Most cited papers in Electronic Packaging and Soldering Technologies
What are the most cited papers in Electronic Packaging and Soldering Technologies?
The most cited paper in Electronic Packaging and Soldering Technologies is "Tensile properties of fibre-reinforced metals: Copper/tungsten and copper/molybdenum" (Anthony E. Kelly, William R. Tyson, 1965), with 2,400 citations. Next come "Lead-free Solders in Microelectronics" (1,970) and "Thin Film Materials: Stress, Defect Formation and Surface Evolution" (1,554).
Showing 50 of 100 papers. Every paper with more than 352 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Tensile properties of fibre-reinforced metals: Copper/tungsten and copper/molybdenum Anthony E. Kelly, William R. Tyson · Journal of the Mechanics and Physics of Solids | Dec 1965 | 2,400 |
| 2 | Lead-free Solders in Microelectronics Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports | Jun 2000 | 1,970 |
| 3 | Thin Film Materials: Stress, Defect Formation and Surface Evolution L. B. Freund, S. Srinivasa Suresh | 2 Feb 2004 | 1,554 |
| 4 | The metallurgy of zinc-coated steel A. R. Marder · Progress in Materials Science | Jun 2000 | 1,519 |
| 5 | Electromigration—A brief survey and some recent results J. R. Black · IEEE Transactions on Electron Devices | Apr 1969 | 1,498 |
| 6 | Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports | Jun 2002 | 1,367 |
| 7 | Damascene copper electroplating for chip interconnections Panayotis C. Andricacos, Cyprian E. Uzoh, John O. Dukovic et al. · IBM Journal of Research and Development | Sep 1998 | 1,226 |
| 8 | Phaselock Techniques Floyd M. Gardner · IEEE Transactions on Systems Man and Cybernetics | 1984 | 1,091 |
| 9 | Recent advances on electromigration in very-large-scale-integration of interconnects K. N. Tu · Journal of Applied Physics | 24 Oct 2003 | 1,074 |
| 10 | Electrical resistivity of copper, gold, palladium, and silver Richard A. Matula · Journal of Physical and Chemical Reference Data | Oct 1979 | 1,025 |
| 11 | The Changing Automotive Environment: High-Temperature Electronics Wayne R. Johnson, John L. Evans, Peter Kraglund Jacobsen et al. · IEEE Transactions on Electronics Packaging Manufacturing | Jul 2004 | 869 |
| 12 | Tungsten Microelectrode for Recording from Single Units David Hunter Hubel · Science | 22 Mar 1957 | 857 |
| 13 | Electromigration in metals Pui Shing Ho, T Kwok · Reports on Progress in Physics | Mar 1989 | 837 |
| 14 | Ceramic and Glass‐Ceramic Packaging in the 1990s Rao Tummala · Journal of the American Ceramic Society | May 1991 | 743 |
| 15 | Stress evolution due to electromigration in confined metal lines Matt A. Korhonen, P. Bo rgesen, K. N. Tu et al. · Journal of Applied Physics | 15 Apr 1993 | 739 |
| 16 | Advances in lead-free electronics soldering Katsuaki Suganuma · Current Opinion in Solid State and Materials Science | 2001 | 734 |
| 17 | Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications Yi Li, Ching Ping Wong · Materials Science and Engineering R Reports | 2006 | 715 |
| 18 | Recent Advances and Trends in Advanced Packaging John Hon-Shing Lau · IEEE Transactions on Components Packaging and Manufacturing Technology | 18 Jan 2022 | 694 |
| 19 | Reliability challenges in 3D IC packaging technology K. N. Tu · Microelectronics Reliability | 26 Oct 2010 | 657 |
| 20 | Cracking of thin bonded films in residual tension Jack Beuth · International Journal of Solids and Structures | 1992 | 647 |
| 21 | Estimation of the isotope effect on the lattice thermal conductivity of group IV and group III-V semiconductors Donald T. Morelli, Joseph P. Heremans, Glen A. Slack · Physical review. B, Condensed matter | Nov 2002 | 630 |
| 22 | Adhesively-bonded joints and repairs in metallic alloys, polymers and composite materials: Adhesives, adhesion theories and surface pretreatment Ahmet Baldan · Journal of Materials Science | 12 Dec 2003 | 620 |
| 23 | Strain-dependent electrical resistance of tin-doped indium oxide on polymer substrates Darran R. Cairns, Richard P. Witte, Daniel K. Sparacin et al. · Applied Physics Letters | 13 Mar 2000 | 615 |
| 24 | Joining of dissimilar materials Kristian Martinsen, S. Jack Hu, Blair E. Carlson · CIRP Annals | 2015 | 611 |
