T.C. Chai
T.C. Chai publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Atomic and Molecular Physics, and Optics, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advanced Surface Polishing Techniques.
- World rank
- #1,299,636 of 1,633,909 ranked researchers
- Rank in Singapore
- #4,284 of 5,048
- Works
- 15
- Citations
- 16
- Citations per work
- 1.1
What does T.C. Chai research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering67% of their works
- 2Mechanics of Materials11% of their works
- 3Atomic and Molecular Physics, and Optics11% of their works
- 4Mechanical Engineering6% of their works
- 5Biomedical Engineering6% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Surface Polishing Techniques
- Photonic and Optical Devices
- Electromagnetic Compatibility and Noise Suppression
- Aluminum Alloys Composites Properties
- Material Properties and Processing
- Adhesion, Friction, and Surface Interactions
Which keywords describe T.C. Chai's research?
The keywords of their largest research topics: Nanoparticles, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Adhesion, Chemical Mechanical Planarization and Electromagnetic Compatibility.
- Reinforcement
- Optical Modulators
- Material Removal Mechanism
- Fiber Networks
- EMI
- Adhesion
- Lead-free Solders
- Interconnect
- Nanoparticles
- Interfacial Reactions
- Through-Silicon Via
- Chemical Mechanical Planarization
- Electromagnetic Compatibility
- Gecko
- Metal Matrix Composites
- Paper Mechanics
- Silicon Photonics
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 17 words, with their numbers
- Nanoparticles62 topics
- Interconnect51 topic
- Interfacial Reactions51 topic
- Lead-free Solders51 topic
- Through-Silicon Via51 topic
- Adhesion11 topic
- Chemical Mechanical Planarization11 topic
- EMI11 topic
- Electromagnetic Compatibility11 topic
- Fiber Networks11 topic
- Gecko11 topic
- Material Removal Mechanism11 topic
- Metal Matrix Composites11 topic
- Optical Modulators11 topic
- Paper Mechanics11 topic
- Reinforcement11 topic
- Silicon Photonics11 topic
Where does T.C. Chai work?
T.C. Chai's main affiliation in the publication record is Institute of Microelectronics, Singapore.
How many publications and citations does T.C. Chai have?
Science Explorer counts 15 works and 16 citations for T.C. Chai, ranking #1,299,636 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.