Most cited papers from Plasma Processes (United States)
What are the most cited papers from Plasma Processes (United States)?
The most cited paper from Plasma Processes (United States) is "High-efficiency humidity-stable planar perovskite solar cells based on atomic layer architecture" (Dibyashree Koushik, Wiljan J. H. Verhees, Yinghuan Kuang et al., 2016), with 282 citations. Next come "Synthesis and characterization of plasma spray formed carbon nanotube reinforced aluminum composite" (249) and "Inductively coupled plasma etching of GaN" (216).
Showing 50 of 59 papers. Every paper with more than 19 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | High-efficiency humidity-stable planar perovskite solar cells based on atomic layer architecture Dibyashree Koushik, Wiljan J. H. Verhees, Yinghuan Kuang et al. · Energy & Environmental Science | 21 Nov 2016 | 282 |
| 2 | Synthesis and characterization of plasma spray formed carbon nanotube reinforced aluminum composite Tapas Laha, Arvind K. Agarwal, Tim McKechnie et al. · Materials Science and Engineering A | 30 Jul 2004 | 249 |
| 3 | Inductively coupled plasma etching of GaN RANDY J. SHUL, G McClellan, Stephen A. Casalnuovo et al. · Applied Physics Letters | 19 Aug 1996 | 216 |
| 4 | Synthesis and applications of carbon nanomaterials for energy generation and storage Marco Notarianni, Jinzhang Liu, K. C. Vernon et al. · Beilstein Journal of Nanotechnology | Feb 2016 | 163 |
| 5 | JSC-1A lunar soil simulant: Characterization, glass formation, and selected glass properties Chandra S. Ray, Signo Tadeu dos Reis, Sujat Sen et al. · Journal of Non-Crystalline Solids | 10 Jun 2010 | 152 |
| 6 | High-density plasma etching of compound semiconductors RANDY J. SHUL, G McClellan, Ronald D. Briggs et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films | May 1997 | 123 |
| 7 | The evolution of atmospheric-pressure low-temperature plasma jets: jet current measurements Erdinç Karakaş, Mehmet Arda Akman, Mounir Laroussi · Plasma Sources Science and Technology | 18 May 2012 | 115 |
| 8 | Plasma etching of III–V semiconductors in CH4/H2/Ar electron cyclotron resonance discharges Chris Constantine, Derek Campbell Johnson, S. J. Pearton et al. · Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena | Jul 1990 | 111 |
| 9 | Negative ion destruction by O(3P) atoms and O2(a 1Δg) molecules in an oxygen plasma S.G. Belostotsky, Demetre J. Economou, D. V. Lopaev et al. · Plasma Sources Science and Technology | 9 Jun 2005 | 91 |
| 10 | Oxygen diffusion into SiO2-capped GaN during annealing S. J. Pearton, Hayeong Cho, Jeffery R. LaRoche et al. · Applied Physics Letters | 8 Nov 1999 | 82 |
| 11 | Synthesis, Microstructural Characterization, and Mechanical Property Evaluation of Vacuum Plasma Sprayed Tantalum Carbide Kantesh Balani, G H Andres Gonzalez, Arvind K. Agarwal et al. · Journal of the American Ceramic Society | Feb 2006 | 79 |
| 12 | Forecasting Solar Cycle 25 Using Deep Neural Networks B. Benson, W. D. Pan, A. Prasad et al. · Solar Physics | May 2020 | 76 |
| 13 | Annealing of dry etch damage in metallized and bare (-201) Ga2O3 Jiancheng Yang, Fan Ren, Rohit Khanna et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena | 25 Jul 2017 | 74 |
| 14 | Inductively coupled plasma etch damage in (-201) Ga2O3 Schottky diodes Jiancheng Yang, Shihyun Ahn, Fan Ren et al. · Applied Physics Letters | 3 Apr 2017 | 71 |
| 15 | Room temperature gas sensing properties of ultrathin carbon nanotube films by surfactant-free dip coating Carlo Piloto, Francesca Mirri, Elie Amram Bengio et al. · Sensors and Actuators B Chemical | 18 Dec 2015 | 68 |
