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Topic · Electrical and Electronic Engineering

Electronic Packaging and Soldering Technologies

Electronic Packaging and Soldering Technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 32k research works in it since 1950. 9.9% of them reached the world's top 10% most cited for their field and year.

This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.

  • Lead-free Solders
  • Interfacial Reactions
  • Electronic Packaging
  • High-Temperature Electronics
  • Reliability Study
  • Nanoparticles
  • Electromigration
  • Thermal Behavior
  • Rare Earth Elements
  • Conductive Adhesives
Research works
32k
fractional, since 1950
In the world top 10%
3.2k
per year above
Top-10% rate
9.9%
share of its works in the world top 10%
Growth, 2018-21 → 2022-25
+10%
the tick is no change
Largest producer
China
41% of the 10 largest, 2022-now
Electronic Packaging and Soldering Technologies

Which countries lead Electronic Packaging and Soldering Technologies research?

By volume, China and the United States publish the most (1.5k and 652 works in 2022-now).

By volume, 2022-now

  1. 1 China 1.5k works
  2. 2 United States 652 works
  3. 3 Japan 344 works
  4. 4 Taiwan 302 works
  5. 5 Germany 260 works
  6. 6 South Korea 255 works
  7. 7 India 123 works
  8. 8 Malaysia 98 works
  9. 9 France 86 works
  10. 10 United Kingdom 84 works

How concentrated that is

The same countries as shares of everything the list above accounts for. A node where two countries do two thirds of the work and one spread evenly across twelve read alike as a ranking and not at all alike here.

China: 40.8%United States: 17.5%Japan: 9.2%Taiwan: 8.1%6 others listed: 24.4%41%largest
China1,516 · 40.8%United States652 · 17.5%Japan344 · 9.2%Taiwan302 · 8.1%6 others listed906 · 24.4%

Shares of the rows listed above, not of the whole node.

Which institutions lead Electronic Packaging and Soldering Technologies research?

By volume in 2022-now, Chinese Academy of Sciences publishes the most Electronic Packaging and Soldering Technologies research, followed by Harbin Institute of Technology and Auburn University.

By volume, 2022-now

  1. 1 Chinese Academy of SciencesChina 95 works
  2. 2 Harbin Institute of TechnologyChina 68 works
  3. 3 Auburn UniversityUnited States 59 works
  4. 4 Fraunhofer-GesellschaftGermany 46 works
  5. 5 Dalian University of TechnologyChina 44 works
  6. 6 The University of OsakaJapan 43 works
  7. 7 Agency for Science, Technology and ResearchSingapore 41 works
  8. 8 Guilin University of Electronic TechnologyChina 38 works
  9. 9 Central South UniversityChina 37 works
  10. 10 Samsung (South Korea)South Korea 37 works

Who are the leading researchers in Electronic Packaging and Soldering Technologies?

The most-cited researchers publishing on Electronic Packaging and Soldering Technologies include Wei Huang, Takashi Taniguchi and Lei Jiang.

  1. 1 Wei Huang China 267k citations
  2. 2 Takashi Taniguchi Japan 227k citations
  3. 3 Lei Jiang China 214k citations
  4. 4 Frede Blaabjerg Denmark 203k citations
  5. 5 Mercouri G. Kanatzidis United States 196k citations
  6. 6 Hua Zhang Singapore 196k citations
  7. 7 Seeram Ramakrishna Singapore 186k citations
  8. 8 Qiang Zhang China 184k citations

Ranked by citations received across their whole record, among researchers with at least three works on this topic.

What are the most cited papers in Electronic Packaging and Soldering Technologies?

The most cited paper in Electronic Packaging and Soldering Technologies is "Tensile properties of fibre-reinforced metals: Copper/tungsten and copper/molybdenum" (Anthony E. Kelly, William R. Tyson, 1965), with 2,400 citations. Next come "Lead-free Solders in Microelectronics" (1,970) and "Thin Film Materials: Stress, Defect Formation and Surface Evolution" (1,554).

Most cited papers
#PaperReleasedCitations
1 Tensile properties of fibre-reinforced metals: Copper/tungsten and copper/molybdenum Anthony E. Kelly, William R. Tyson · Journal of the Mechanics and Physics of Solids Dec 1965 2,400
2 Lead-free Solders in Microelectronics Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports Jun 2000 1,970
3 Thin Film Materials: Stress, Defect Formation and Surface Evolution L. B. Freund, S. Srinivasa Suresh 2 Feb 2004 1,554
4 The metallurgy of zinc-coated steel A. R. Marder · Progress in Materials Science Jun 2000 1,519
5 Electromigration—A brief survey and some recent results J. R. Black · IEEE Transactions on Electron Devices Apr 1969 1,498
All 100 most cited papers, with filters and sorting

Where is Electronic Packaging and Soldering Technologies research done?

