Institution · Micralyne
Most cited papers from Micralyne
What are the most cited papers from Micralyne?
The most cited paper from Micralyne is "Microfabricated Device for DNA and RNA Amplification by Continuous-Flow Polymerase Chain Reaction and Reverse Transcription-Polymerase Chain Reaction with Cycle Number Selection" (Pierre J. Obeid, Theodore K. Christopoulos, H. John Crabtree et al., 2002), with 232 citations. Next come "Ferrofluid-based microchip pump and valve" (224) and "Continuous dielectrophoretic cell separation microfluidic device" (158).
Showing 32 of 32 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Microfabricated Device for DNA and RNA Amplification by Continuous-Flow Polymerase Chain Reaction and Reverse Transcription-Polymerase Chain Reaction with Cycle Number Selection Pierre J. Obeid, Theodore K. Christopoulos, H. John Crabtree et al. · Analytical Chemistry | 12 Dec 2002 | 232 |
| 2 | Ferrofluid-based microchip pump and valve Herb Hartshorne, C. Backhouse, William Lee · Sensors and Actuators B Chemical | 9 Apr 2004 | 224 |
| 3 | Continuous dielectrophoretic cell separation microfluidic device Youlan Li, Colin Dalton, H. John Crabtree et al. · Lab on a Chip | Dec 2006 | 158 |
| 4 | Microchip Injection and Separation Anomalies Due to Pressure Effects H. John Crabtree, Eric C. S. Cheong, Daryle A. Tilroe et al. · Analytical Chemistry | 4 Aug 2001 | 138 |
| 5 | Design of an interface to allow microfluidic electrophoresis chips to drink from the fire hose of the external environment Said Attiya, Abebaw B. Jemere, Thompson Tang et al. · Electrophoresis | 2001 | 100 |
| 6 | Capacitive Humidity Sensors With High Sensitivity and Subsecond Response Times John J. Steele, Glen A. Fitzpatrick, Michael J. Brett · IEEE Sensors Journal | 3 May 2007 | 75 |
| 7 | High fidelity, high yield production of microfluidic devices by hot embossing lithography: rheology and stiction Neil S. Cameron, Hélène Roberge, Teodor Veres et al. · Lab on a Chip | 2006 | 53 |
| 8 | Characterisation and comparison of microfluidic chips formed using abrasive jet micromachining and wet etching Amin Ghobeity, H. John Crabtree, Marcello Papini et al. · Journal of Micromechanics and Microengineering | 20 Jan 2012 | 51 |
| 9 | Double-SOI Wafer-Bonded CMUTs With Improved Electrical Safety and Minimal Roughness of Dielectric and Electrode Surfaces Peiyu Zhang, Glen A. Fitzpatrick, Tyler Harrison et al. · Journal of Microelectromechanical Systems | 11 Apr 2012 | 40 |
| 10 | Thin-layer Au-Sn solder bonding process for wafer-level packaging, electrical interconnections and MEMS applications Nickolai Belov, T.-K. Chou, J. M. Heck et al. | Jun 2009 | 35 |
| 11 | Sample purification on a microfluidic device Tim K. Footz, Sybille Wunsam, Stephen C. Kulak et al. · Electrophoresis | Oct 2001 | 32 |
| 12 | Modelling of air damping effect on the performance of encapsulated MEMS resonators Ankang Wang, Sahereh Sahandabadi, Tyler R. Harrison et al. · Microsystem Technologies | 30 Sep 2022 | 28 |
| 13 | Bacteriophage tail-spike protein derivitized microresonator arrays for specific detection of pathogenic bacteria Somayyeh Poshtiban, Amit Singh, Glen A. Fitzpatrick et al. · Sensors and Actuators B Chemical | 16 Jan 2013 | 22 |
