3D IC and TSV technologies
3D IC and TSV technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 26k research works in it since 1953. 10.0% of them reached the world's top 10% most cited for their field and year.
This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.
- Through-Silicon Via
- Interconnect
- Wafer Bonding
- Thermal Management
- System Integration
- TSV Technology
- Microarchitecture
- Heterogeneous Integration
- Electrical Modeling
- Chip Stacking
- Research works
- 26k fractional, since 1953
- In the world top 10%
- 2.6k per year above
- Top-10% rate
- 10.0% share of its works in the world top 10%
- Growth, 2013–17 → 2018–22
- -23% the tick is no change
Which countries lead 3D IC and TSV technologies research?
By volume, China and the United States publish the most (1k and 639 works in 2022–2025).
By volume, 2022–2025
- 1 China 1k works
- 2 United States 639 works
- 3 South Korea 282 works
- 4 Japan 275 works
- 5 Taiwan 268 works
- 6 Germany 203 works
- 7 India 117 works
- 8 France 91 works
- 9 Singapore 82 works
- 10 Belgium 65 works
How concentrated that is
The same countries as shares of everything the list above accounts for. A node where two countries do two thirds of the work and one spread evenly across twelve read alike as a ranking and not at all alike here.
Shares of the rows listed above, not of the whole node.
Which institutions lead 3D IC and TSV technologies research?
By volume in 2022–2025, Samsung (South Korea) publishes the most 3D IC and TSV technologies research, followed by IMEC and National Yang Ming Chiao Tung University.
By volume, 2022–2025
- 1 Samsung (South Korea)South Korea 64 works
- 2 IMECBelgium 49 works
- 3 National Yang Ming Chiao Tung UniversityTaiwan 38 works
- 4 Harbin Institute of TechnologyChina 38 works
- 5 Xidian UniversityChina 37 works
- 6 Georgia Institute of TechnologyUnited States 36 works
- 7 Intel (United States)United States 34 works
- 8 Agency for Science, Technology and ResearchSingapore 28 works
- 9 Advanced Semiconductor Engineering (Taiwan)Taiwan 27 works
- 10 Shanghai Jiao Tong UniversityChina 26 works
Who are the leading researchers in 3D IC and TSV technologies?
The most-cited researchers publishing on 3D IC and TSV technologies include Luca Benini and Róbert Langer.
- 1 Luca Benini Italy 4.6k citations
- 2 Róbert Langer United States 4.2k citations
Ranked by citations received across their whole record, among researchers with at least three works on this topic.
Where is 3D IC and TSV technologies research done?
The largest centres of 3D IC and TSV technologies research in 2022–2025 are Beijing (China), Seoul (South Korea), Shanghai (China) and Tokyo (Japan). Among places with at least 20 works in it, it is an unusually large share of all research in Santa Clara and Hsinchu.
Largest cities, 2022–2025
Where it is the local speciality
- Santa ClaraUS · 51.9 works59×
- HsinchuTW · 101.2 works35×
Location quotient: how much more of its research is in 3D IC and TSV technologies than the world average.
Where is the best place to study 3D IC and TSV technologies?
Among universities, judged by research, Binghamton University, Xiamen University of Technology and Georgia Institute of Technology score highest, combining excellence, specialisation, size, growth and international reach. Research strength is one signal when choosing where to study; it does not measure teaching.
One dot per university in the table below. The upper left is the interesting corner: small places doing unusually strong work.
| # | University | Score | Top 10% | Specialisation | Works | Growth |
|---|---|---|---|---|---|---|
| 1 | Binghamton UniversityUnited States | 57.8 | 24.1% | 26.4× | 12 | -35.9% |
| 2 | Xiamen University of TechnologyChina | 56.6 | 18.9% | 17.2× | 12 | — |
| 3 | Georgia Institute of TechnologyUnited States | 56.2 | 11.4% | 17.4× | 36 | -24.5% |
| 4 | Xidian UniversityChina | 55.6 | 7.7% | 14.9× | 37 | +39.7% |
| 5 | National Yang Ming Chiao Tung UniversityTaiwan | 54.9 | 8.8% | 27.5× | 38 | -13.1% |
| 6 | Harbin Institute of TechnologyChina | 53.4 | 13.2% | 6.8× | 38 | +67.0% |
| 7 | Jiangsu University of Science and TechnologyChina | 53.4 | 12.9% | 9.2× | 10 | +158.7% |
| 8 | The University of OsakaJapan | 50.8 | 5.1% | 11.3× | 23 | +62.0% |
| 9 | City University of Hong KongHong Kong | 49.8 | 28.1% | 4.7× | 9 | -43.5% |
| 10 | Korea Advanced Institute of Science and TechnologySouth Korea | 49.4 | 9.4% | 13.9× | 22 | -23.5% |
Universities only. Score blends excellence (30%), specialisation (25%), size (20%), growth (15%) and international reach (10%), 2015–2022; growth compares 2010–14 with 2015–19.
Is 3D IC and TSV technologies research growing?
Output in 2018–2022 was 23% lower than in 2013–2017, peaking in 2002.
The same series as a ribbon — one cell per year, darker for more. The line above answers how much; this answers when.
Which topics inside it are moving
Growth and decline on one axis around a shared zero. Two lists side by side hide the thing that matters: whether the growth dwarfs the decline, or the other way round.