| 25 | Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Journal of Alloys and Compounds | Mar 2003 | 610 |
| 26 | SEMICONDUCTOR WAFER BONDING U. Gösele, Qiaoling Tong · Annual Review of Materials Science | Aug 1998 | 598 |
| 27 | A review of mechanical properties of lead-free solders for electronic packaging Hongtao Ma, Jeffrey C. Suhling · Journal of Materials Science | 26 Jan 2009 | 598 |
| 28 | Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs Guruprasad Katti, Michele Stucchi, Kristin De Meyer et al. · IEEE Transactions on Electron Devices | Dec 2009 | 591 |
| 29 | Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history P. A. Flinn, Donald S. Gardner, William D. Nix · IEEE Transactions on Electron Devices | Mar 1987 | 591 |
| 30 | Properties of lead-free solder alloys with rare earth element additions Chi‐Man Lawrence Wu, Daquan Yu, Cheh Pau Law et al. · Materials Science and Engineering R Reports | 12 Mar 2004 | 591 |
| 31 | Wafer bonding for silicon-on-insulator technologies J. B. Lasky · Applied Physics Letters | 6 Jan 1986 | 578 |
| 32 | Stress analysis of adhesive-bonded lap joints RD Adams, N A Peppiatt · The Journal of Strain Analysis for Engineering Design | Jul 1974 | 577 |
| 33 | Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys Kil-Won Moon, William J. Boettinger, Ursula R. Kattner et al. · Journal of Electronic Materials | Oct 2000 | 564 |
| 34 | Comparison of methods for the measurement of fibre/matrix adhesion in composites Pedro Jesús Herrera-Franco, Lawrence T. Drzal · Composites | 1992 | 550 |
| 35 | Microelectronics Packaging Handbook Rao Tummala, Eugene J. Rymaszewski, Y. C. Lee · Journal of Electronic Packaging | Sep 1989 | 535 |
| 36 | Comprehensive study of the resistivity of copper wires with lateral dimensions of 100 nm and smaller Werner Steinhögl, G. Schindler, Gernot Steinlesberger et al. · Journal of Applied Physics | 27 Dec 2004 | 533 |
| 37 | A review of lead-free solders for electronics applications Shunfeng Cheng, Chien‐Ming Huang, MICHAEL G. PECHT · Microelectronics Reliability | Jul 2017 | 529 |
| 38 | Three-dimensional problems of the theory of elasticity Harry Donald Conway · Journal of the Franklin Institute | May 1965 | 527 |
| 39 | Advances in fusion bonding techniques for joining thermoplastic matrix composites: a review Christophe Ageorges, Lin Ye, M. Hou · Composites Part A Applied Science and Manufacturing | Jun 2001 | 527 |
| 40 | Adhesion phenomena in bonded joints Ahmet Baldan · International Journal of Adhesion and Adhesives | 8 May 2012 | 526 |
| 41 | Joule heating during flash-sintering Rishi Raj · Journal of the European Ceramic Society | 16 Mar 2012 | 526 |
| 42 | Solder joint fatigue models: review and applicability to chip scale packages W.W Lee, Luu T. Nguyen, Guna S Selvaduray · Microelectronics Reliability | Feb 2000 | 521 |
| 43 | Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening H. K. Kim, K. N. Tu · Physical review. B, Condensed matter | 15 Jun 1996 | 506 |
| 44 | The role of friction stir welding tool on material flow and weld formation K. Kumar, Satish Vasu Kailas · Materials Science and Engineering A | 16 Aug 2007 | 505 |
| 45 | High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology | Feb 2011 | 503 |
| 46 | Metal–metal bonding process using Ag metallo-organic nanoparticles Eiichi Ide, Shinji Angata, Akio Hirose et al. · Acta Materialia | 11 Apr 2005 | 501 |
| 47 | Electronics Without Lead Yi Li, Kyoung‐sik Moon, Ching Ping Wong · Science | 2 Jun 2005 | 497 |
| 48 | Reliability of Controlled Collapse Interconnections K. C. Norris, Abraham H. Landzberg · IBM Journal of Research and Development | May 1969 | 495 |
| 49 | Fusion Bonding/Welding of Thermoplastic Composites Ali Yousefpour, Mehdi Hojjati, J.-P. Immarigeon · Journal of Thermoplastic Composite Materials | 22 Jun 2004 | 491 |
| 50 | A consideration of the morphology of electrochemically deposited lithium in an organic electrolyte Jun‐ichi Yamaki, Shin‐ichi Tobishima, Katsuro Hayashi et al. · Journal of Power Sources | Aug 1998 | 491 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for a field when OpenAlex files it under one of the field's topics; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.