Jian Cai
Jian Cai publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Automotive Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Semiconductor materials and devices.
- World rank
- #875,151 of 1,633,909 ranked researchers
- Rank in China
- #74,358 of 187,979
- Works
- 56
- Citations
- 105
- Citations per work
- 1.9
What does Jian Cai research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering67% of their works
- 2Mechanical Engineering9% of their works
- 3Automotive Engineering3% of their works
- 4Mechanics of Materials3% of their works
- 5Materials Chemistry3% of their works
- 6Electronic, Optical and Magnetic Materials3% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electrodeposition and Electroless Coatings
- Advanced Welding Techniques Analysis
- Additive Manufacturing and 3D Printing Technologies
- Advancements in Semiconductor Devices and Circuit Design
- Thin-Film Transistor Technologies
Which keywords describe Jian Cai's research?
The keywords of their largest research topics: Nanoparticles, Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Additive Manufacturing, Atomic Layer Deposition and High-k Dielectrics.
- Tunnel Field-Effect Transistors
- Plasmonics
- Materials
- Processing
- Electrodeposition
- High-k Dielectrics
- Additive Manufacturing
- Interfacial Reactions
- Interconnect
- Nanoparticles
- Through-Silicon Via
- Lead-free Solders
- Atomic Layer Deposition
- Composite Coatings
- Friction Stir Welding
- 3D Printing
- Nanowire Transistors
- Thin-Film Transistors
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Nanoparticles202 topics
- Interconnect181 topic
- Through-Silicon Via181 topic
- Interfacial Reactions161 topic
- Lead-free Solders161 topic
- Additive Manufacturing72 topics
- Atomic Layer Deposition71 topic
- High-k Dielectrics71 topic
- Composite Coatings41 topic
- Electrodeposition41 topic
- Friction Stir Welding41 topic
- Processing41 topic
- 3D Printing31 topic
- Materials31 topic
- Nanowire Transistors31 topic
- Plasmonics31 topic
- Thin-Film Transistors31 topic
- Tunnel Field-Effect Transistors31 topic
Where does Jian Cai work?
Jian Cai's main affiliation in the publication record is Tsinghua University, China.
How many publications and citations does Jian Cai have?
Science Explorer counts 56 works and 105 citations for Jian Cai, ranking #875,151 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named Jian Cai
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.