| 14 | Improved resolution with microchip‐based enhanced field inversion electrophoresis C. Backhouse, Ania Gajdal, Linda M. Pilarski et al. · Electrophoresis | 28 May 2003 | 19 |
| 15 | Ultra-high density MEMS probe memory device John M. Heck, Donald E. Adams, Nickolai Belov et al. · Microelectronic Engineering | 12 Dec 2009 | 16 |
| 16 | CMUTs with improved electrical safety & minimal dielectric surface charging Peiyu Zhang, Glen A. Fitzpatrick, Walied A. Moussa et al. | Oct 2010 | 12 |
| 17 | Microelectromechanical Resonator Characterization Using Noncontact Parametric Electrostatic Excitation and Probing Kar-Mun Cheng, Zifeng Weng, Derek R. Oliver et al. · Journal of Microelectromechanical Systems | Oct 2007 | 12 |
| 18 | A review of commercial and laboratory-based microfluidic devices based on glass and/or silicon substrates Avishek Deb, Gnanesh Nagesh, Tyler Harrison et al. · RSC Advances | 2026 | 9 |
| 19 | A rejuvenation method for poly(N,N‐dimethylacrylamide)‐coated glass microfluidic chips Rubin Ma, H. John Crabtree, C. Backhouse · Electrophoresis | 27 Jun 2005 | 8 |
| 20 | Square spiral photonic crystal with visible bandgap Joshua D. Krabbe, Viktor Leontyev, Michael T. Taschuk et al. · Journal of Applied Physics | 15 Mar 2012 | 7 |
| 21 | Automated bead-trapping apparatus and control system for single-molecule DNA sequencing Greg R. Bashford, Don C. Lamb, Dan Grone et al. · Optics Express | 2008 | 6 |
| 22 | MEMS 3D optical mirror/scanner Tianshu Zhou, Paul Wright, Jackie Crawford et al. | 22 Mar 2004 | 5 |
| 23 | Empirical model for dielectric charging in double-SOI-wafer-bonded CMUTs: Theory and experiment Wei Zheng, Douglas W. Barlage, Peiyu Zhang et al. | Oct 2011 | 4 |
| 24 | Design for Manufacturability a Holistic Approach for the Development of MEMS Inertial Sensors Gnanesh Nagesh, Ahmad Rahbar Ranji, Sahereh Sahanbadadi et al. · IEEE Sensors Journal | 29 Nov 2024 | 3 |
| 25 | Interobserver and Intraobserver Reliability of Hepatic Shear Wave Elastography and the Influence of Fasted Versus Nonfasted States in Healthy Volunteers Zerlene Lim, Toni M. Whitaker, Kandis DeColle et al. · Journal of Ultrasound in Medicine | 20 Jul 2020 | 2 |
| 26 | Pressure indicating film characterization of pressure distribution in eutectic Au/Sn wafer‐to‐wafer bonding D. F. Spicer, Kevin Lai, K. Kornelsen et al. · Microelectronics International | 26 Jun 2010 | 2 |
| 27 | Transition of MEMS technology to nanofabrication Stephen C. Jakeway, H.J. Crabtree, Teodor Veres et al. | 6 May 2004 | 1 |
| 28 | Mapping stresses in high aspect ratio polysilicon electrical through-wafer interconnects Himani Sharma, Joshua D. Krabbe, Samira Farsinezhad et al. · Journal of Micro/Nanolithography MEMS and MOEMS | 17 Jun 2015 | 1 |
| 29 | Gold-tin solder electroplating of photo-resist laminated AlN ceramics Siamak Akhlaghi, J. N. Broughton, Douglas Gordon Ivey | 25 Jun 2003 | 1 |
| 30 | MEMS Relays/Switches Tiansheng Zhou, Yan Loke | 11 Oct 2006 | 1 |
| 31 | Examination of Key Packaging Metrics of a Hermetically Sealed MEMS Accelerometer Joshua D. Krabbe, Nick G. Wakefield, Serguei Roupassov et al. · Wafer-Level Packaging Symposium | Nov 2013 | 0 |
| 32 | Effect of Manufacturing Process Tolerances on MEMS Vibratory Sensor Dynamics Nabeel Khan, Anurag Agarwal, Tyler Harrison et al. | Nov 2021 | 0 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.