down deposited underlayers for EUV lithography Mihir Gupta, Joao Antunes Afonso, Philippe Bézard et al. Conference paper May 2023 0

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.