Yongping Lei
Yongping Lei publishes mostly in Mechanical Engineering, Electrical and Electronic Engineering and Materials Chemistry, on topics such as Electronic Packaging and Soldering Technologies, Welding Techniques and Residual Stresses and 3D IC and TSV technologies.
- World rank
- #214,633 of 1,633,909 ranked researchers
- Rank in China
- #9,909 of 187,979
- Works
- 52
- Citations
- 229
- Citations per work
- 4.4
What does Yongping Lei research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Mechanical Engineering35% of their works
- 2Electrical and Electronic Engineering22% of their works
- 3Materials Chemistry8% of their works
- 4Mechanics of Materials6% of their works
- 5Automotive Engineering4% of their works
- 6Computational Mechanics4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Welding Techniques and Residual Stresses
- 3D IC and TSV technologies
- Additive Manufacturing Materials and Processes
- High Entropy Alloys Studies
- Additive Manufacturing and 3D Printing Technologies
- Advanced materials and composites
- Metal Alloys Wear and Properties
Which keywords describe Yongping Lei's research?
The keywords of their largest research topics: Mechanical Properties, Microstructure, Additive Manufacturing, Interfacial Reactions, Lead-free Solders, Residual Stress, Welding and Interconnect.
- Sintering
- Cryogenic Treatment
- 3D Printing
- Multi-Component Alloys
- High-Entropy Alloys
- Interconnect
- Residual Stress
- Interfacial Reactions
- Microstructure
- Mechanical Properties
- Additive Manufacturing
- Lead-free Solders
- Welding
- Through-Silicon Via
- Metallic Components
- Selective Laser Melting
- Cemented Carbides
- Materials
- Wear Resistance
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 19 words, with their numbers
- Mechanical Properties144 topics
- Microstructure144 topics
- Additive Manufacturing72 topics
- Interfacial Reactions71 topic
- Lead-free Solders71 topic
- Residual Stress71 topic
- Welding71 topic
- Interconnect61 topic
- Through-Silicon Via61 topic
- High-Entropy Alloys41 topic
- Metallic Components41 topic
- Multi-Component Alloys41 topic
- Selective Laser Melting41 topic
- 3D Printing31 topic
- Cemented Carbides31 topic
- Cryogenic Treatment31 topic
- Materials31 topic
- Sintering31 topic
- Wear Resistance31 topic
Where does Yongping Lei work?
Yongping Lei's main affiliation in the publication record is Beijing University of Technology, China.
How many publications and citations does Yongping Lei have?
Science Explorer counts 52 works and 229 citations for Yongping Lei, ranking #214,633 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.