Institution · Tongfu Microelectronics (China)
Most cited papers from Tongfu Microelectronics (China)
What are the most cited papers from Tongfu Microelectronics (China)?
The most cited paper from Tongfu Microelectronics (China) is "Challenges and developments of copper wire bonding technology" (Peisheng Liu, Liangyu Tong, Jinlan Wang et al., 2011), with 102 citations. Next come "Fabrication and characteristics of rutile TiO2 nanoparticles induced by laser ablation" (55) and "RLWE-Oriented High-Speed Polynomial Multiplier Utilizing Multi-Lane Stockham NTT Algorithm" (45).
Showing 50 of 88 papers. Every paper is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Challenges and developments of copper wire bonding technology Peisheng Liu, Liangyu Tong, Jinlan Wang et al. · Microelectronics Reliability | 27 Dec 2011 | 102 |
| 2 | Fabrication and characteristics of rutile TiO2 nanoparticles induced by laser ablation Peisheng Liu, Weiping Cai, Lixi Wan et al. · Transactions of Nonferrous Metals Society of China | Dec 2009 | 55 |
| 3 | RLWE-Oriented High-Speed Polynomial Multiplier Utilizing Multi-Lane Stockham NTT Algorithm Xiang Peng Feng, Shuguo Li, Sufen Xu · IEEE Transactions on Circuits & Systems II Express Briefs | 17 May 2019 | 45 |
| 4 | Seasonal dynamics, tidal influences, and anthropogenic impacts on microplastic distribution in the Yangtze River estuary: A comprehensive characterization and comparative analysis Panfeng Wu, Yuchuan Fan, Xinxin Zhang et al. · Journal of Hazardous Materials | 14 Jul 2024 | 36 |
| 5 | Smartphone Sonar-Based Contact-Free Respiration Rate Monitoring Xuyu Wang, Runze Huang, Chao Yang et al. · ACM Transactions on Computing for Healthcare | 9 Feb 2021 | 25 |
| 6 | Fall detection based on fused saliency maps Hongjun Li, Chaobo Li, Yupeng Ding · Multimedia Tools and Applications | 10 Sep 2020 | 22 |
| 7 | Large-Signal Behavior Modeling of GaN P-HEMT Based on GA-ELM Neural Network Shaowei Wang, Jincan Zhang, Min Liu et al. · Circuits Systems and Signal Processing | 23 Nov 2021 | 13 |
| 8 | Compact bandpass filter using CMRC‐based dual‐behavior resonator Zhong‐Yu Qian, Jian‐Xin Chen · International Journal of RF and Microwave Computer-Aided Engineering | 15 Mar 2019 | 12 |
| 9 | Comparative Study of Biosafety, DNA, and Chromosome Damage of Different-Materials-Modified Fe3O4 in Rats Donglin Xia, Yanpei Chen, Chao Chen et al. · Applied Biochemistry and Biotechnology | Sep 2015 | 12 |
| 10 | Study on the Relationship Between the Stiffness of RV Reducer and the Profile Modification Method of Cycloid-pin Wheel Jianing Wang, Jingjun Gu, Yonghua Yan · Lecture notes in computer science | 2016 | 11 |
| 11 | A reliable parameter extraction method for the augmented GaN high electron mobility transistor small‐signal model Lili Zhai, Haiyi Cai, Shaowei Wang et al. · International Journal of RF and Microwave Computer-Aided Engineering | 28 Apr 2022 | 10 |
| 12 | Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging Lei Shi, Lin Chen, David Wei Zhang et al. · Journal of Electronic Packaging | 23 Oct 2017 | 10 |
| 13 | Deformation monitoring for fixed-wing UAS through Inverse Mesh-free Method Yanhao Guo, Kangyu Chen, M. C. Wu et al. · Measurement | 18 Oct 2024 | 8 |
