3D IC and TSV technologies

3D IC and TSV technologies is a research topic within Electrical and Electronic Engineering. Science Explorer counts 26k research works in it since 1953. 9.9% of them reached the world's top 10% most cited for their field and year.

This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.

• Through-Silicon Via
• Interconnect
• Wafer Bonding
• Thermal Management
• System Integration
• TSV Technology
• Microarchitecture
• Heterogeneous Integration
• Electrical Modeling
• Chip Stacking