Most cited papers in 3D IC and TSV technologies

3D IC and TSV technologies

What are the most cited papers in 3D IC and TSV technologies?

The most cited paper in 3D IC and TSV technologies is "Fracture Toughness Determinations by Indentation" (Anthony Glyn Evans, E.A. Charles, 1976), with 2,344 citations. Next come "Lead-free Solders in Microelectronics" (1,970) and "The future of wires" (1,441).

Published TypeAccessCitations

Showing 50 of 100 papers. Every paper with more than 301 citations is listed.

Most cited papers, sortable by citations and release date
#	Paper
1	Fracture Toughness Determinations by Indentation Anthony Glyn Evans, E.A. Charles · Journal of the American Ceramic Society	Jul 1976	2,344
2	Lead-free Solders in Microelectronics Mulugeta Abtew, Guna S Selvaduray · Materials Science and Engineering R Reports	Jun 2000	1,970
3	The future of wires R. Ho, Ken Mai, Mark Horowitz · Proceedings of the IEEE	Apr 2001	1,441
4	Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports	Jun 2002	1,367
5	Equivalent Circuit Models for Three-Dimensional Multiconductor Systems Albert E. Ruehli · IEEE Transactions on Microwave Theory and Techniques	Mar 1974	1,269
6	Damascene copper electroplating for chip interconnections Panayotis C. Andricacos, Cyprian E. Uzoh, John O. Dukovic et al. · IBM Journal of Research and Development	Sep 1998	1,226
7	HotSpot: a compact thermal modeling methodology for early-stage VLSI design Wei Huang, Sudeep Ghosh, S. Velusamy et al. · IEEE Transactions on Very Large Scale Integration (VLSI) Systems	May 2006	1,116
8	3-D ICs: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration Kaustav Banerjee, Shukri J. Souri, Pawan Kapur et al. · Proceedings of the IEEE	May 2001	1,030
9	Silicon on insulator material technology MICHEL BRUEL · Electronics Letters	6 Jul 1995	1,015
10	Demystifying 3D ICs: The Pros and Cons of Going Vertical William Rhett Davis, John Wilson, Stephen E. Mick et al. · IEEE Design & Test of Computers	Jun 2005	841
11	Ceramic and Glass‐Ceramic Packaging in the 1990s Rao Tummala · Journal of the American Ceramic Society	May 1991	743
12	Nanomoulding with amorphous metals Golden Kumar, Hong X. Tang, Jan Schroers · Nature	Feb 2009	718
13	Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications Yi Li, Ching Ping Wong · Materials Science and Engineering R Reports	2006	715
14	Three-dimensional integrated circuits Anna W. Topol, Douglas Charles La Tulipe, L. Shi et al. · IBM Journal of Research and Development	Jul 2006	706
15	Recent Advances and Trends in Advanced Packaging John Hon-Shing Lau · IEEE Transactions on Components Packaging and Manufacturing Technology	18 Jan 2022	694
16	Wire routing by optimizing channel assignment within large apertures Akihiro Hashimoto, James D. Stevens Conference paper	1971	682
17	Reliability challenges in 3D IC packaging technology K. N. Tu · Microelectronics Reliability	26 Oct 2010	657
18	Lithography gets extreme Christian C. Wagner, Noreen Harned · Nature Photonics	23 Dec 2009	641
19	Computer-aided design of analog and mixed-signal integrated circuits Georges E. Gielen, Rob A. Rutenbar · Proceedings of the IEEE Open access	Dec 2000	616
20	Die Stacking (3D) Microarchitecture Bryan Black, Daniel Pantuso, Paul A. Reed et al. Conference paper	Dec 2006	607
21	Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs Robert Patti · Proceedings of the IEEE	Jun 2006	604
22	SEMICONDUCTOR WAFER BONDING U. Gösele, Qiaoling Tong · Annual Review of Materials Science	Aug 1998	598
23	Electrical Modeling and Characterization of Through Silicon via for Three-Dimensional ICs Guruprasad Katti, Michele Stucchi, Kristin De Meyer et al. · IEEE Transactions on Electron Devices	Dec 2009	591
24	Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history P. A. Flinn, Donald S. Gardner, William D. Nix · IEEE Transactions on Electron Devices	Mar 1987	591
