Electronic Packaging and Soldering Technologies

Electronic Packaging and Soldering Technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 32k research works in it since 1950. 9.9% of them reached the world's top 10% most cited for their field and year.

This cluster of papers focuses on the advances and challenges in the use of lead-free solders, interfacial reactions between solders and base materials, reliability studies in electronic packaging, high-temperature electronics, nanoparticle applications, electromigration effects, thermal behavior, rare earth element additions, and the use of conductive adhesives as alternatives.

• Lead-free Solders
• Interfacial Reactions
• Electronic Packaging
• High-Temperature Electronics
• Reliability Study
• Nanoparticles
• Electromigration
• Thermal Behavior
• Rare Earth Elements
• Conductive Adhesives