| 16 | Low Temperature Silicon Nitride and Silicon Dioxide Film Processing by Inductively Coupled Plasma Chemical Vapor Deposition J. W. Lee, Kenneth D. Mackenzie, D. J. Johnson et al. · Journal of The Electrochemical Society | 2000 | 64 |
| 17 | The Science and Technologies for Fusion Energy With Lasers and Direct-Drive Targets J. D. Sethian et al. · IEEE Transactions on Plasma Science | 20 Jan 2010 | 63 |
| 18 | Comparison of dry etch techniques for GaN RANDY J. SHUL, G McClellan, S. J. Pearton et al. · Electronics Letters | 18 Jul 1996 | 62 |
| 19 | Electron cyclotron resonance plasma etching of InP in CH4/H2/Ar S. J. Pearton, U. K. Chakrabarti, A. P. Kinsella et al. · Applied Physics Letters | 9 Apr 1990 | 62 |
| 20 | Net Shape Nanostructured Aluminum Oxide Structures Fabricated by Plasma Spray Forming Arvind K. Agarwal, Tim McKechnie, Sudipta Seal · Journal of Thermal Spray Technology | Sep 2003 | 60 |
| 21 | A Segmented‐Target Sputtering Process for Growth of Sub‐50 nm Ferroelectric Scandium–Aluminum–Nitride Films with Composition and Stress Tuning Sushant Rassay, Faysal Hakim, Chao Li et al. · physica status solidi (RRL) - Rapid Research Letters | 12 Apr 2021 | 58 |
| 22 | Inductively coupled plasma etching of III–V semiconductors in BCl3-based chemistries Tatsuro Maeda, J.W Lee, RANDY J. SHUL et al. · Applied Surface Science | Apr 1999 | 51 |
| 23 | Synthesis of bulk nanostructured aluminum alloy component through vacuum plasma spray technique Tapas Laha, Arvind K. Agarwal, Tim McKechnie et al. · Acta Materialia | 28 Oct 2005 | 51 |
| 24 | Advanced selective dry etching of GaAs/AlGaAs in high density inductively coupled plasmas J. W. Lee, M. W. Devre, B. H. Reelfs et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films | Jul 2000 | 51 |
| 25 | Inductively coupled plasma etching of bulk, single-crystal Ga2O3 Jiancheng Yang, Shihyun Ahn, Fan Ren et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena | May 2017 | 48 |
| 26 | Smooth, low-bias plasma etching of InP in microwave Cl2/CH4/H2 mixtures Chris Constantine, C. Barratt, S. J. Pearton et al. · Applied Physics Letters | 14 Dec 1992 | 47 |
| 27 | Copper Dry Etching with Cl2 / Ar Plasma Chemistry J. W. Lee, Y. D. Park, Jeffrey R. Childress et al. · Journal of The Electrochemical Society | Jul 1998 | 41 |
| 28 | Intrinsically Switchable Ferroelectric Scandium Aluminum Nitride Lamb-Mode Resonators Sushant Rassay, Dicheng Mo, Chao Li et al. · IEEE Electron Device Letters | 10 May 2021 | 40 |
| 29 | Relative merits of Cl2 and CO/NH3 plasma chemistries for dry etching of magnetic random access memory device elements K. B. Jung, Hayeong Cho, Yoon‐Bong Hahn et al. · Journal of Applied Physics | 15 Apr 1999 | 39 |
| 30 | Oxidation-Protective Iridium and Iridium-Rhodium Coating Produced by Electrodeposition from Molten Salts Alexander Etenko, Tim McKechnie, Anatoliy Shchetkovskiy et al. · ECS Transactions | 6 Jul 2007 | 38 |
| 31 | Variations in Tantalum Carbide Microstructures with Changing Carbon Content Robert A. Morris, Billie Wang, Daniel A. Butts et al. · International Journal of Applied Ceramic Technology | 8 Mar 2012 | 38 |
| 32 | Exploring few-layer graphene and graphene oxide as fillers to enhance the oxygen-atom corrosion resistance of composites Min Su Yi, Zhigang Shen, Xiao-Hu Zhao et al. · Physical Chemistry Chemical Physics | 2014 | 36 |
