Question 1

What are the most cited papers from Tongfu Microelectronics (China)?

Accepted Answer

The most cited paper from Tongfu Microelectronics (China) is "Challenges and developments of copper wire bonding technology" (Peisheng Liu, Liangyu Tong, Jinlan Wang et al., 2011), with 102 citations. Next come "Fabrication and characteristics of rutile TiO2 nanoparticles induced by laser ablation" (55) and "RLWE-Oriented High-Speed Polynomial Multiplier Utilizing Multi-Lane Stockham NTT Algorithm" (45).

Question 2

Which research topics does Tongfu Microelectronics (China) publish most on?

Accepted Answer

By volume in 2022-now: 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies, Electron and X-Ray Spectroscopy Techniques and Semiconductor Lasers and Optical Devices.

Question 3

Which keywords describe research at Tongfu Microelectronics (China)?

Accepted Answer

By fractional works in 2022-now, weighted toward what it does more of than the world: Thermal Management, Interconnect, Through-Silicon Via, Electromigration, High-Temperature Electronics, Nanoparticles, Nanocomposites and X-ray Photoelectron Spectroscopy.

Question 4

Which fields of science does Tongfu Microelectronics (China) work in?

Accepted Answer

In 2022-now, 89% of research at Tongfu Microelectronics (China) is in Physical Sciences, 5% in Life Sciences. Its largest fields are Engineering (59%), Materials Science (13%), Computer Science (10%). It does 2.0× the world's share of Physical Sciences.

Question 5

Is Tongfu Microelectronics (China)'s research output growing?

Accepted Answer

Output in 2022-2025 was 31% higher than in 2018-2021.