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Topic · Electrical and Electronic Engineering

3D IC and TSV technologies

3D IC and TSV technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 26k research works in it since 1953. 9.9% of them reached the world's top 10% most cited for their field and year.

This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.

  • Through-Silicon Via
  • Interconnect
  • Wafer Bonding
  • Thermal Management
  • System Integration
  • TSV Technology
  • Microarchitecture
  • Heterogeneous Integration
  • Electrical Modeling
  • Chip Stacking
Research works
26k
fractional, since 1953
In the world top 10%
2.6k
per year above
Top-10% rate
9.9%
share of its works in the world top 10%
Growth, 2018-21 → 2022-25
+21%
the tick is no change
Largest producer
China
35% of the 10 largest, 2022-now
3D IC and TSV technologies

Which countries lead 3D IC and TSV technologies research?

By volume, China and the United States publish the most (1.2k and 731 works in 2022-now).

By volume, 2022-now

  1. 1 China 1.2k works
  2. 2 United States 731 works
  3. 3 South Korea 329 works
  4. 4 Japan 320 works
  5. 5 Taiwan 308 works
  6. 6 Germany 219 works
  7. 7 India 134 works
  8. 8 France 97 works
  9. 9 Singapore 92 works
  10. 10 Belgium 76 works

How concentrated that is

The same countries as shares of everything the list above accounts for. A node where two countries do two thirds of the work and one spread evenly across twelve read alike as a ranking and not at all alike here.

China: 34.7%United States: 20.7%South Korea: 9.3%Japan: 9.1%6 others listed: 26.2%35%largest
China1,226 · 34.7%United States731 · 20.7%South Korea329 · 9.3%Japan320 · 9.1%6 others listed926 · 26.2%

Shares of the rows listed above, not of the whole node.

Which institutions lead 3D IC and TSV technologies research?

By volume in 2022-now, Chinese Academy of Sciences publishes the most 3D IC and TSV technologies research, followed by Samsung (South Korea) and Agency for Science, Technology and Research.

By volume, 2022-now

  1. 1 Chinese Academy of SciencesChina 92 works
  2. 2 Samsung (South Korea)South Korea 77 works
  3. 3 Agency for Science, Technology and ResearchSingapore 62 works
  4. 4 Intel (United States)United States 59 works
  5. 5 IMECBelgium 58 works
  6. 6 Georgia Institute of TechnologyUnited States 46 works
  7. 7 Fraunhofer-GesellschaftGermany 44 works
  8. 8 Harbin Institute of TechnologyChina 43 works
  9. 9 National Yang Ming Chiao Tung UniversityTaiwan 42 works
  10. 10 Xidian UniversityChina 41 works

Who are the leading researchers in 3D IC and TSV technologies?

The most-cited researchers publishing on 3D IC and TSV technologies include Róbert Langer, Kai You Wang and Zhenan Bao.

  1. 1 Róbert Langer United States 303k citations
  2. 2 Kai You Wang China 224k citations
  3. 3 Zhenan Bao United States 187k citations
  4. 4 L. Masetti France 178k citations
  5. 5 Lin Gu China 159k citations

Ranked by citations received across their whole record, among researchers with at least three works on this topic.

What are the most cited papers in 3D IC and TSV technologies?

The most cited paper in 3D IC and TSV technologies is "Fracture Toughness Determinations by Indentation" (Anthony Glyn Evans, E.A. Charles, 1976), with 2,344 citations. Next come "Lead-free Solders in Microelectronics" (1,970) and "The future of wires" (1,441).

Most cited papers
#PaperReleasedCitations
1 Fracture Toughness Determinations by Indentation Anthony Glyn Evans, E.A. Charles · Journal of the American Ceramic Society Jul 1976 2,344
2 Lead-free Solders in Microelectronics Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports Jun 2000 1,970
3 The future of wires R. Ho, Ken Mai, Mark Horowitz · Proceedings of the IEEE Apr 2001 1,441
4 Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports Jun 2002 1,367
5 Equivalent Circuit Models for Three-Dimensional Multiconductor Systems Albert E. Ruehli · IEEE Transactions on Microwave Theory and Techniques Mar 1974 1,269
All 100 most cited papers, with filters and sorting

Where is 3D IC and TSV technologies research done?

