Electronic Packaging and Soldering Technologies
Electronic Packaging and Soldering Technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 32k research works in it since 1950. 9.9% of them reached the world's top 10% most cited for their field and year.
This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.
- Lead-free Solders
- Interfacial Reactions
- Electronic Packaging
- High-Temperature Electronics
- Reliability Study
- Nanoparticles
- Electromigration
- Thermal Behavior
- Rare Earth Elements
- Conductive Adhesives
- Research works
- 32k fractional, since 1950
- In the world top 10%
- 3.2k per year above
- Top-10% rate
- 9.9% share of its works in the world top 10%
- Growth, 2018-21 → 2022-25
- +10% the tick is no change
- Largest producer
China
41% of the 10 largest, 2022-now
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