| 14 | A substrate integrated cavity‐fed dual‐polarized filtering patch antenna with high isolation Chun‐Mei Meng, Jian Wang, Jin Shi · International Journal of RF and Microwave Computer-Aided Engineering | 24 May 2019 | 8 |
| 15 | Novel and facile fabrication of hydrophobic sponge for the efficient adsorption of marine crude oil by photothermal conversion Di Zhang, Jingyuan Zhao, Tong Zhang et al. · Polymer | 4 May 2025 | 6 |
| 16 | Mold Flow Analysis and Optimization in Injection Molding Process for Semiconductor Packages Jinxin Huang, Xiaomeng Huang, Kaijie Shi et al. · 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) | 10 Aug 2022 | 6 |
| 17 | Study of viscoelastic effect of EMC on FBGA block warpage by FEA simulation Lin Tan, Jingrui Li, Xiyun Cheng et al. | Aug 2013 | 6 |
| 18 | Independently controllable dual‐band filter using single quad‐mode silver‐loaded dielectric resonator Li‐Heng Zhou, Xiao‐Xiao Yuan, Jian‐Xin Chen · International Journal of RF and Microwave Computer-Aided Engineering | 18 Dec 2018 | 5 |
| 19 | Enhanced Tribological Properties of PBO /Polyimide Composites Containing GO Interfacial Phase Liang Yu, Qian Wu, Tao Li et al. · Polymer Composites | 29 Aug 2025 | 4 |
| 20 | A cross-scale investigation on transient electrothermal performance for power MOSFETs at device-package level Y. H. Dai, Jiafei Yao, Jing Chen et al. · Microelectronics Journal | 11 Jan 2025 | 4 |
| 21 | A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device–Package–Heatsink–Board Levels Y. H. Dai, Jiafei Yao, Jing Chen et al. · Micromachines | 31 Oct 2024 | 4 |
| 22 | Failure Analysis on Abnormal Cracking of Flip-Chip Au Bumps During the High Temperature and Humidity Testing Yi Zhong, Zhongliang Liu, Binbin Jiang et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | 29 Oct 2024 | 4 |
| 23 | Analysis of 3D stacking technology and TSV technology Hui Xia Xuan, Guohua Gao, Xiao‐Yong Miao | 8 Aug 2023 | 4 |
| 24 | A LFP/AP Mode Reconfigurable Analog Front-End Combining an Electrical EEEG-iEEG Model for the Closed-Loop VNS Xiaolong Li, Senlin Ren, Xiaowei Li et al. · IEEE Transactions on Biomedical Circuits and Systems | 16 Nov 2023 | 4 |
| 25 | Compact differential dual‐band bandpass filter using single quad‐mode metal‐loaded dielectric resonator Yalin Ma, Xiao‐Xiao Yuan, Li‐Heng Zhou · International Journal of RF and Microwave Computer-Aided Engineering | 29 Mar 2019 | 4 |
| 26 | Investigation on Copper Clip Bonding Structure for Power Package Linqi Liu, Wei Jiang, Qiang Liu et al. | Aug 2018 | 4 |
| 27 | Electrical-Thermal Co-Simulation for LFBGA Sun Haiyan, Bo Gao, Ling Sun et al. | Aug 2018 | 4 |
| 28 | Investigation on solder bump process polyimide cracking for wafer level packaging Lei Shi, Lin Chen, David Wei Zhang et al. | Aug 2016 | 4 |
| 29 | A flexible piezoresistive pressure sensor with high sensitivity and wide sensing range based on TPU/PCL/MXene@PEDOT:PSS nanofibers Chuang Zhi Wu, Manlin Jiang, Jiacheng Wu et al. · Journal of Alloys and Compounds | Mar 2026 | 3 |
| 30 | Multi-memory video anomaly detection based on scene object distribution Hongjun Li, Jinyi Chen, Xiaohu Sun et al. · Multimedia Tools and Applications | 8 Mar 2023 | 3 |
| 31 | Modeling and Analysis of Differential Crosstalk of Interconnect Structures in High-Density Packages Hui Xia Xuan, Guohua Gao | Aug 2020 | 3 |