The largest centres of 3D IC and TSV technologies research in 2022-now are Beijing (China), Seoul (South Korea), Shanghai (China) and Tokyo (Japan). Among places with at least 20 works in it, it is an unusually large share of all research in Santa Clara.

Largest cities, 2022-now

  1. 1 BeijingChina 270 works
  2. 2 SeoulSouth Korea 194 works
  3. 3 ShanghaiChina 132 works
  4. 4 TokyoJapan 123 works
  5. 5 HsinchuTaiwan 118 works
  6. 6 SingaporeSingapore 92 works
  7. 7 Xi'anChina 73 works
  8. 8 LeuvenBelgium 63 works
  9. 9 Santa ClaraUnited States 60 works
  10. 10 TaipeiTaiwan 58 works

Where it is the local speciality

  1. Santa ClaraUS · 60.4 works60×
← less than its size predicts1×more →

Location quotient: how much more of its research is in 3D IC and TSV technologies than the world average.

See 3D IC and TSV technologies on the map

Where is the best place to study 3D IC and TSV technologies?

Among universities, judged by research, Harbin Institute of Technology, National Yang Ming Chiao Tung University and City University of Hong Kong score highest, combining excellence, specialisation, size, growth and international reach. Research strength is one signal when choosing where to study; it does not measure teaching.

0%20%40%mean 17.35%fractional works in this field (log) →share of work in the world top 10% →City University of H…Harbin Institute of …National Yang Ming C…Xidian University
above the meannear itbelow it

One dot per university in the first ten of the table below, at the default weights. The upper left is the interesting corner: small places doing unusually strong work.

Excellenceshare of its work in the world top 10%, 2022-now and all time averaged
40%
Specialisationhow much of its work is in this field, counted up to 10× the world share
10%
Sizeits output in this field, on a log scale
30%
Growthoutput growth, counted from -20% to +20%
10%
Internationalshare of its work with a co-author abroad
10%
Each slider sets a weight; the share it gets of the score is beside it.
#UniversityScoreTop 10%SpecialisationWorksGrowth
1Harbin Institute of TechnologyChina 72.720.1%7.6×43 +38.1%
2National Yang Ming Chiao Tung UniversityTaiwan 71.119.6%30.3×42 +38.7%
3City University of Hong KongChina 70.333.8%5.0×10 +232.3%
4Xidian UniversityChina 64.715.0%16.2×41 +98.6%
5Georgia Institute of TechnologyUnited States 62.815.3%21.5×46 -12.2%
6Xiamen University of TechnologyChina 59.326.6%19.0×14 +190.8%
7Seoul National University of Science and TechnologySouth Korea 57.114.0%54.3×25 +59.2%
8National Tsing Hua UniversityTaiwan 56.58.5%33.1×27 +25.2%
9Dalian University of TechnologyChina 55.614.7%7.0×23 +19.3%
10National Taiwan UniversityTaiwan 54.15.9%11.3×25 +38.8%

Universities only. The score blends excellence (40%), size (30%), specialisation (10%), growth (10%), international reach (10%), 2022-now; growth compares 2018-21 with 2022-25 and counts up to +20%, since a jump from a small base is mostly noise.

Every institution in 3D IC and TSV technologies, country by country

Is 3D IC and TSV technologies research growing?

Output in 2022-2025 was 21% higher than in 2018-2021, peaking in 2002. The fastest-growing topics are 3D IC and TSV technologies.

still counting19801990200020102020
grewheldshrank

The same series as a ribbon: one cell per year, darker for more. The line above answers how much; this answers when.

Its share of all research

Growing output can still be a shrinking share: all of science grows. This is 3D IC and TSV technologies as a percentage of every work published that year, 0.018% in 2024.

still counting0.050%0.10%3D IC and TSV technologies0.019% in 202519801990200020102020

Fractional works of 3D IC and TSV technologies over all fractional works that year. How the balance of science has shifted.

How much of it reaches the world top 10%

Year by year.

still counting5%10%15%3D IC and TSV technologies9.7% in 2025200020102020

Of each year's works in it, the share that reached the world's 10% most cited for their field and year. A field is the world for its own topics, so there is no other line to hold it against.

Which topics inside it are moving

Growth and decline on one axis around a shared zero. Two lists side by side hide the thing that matters: whether the growth dwarfs the decline, or the other way round.

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