| 33 | Comparison of CH4/H2/Ar reactive ion etching and electron cyclotron resonance plasma etching of In-based III–V alloys S. J. Pearton, U. K. Chakrabarti, Avishay Katz et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena | May 1991 | 33 |
| 34 | Comparison of inductively coupled plasma Cl2 and Cl4/H2 etching of III-nitrides Hyun Min Cho, C. B. Vartuli, S. M. Donovan et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films | May 1998 | 33 |
| 35 | Microwave CI 2 /H 2 discharges for high rate etching of InP Chris Constantine, C. Barratt, S. J. Pearton et al. · Electronics Letters | 27 Aug 1992 | 33 |
| 36 | Chlorine-Based Plasma Etching of GaN RANDY J. SHUL, Ronald D. Briggs, S. J. Pearton et al. · MRS Proceedings | 1996 | 32 |
| 37 | Low-pressure, low-temperature, and remote-plasma deposition of diamond thin films from water-methanol mixtures R. K. Singh, Donald R. Gilbert, R. Tellshow et al. · Applied Physics Letters | 14 Dec 1992 | 29 |
| 38 | Structure and property evaluation of a vacuum plasma sprayed nanostructured tungsten–hafnium carbide bulk composite Keith E. Rea, V. Viswanathan, Arnold Kruize et al. · Materials Science and Engineering A | 25 May 2007 | 27 |
| 39 | How to Ignite an Atmospheric Pressure Microwave Plasma Torch without Any Additional Igniters Martina Leins, Sandra Gaiser, Andreas Schulz et al. · Journal of Visualized Experiments | 16 Apr 2015 | 26 |
| 40 | A thin film approach for SiC-derived graphene as an on-chip electrode for supercapacitors Mohsin Ahmed, Mohamad K. Khawaja, Marco Notarianni et al. · Nanotechnology | 8 Oct 2015 | 25 |
| 41 | Anisotropic electron cyclotron resonance etchingof GaInP/AlGaInP heterostructures RANDY J. SHUL, R.P. Schneider, Chris Constantine · Electronics Letters | 12 May 1994 | 25 |
| 42 | Electron Beam Melting of Niobium Alloys from Blended Powders Jameson P. Hankwitz, Christopher Ledford, Christopher Rock et al. · Materials | 24 Sep 2021 | 24 |
| 43 | Influence of hafnium carbide on vacuum plasma spray processed tantalum carbide microstructures Bradford C. Schulz, Billie Wang, Robert A. Morris et al. · Journal of the European Ceramic Society | 17 Dec 2012 | 24 |
| 44 | Reactive ion beam etching of GaAs and related compounds in an inductively coupled plasma of Cl2–Ar mixture Yoon‐Bong Hahn, J. W. Lee, Gregory A. Vawter et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena | Mar 1999 | 24 |
| 45 | CH4/H2/Ar/Cl2 electron cyclotron resonance plasma etching of via holes for InP-based microwave devices Rohit Sanjay Khare, J.J. Brown, Meng Hu et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena | Sep 1994 | 24 |
| 46 | A Top-Down Fabrication Process for Vertical Hollow Silicon Nanopillars Yuan He, Xiangchen Che, Long Que · Journal of Microelectromechanical Systems | 30 Jun 2016 | 22 |
| 47 | Etching of Ga-based III - V semiconductors in inductively coupled Ar and -based plasma chemistries Jun-Hyeop Lee, C. R. Abernathy, S. J. Pearton et al. · Plasma Sources Science and Technology | Nov 1997 | 22 |
| 48 | Dry etch damage in inductively coupled plasma exposed GaAs/AlGaAs heterojunction bipolar transistors Fan Ren, J. W. Lee, C. R. Abernathy et al. · Applied Physics Letters | 5 May 1997 | 22 |
| 49 | Comparison of F 2‐Based Gases for High‐Rate Dry Etching of Si David C. Hays, K. B. Jung, Yoon‐Bong Hahn et al. · Journal of The Electrochemical Society | Oct 1999 | 22 |
| 50 | Inductively Coupled Plasma Etching of III‐V Nitrides in CH 4 / H 2 / Ar and CH 4 / H 2 / N 2 Chemistries C. B. Vartuli, S. J. Pearton, J. W. Lee et al. · Journal of The Electrochemical Society | Aug 1997 | 21 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.