25	Wafer bonding for silicon-on-insulator technologies J. B. Lasky · Applied Physics Letters	6 Jan 1986	578
26	Interconnect scaling-the real limiter to high performance ULSI Mark T. Bohr Conference paper	19 Nov 2002	552
27	Microelectronics Packaging Handbook Rao Tummala, Eugene J. Rymaszewski, Y. C. Lee · Journal of Electronic Packaging	Sep 1989	535
28	The TimberWolf placement and routing package Carl Sechen, Alberto L. Sangiovanni-Vincentelli · IEEE Journal of Solid-State Circuits	Apr 1985	534
29	A review of lead-free solders for electronics applications Shunfeng Cheng, Chien‐Ming Huang, MICHAEL G. PECHT · Microelectronics Reliability	Jul 2017	529
30	Interconnect limits on gigascale integration (GSI) in the 21st century Jeffrey A. Davis, R. Venkatesan, Alex E. Kaloyeros et al. · Proceedings of the IEEE	Mar 2001	516
31	Silicon-to-silicon direct bonding method Masaru Shimbo, K. Furukawa, Kota Fukuda et al. · Journal of Applied Physics	15 Oct 1986	513
32	A Procedure for Placement of Standard-Cell VLSI Circuits A.E. Dunlop, Brian W. Kernighan · IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems	1985	507
33	Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening H. K. Kim, K. N. Tu · Physical review. B, Condensed matter	15 Jun 1996	506
34	High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Joohee Kim, Jun So Pak, Jonghyun Cho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology	Feb 2011	503
35	Three-dimensional silicon integration John U. Knickerbocker, Paul S. Andry, B. Dang et al. · IBM Journal of Research and Development	Nov 2008	501
36	Electronics Without Lead Yi Li, Kyoung‐sik Moon, Ching Ping Wong · Science	2 Jun 2005	497
37	Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory Carlos H. Mastrangelo, C.H. Hsu · Journal of Microelectromechanical Systems	Mar 1993	491
38	8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology Uksong Kang et al. · IEEE Journal of Solid-State Circuits	2010	488
39	Through-Silicon Via (TSV) Makoto Motoyoshi · Proceedings of the IEEE	2009	481
40	A review: On the development of low melting temperature Pb-free solders Hiren Ramniklal Kotadia, Philip D. Howes, SAMJID H. MANNAN · Microelectronics Reliability	6 Apr 2014	481
41	Overview of transient liquid phase and partial transient liquid phase bonding Grant O. Cook, Carl D. Sorensen · Journal of Materials Science Open access	6 May 2011	470
42	Adhesive wafer bonding Frank Niklaus, Göran Stemme, Jian‐Qiang Lu et al. · Journal of Applied Physics	Feb 2006	469
43	Networks-on-Chip in a Three-Dimensional Environment: A Performance Evaluation Brett Stanley Feero, Partha Pratim Pande · IEEE Transactions on Computers	19 Aug 2008	467
44	Simple formulas for two- and three-dimensional capacitances Takeaki Sakurai, Kiichiro Tamaru · IEEE Transactions on Electron Devices	Feb 1983	464
45	Knights Landing: Second-Generation Intel Xeon Phi Product Avinash Sodani, Roger Gramunt, Jesús Corbal et al. · IEEE Micro	Mar 2016	453
46	Surface activated bonding of silicon wafers at room temperature Hideki Takagi, Kenya Kikuchi, Ryutaro Maeda et al. · Applied Physics Letters	15 Apr 1996	453
47	Hybrid memory cube new DRAM architecture increases density and performance Joe Jeddeloh, Brent Keeth Conference paper	Jun 2012	446
48	Kirkendall void formation in eutectic SnPb solder joints on bare Cu and its effect on joint reliability Kejun Zeng, R.J. Stierman, Tz-Cheng Chiu et al. · Journal of Applied Physics	23 Dec 2004	440
49	Wafer-to-wafer bonding for microstructure formation Martin A. Schmidt · Proceedings of the IEEE	1998	434
50	A thermal-driven floorplanning algorithm for 3D ICs J. Cong, Jie Wei, Yan Zhang Conference paper	22 Feb 2005	432

Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for a field when OpenAlex files it under one of the field's topics; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.