| 32 | A bandwidth‐agile balanced filtering power divider Zhen Tan, Qing‐Yuan Lu, Wei Yu et al. · International Journal of RF and Microwave Computer-Aided Engineering | 23 Mar 2019 | 3 |
| 33 | Model and Analysis of Planar Spiral Inductor Based on Package Substrate Sun Haiyan, SUN Wenjun, Ling Sun et al. | Aug 2018 | 3 |
| 34 | Investigation on FBGA block warpage by Finite Element Simulation Jingrui Li, Lin Tan, Qian Wang et al. | Aug 2012 | 3 |
| 35 | Research progress of CeO2-based polishing slurry in SiC-CMP Ning Xu, Guosheng Zhang, Jian Zhang et al. · Journal of Materials Science | 24 Oct 2025 | 2 |
| 36 | Comparative Deep Learning-Based Side-Channel Analysis of an FPGA-Based CRYSTALS-Kyber NTT Accelerator Munkhbaatar Chinbat, Liji Wu, Xiangmin Zhang et al. · Cryptography | 9 Oct 2025 | 2 |
| 37 | Fluorine Residue Reduction in Plasma Dicing Chua Rho Wen, Lau Teck Beng, Taki Fang et al. | 16 Oct 2024 | 2 |
| 38 | An enhanced manifold alignment method for fault diagnosis of liquid-cooled plate based on manifold distance features Xiaoping Liu, Shang Chen, Wei Wang et al. · Measurement | 23 Nov 2024 | 2 |
| 39 | Overcome high density substrate shortage by using Fan Out Chip Module C. Key Chung, Luke Liu, Wuhong Cai et al. · 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) | 10 Aug 2022 | 2 |
| 40 | Research on BEOL Failures of the Chip-Package Interaction by Shear Tests of the Bumps Shizhao Wang, Lianghao Xue, Hongjie Wang et al. | 14 Sep 2021 | 2 |
| 41 | P‐1.14: An a‐IGZO TFT AMOLED Pixel Circuit with Source Follower Structure to Alleviate Hysteresis Effect Zhichao Peng, Congwei Liao, Junjun An et al. · SID Symposium Digest of Technical Papers | Feb 2021 | 2 |
| 42 | Transformed Network Based on Task-Driven Hongjun Li, Ze Zhou, Chaobo Li et al. · Lecture notes in computer science | 2020 | 2 |
| 43 | Wideband balanced microstrip-to-microstrip vertical transition Zhidan Shen, Jin Shi, Kai Xu et al. · International Journal of RF and Microwave Computer-Aided Engineering | 29 Oct 2018 | 2 |
| 44 | Dual-temperature H2 sensing with a wide dynamic range enabled by PdO/Pd-ZnO nanorod arrays Yingyi Wang, Lin Liu, Chenfei Guo et al. · Microsystems & Nanoengineering | 27 Jul 2026 | 1 |
| 45 | Research on Intelligent Thermal Optimization for Chiplet-Based Heterogeneously Integrated AI Chip Embedded with Leaf-Vein-Inspired Fractal Microchannels Jie Wu, Yu Liang, Guibin Liu et al. · Materials | 10 Feb 2026 | 1 |
| 46 | High-Sensitivity Optical Fiber Mach-Zehnder Interferometer Sensor Based on Eight-Core Fiber Yancheng Ji, Junjie Wang, Jiayi Qian et al. · IEEE Photonics Technology Letters | 18 Mar 2025 | 1 |
| 47 | Moisture Effect on Adhesion Between Polybenzoxazole and Sputtering Titanium in WLCSP Fang Ming, Eu Poh Leng, Huang Wen Hung et al. | 16 Oct 2024 | 1 |
| 48 | Development of Thermo-Compression NCF Bonding Process with High Throughput for 3DS DRAM Ming Min Wu, Jia Fei Lu, D. Li et al. | 7 Aug 2024 | 1 |
| 49 | A low-cost configurable hash computing circuit for PQC algorithm Wentao Xi, Xingjun Wu, Kai Zhang | 6 Dec 2023 | 1 |
| 50 | Integrated Circuit Package Types Guoliang Yu, Haizhong Shi, Honghui Wang | 27 Nov 2023 | 1 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.