The largest centres of Electronic Packaging and Soldering Technologies research in 2022-now are Beijing (China), Seoul (South Korea), Tokyo (Japan) and Shanghai (China). Among places with at least 20 works in it, it is an unusually large share of all research in Clinton, Auburn and Binghamton.

Largest cities, 2022-now

  1. 1 BeijingChina 287 works
  2. 2 SeoulSouth Korea 126 works
  3. 3 TokyoJapan 113 works
  4. 4 ShanghaiChina 112 works
  5. 5 HsinchuTaiwan 96 works
  6. 6 HarbinChina 85 works
  7. 7 GuangzhouChina 71 works
  8. 8 Xi'anChina 71 works
  9. 9 SingaporeSingapore 70 works
  10. 10 WuhanChina 69 works

Where it is the local speciality

  1. ClintonUS · 21.3 works228×
  2. AuburnUS · 59.2 works42×
  3. BinghamtonUS · 24.3 works39×
  4. Santa ClaraUS · 38.9 works35×
  5. ChemnitzDE · 22.2 works33×
← less than its size predicts1×more →

Location quotient: how much more of its research is in Electronic Packaging and Soldering Technologies than the world average.

See Electronic Packaging and Soldering Technologies on the map

Where is the best place to study Electronic Packaging and Soldering Technologies?

Among universities, judged by research, Harbin Institute of Technology, City University of Hong Kong and National Yang Ming Chiao Tung University score highest, combining excellence, specialisation, size, growth and international reach. Research strength is one signal when choosing where to study; it does not measure teaching.

0%20%40%mean 20.7%fractional works in this field (log) →share of work in the world top 10% →City University of H…National Yang Ming C…Harbin Institute of …Dalian University of…
above the meannear itbelow it

One dot per university in the first ten of the table below, at the default weights. The upper left is the interesting corner: small places doing unusually strong work.

Excellenceshare of its work in the world top 10%, 2022-now and all time averaged
40%
Specialisationhow much of its work is in this field, counted up to 10× the world share
10%
Sizeits output in this field, on a log scale
30%
Growthoutput growth, counted from -20% to +20%
10%
Internationalshare of its work with a co-author abroad
10%
Each slider sets a weight; the share it gets of the score is beside it.
#UniversityScoreTop 10%SpecialisationWorksGrowth
1Harbin Institute of TechnologyChina 75.418.7%10.9×68 +31.0%
2City University of Hong KongChina 74.632.7%6.1×13 +231.4%
3National Yang Ming Chiao Tung UniversityTaiwan 67.425.0%20.3×31 +4.3%
4Dalian University of TechnologyChina 65.014.8%12.2×44 +39.0%
5Xiamen University of TechnologyChina 63.326.9%19.1×15 +504.0%
6The University of OsakaJapan 60.316.7%18.3×43 -11.4%
7Feng Chia UniversityTaiwan 56.923.2%45.7×13 +138.8%
8Tianjin UniversityChina 54.816.1%4.0×18 +25.6%
9Jiangsu University of Science and TechnologyChina 54.714.4%14.7×17 +96.2%
10Huazhong University of Science and TechnologyChina 53.818.5%4.1×28 +16.2%

Universities only. The score blends excellence (40%), size (30%), specialisation (10%), growth (10%), international reach (10%), 2022-now; growth compares 2018-21 with 2022-25 and counts up to +20%, since a jump from a small base is mostly noise.

Every institution in Electronic Packaging and Soldering Technologies, country by country

Is Electronic Packaging and Soldering Technologies research growing?

Output in 2022-2025 was 10% higher than in 2018-2021, peaking in 2002. The fastest-growing topics are Electronic Packaging and Soldering Technologies.

still counting19801990200020102020
grewheldshrank

The same series as a ribbon: one cell per year, darker for more. The line above answers how much; this answers when.

Its share of all research

Growing output can still be a shrinking share: all of science grows. This is Electronic Packaging and Soldering Technologies as a percentage of every work published that year, 0.019% in 2024.

still counting0.050%0.10%Electronic Packaging and Soldering Technologies0.019% in 202519801990200020102020

Fractional works of Electronic Packaging and Soldering Technologies over all fractional works that year. How the balance of science has shifted.

How much of it reaches the world top 10%

Year by year.

still counting5%10%15%Electronic Packaging and Soldering Technologies9.7% in 2025200020102020

Of each year's works in it, the share that reached the world's 10% most cited for their field and year. A field is the world for its own topics, so there is no other line to hold it against.

Which topics inside it are moving

Growth and decline on one axis around a shared zero. Two lists side by side hide the thing that matters: whether the growth dwarfs the decline, or the other way round.

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