Jun Wei
Jun Wei publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Materials Chemistry, on topics such as Additive Manufacturing Materials and Processes, Additive Manufacturing and 3D Printing Technologies and Electronic Packaging and Soldering Technologies.
- World rank
- #62,053 of 1,633,909 ranked researchers
- Rank in Singapore
- #237 of 5,048
- Works
- 101
- Citations
- 750
- Citations per work
- 7.4
What does Jun Wei research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering19% of their works
- 2Mechanical Engineering16% of their works
- 3Materials Chemistry9% of their works
- 4Automotive Engineering6% of their works
- 5Biomedical Engineering5% of their works
- 6Mechanics of Materials5% of their works
Research topics
- Additive Manufacturing Materials and Processes
- Additive Manufacturing and 3D Printing Technologies
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- High Entropy Alloys Studies
- Welding Techniques and Residual Stresses
- Advanced Sensor and Energy Harvesting Materials
- Photopolymerization techniques and applications
Which keywords describe Jun Wei's research?
The keywords of their largest research topics: Additive Manufacturing, Mechanical Properties, Microstructure, Metallic Components, Selective Laser Melting, 3D Printing, Interfacial Reactions and Lead-free Solders.
- Photoinitiation
- Nanogenerators
- Residual Stress
- High-Entropy Alloys
- Interconnect
- Lead-free Solders
- 3D Printing
- Metallic Components
- Mechanical Properties
- Additive Manufacturing
- Microstructure
- Selective Laser Melting
- Interfacial Reactions
- Materials
- Through-Silicon Via
- Multi-Component Alloys
- Welding
- Wearable
- Polymerization
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- Additive Manufacturing182 topics
- Mechanical Properties152 topics
- Microstructure152 topics
- Metallic Components101 topic
- Selective Laser Melting101 topic
- 3D Printing81 topic
- Interfacial Reactions81 topic
- Lead-free Solders81 topic
- Materials81 topic
- Interconnect71 topic
- Through-Silicon Via71 topic
- High-Entropy Alloys51 topic
- Multi-Component Alloys51 topic
- Residual Stress41 topic
- Welding41 topic
- Nanogenerators31 topic
- Wearable31 topic
- Photoinitiation21 topic
- Polymerization21 topic
Where does Jun Wei work?
Jun Wei's main affiliation in the publication record is Singapore Institute of Manufacturing Technology, Singapore.
How many publications and citations does Jun Wei have?
Science Explorer counts 101 works and 750 citations for Jun Wei, ranking #62,053 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named Jun Wei
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