Institution · Advanced Semiconductor Engineering (Taiwan)
Most cited papers from Advanced Semiconductor Engineering (Taiwan)
What are the most cited papers from Advanced Semiconductor Engineering (Taiwan)?
The most cited paper from Advanced Semiconductor Engineering (Taiwan) is "Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints" (Chih Chen, Hua-Ching Tong, K. N. Tu, 2010), with 288 citations. Next come "M-S-QUAL: Mobile service quality measurement" (198) and "Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition" (181).
Showing 50 of 60 papers. Every paper with more than 48 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Electromigration and Thermomigration in Pb-Free Flip-Chip Solder Joints Chih Chen, Hua-Ching Tong, K. N. Tu · Annual Review of Materials Research | Jun 2010 | 288 |
| 2 | M-S-QUAL: Mobile service quality measurement Eugenia Y. Huang, Sheng-Wei Lin, Ya-Chu Fan · Electronic Commerce Research and Applications | 22 Jan 2015 | 198 |
| 3 | Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability | 16 Aug 2005 | 181 |
| 4 | Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples Ping‐Feng Yang, Yi‐Shao Lai, Sheng‐Rui Jian et al. · Materials Science and Engineering A | 20 Aug 2007 | 166 |
| 5 | Thermomigration in SnPb composite flip chip solder joints Annie T. Huang, Andriy M. Gusak, K. N. Tu et al. · Applied Physics Letters | 3 Apr 2006 | 159 |
| 6 | An Enhanced Hierarchical Clustering Approach for Mobile Sensor Networks Using Fuzzy Inference Systems Jin‐Shyan Lee, Chih-Lin Teng · IEEE Internet of Things Journal | 2 Jun 2017 | 149 |
| 7 | An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer Chang-Chi Lee, C.-P Hung, Calvin Cheung et al. | May 2016 | 141 |
| 8 | Multipeak fitting analysis of Raman spectra on DLCH film F. C. Tai, S. C. Lee, Jiunn Chen et al. · Journal of Raman Spectroscopy | 3 Mar 2009 | 123 |
| 9 | Formation and resettlement of (AuxNi1−x)Sn4 in solder joints of ball-grid-array packages with the Au/Ni surface finish Cheng–En Ho, Ruixiao Zheng, Gan Luo et al. · Journal of Electronic Materials | Oct 2000 | 121 |
| 10 | Novel Cu-to-Cu Bonding With Ti Passivation at 180$^{\circ}{\rm C}$ in 3-D Integration Yan-Pin Huang, Yu-San Chien, Ruoh-Ning Tzeng et al. · IEEE Electron Device Letters | 19 Nov 2013 | 118 |
| 11 | Investigation of Thermomechanical Behaviors of Flip Chip BGA Packages During Manufacturing Process and Thermal Cycling Ming-Yi Tsai, C. H. Hsu, C.T.O. Wang · IEEE Transactions on Components and Packaging Technologies | Sep 2004 | 113 |
| 12 | Room-temperature nanoimprint and nanotransfer printing using hydrogen silsequioxane Satoshi� Matsui, Y. Igaku, H. Ishigaki et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena | 12 Feb 2003 | 92 |
| 13 | Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate Yuan-Ting Lin, Wei‐Hong Lai, Chin‐Li Kao et al. | May 2016 | 88 |
| 14 | Support excitation scheme for transient analysis of JEDEC board-level drop test Chang-Lin Yeh, Yi‐Shao Lai · Microelectronics Reliability | 2 Apr 2005 | 88 |
| 15 | Elimination of voids in reactions between Ni and Sn: A novel effect of silver H. Y. Chuang, Jinran Yu, M. S. Kuo et al. · Scripta Materialia | 27 Oct 2011 | 84 |
| 16 | Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling E. H. S. WONG, Cheryl Selvanayagam, S.K.W. Seah et al. · Journal of Electronic Materials | 5 Mar 2008 | 79 |
| 17 | Improved UV-Sensing of Au-Decorated ZnO Nanostructure MSM Photodetectors Yen‐Lin Chu, Yi-Hsing Liu, Tung-Te Chu et al. · IEEE Sensors Journal | 15 Feb 2022 | 77 |
| 18 | A numerical study of factors affecting the characterization of nanoindentation on silicon Tong Hong Wang, Te‐Hua Fang, Yu-Cheng Lin · Materials Science and Engineering A | 5 Dec 2006 | 77 |
| 19 | Alloying modification of Sn–Ag–Cu solders by manganese and titanium Li-Wei Lin, Jenn‐Ming Song, Yi‐Shao Lai et al. · Microelectronics Reliability | 21 Nov 2008 | 76 |
| 20 | Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization Yi‐Shao Lai, Ying-Ta Chiu, Jiunn Chen · Journal of Electronic Materials | Jul 2008 | 74 |
| 21 | An aperture-coupled linear microstrip leaky-wave antenna array with two-dimensional dual-beam scanning capability Cheng-Chi Hu, C.F. Jsu, Jin‐Jei Wu · IEEE Transactions on Antennas and Propagation | Jun 2000 | 73 |
| 22 | Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao et al. · Microelectronics Reliability | 4 Nov 2006 | 73 |
| 23 | A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation Dao-Long Chen, Ping‐Feng Yang, Yi‐Shao Lai · Microelectronics Reliability | 3 Nov 2011 | 73 |
| 24 | Fracture strength characterization and failure analysis of silicon dies J.D. Wu, C.-Y. Huang, C.C. Liao · Microelectronics Reliability | 30 Jan 2003 | 72 |
| 25 | The computer simulation of wear behavior appearing in total hip prosthesis James S. Wu, Jui‐Pin Hung, Chi-Shiang Shu et al. · Computer Methods and Programs in Biomedicine | 10 Dec 2002 | 70 |
| 26 | Improvement of the UV-Sensing Performance of Ga-Doped ZnO Nanostructures via a Wet Chemical Solution at Room Temperature Yen‐Lin Chu, Sheng‐Joue Young, Tung-Te Chu et al. · ECS Journal of Solid State Science and Technology | 29 Nov 2021 | 69 |
| 27 | Evaluation of board-level reliability of electronic packages under consecutive drops Chang-Lin Yeh, Yi‐Shao Lai, Chin‐Li Kao · Microelectronics Reliability | 3 Nov 2005 | 68 |
| 28 | Effects of bolt pre-loading variations on performance of GDL in a bolted PEMFC by 3-D FEM analysis Chi‐Hui Chien, Yao-Lun Hu, Ting‐Hsuan Su et al. · Energy | 4 Aug 2016 | 66 |
| 29 | Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering Ping‐Feng Yang, Hua‐Chiang Wen, Sheng‐Rui Jian et al. · Microelectronics Reliability | 24 Oct 2007 | 65 |
| 30 | Advances in the drop-impact reliability of solder joints for mobile applications E. H. S. WONG, S.K.W. Seah, Willem Dirk van Driel et al. · Microelectronics Reliability | 13 Jan 2009 | 64 |
| 31 | The Effect of Epoxy Molding Compound on Thermal/Residual Deformations and Stresses in IC Packages During Manufacturing Process Ming-Yi Tsai, C.T. Wang, C. H. Hsu · IEEE Transactions on Components and Packaging Technologies | 29 Aug 2006 | 63 |
| 32 | Influence of annealing temperature on the structural, optical and mechanical properties of ALD-derived ZnO thin films Cheng-Yo Yen, Sheng‐Rui Jian, G.-J. Chen et al. · Applied Surface Science | 28 Apr 2011 | 63 |
| 33 | Hardware Implementation of RFID Mutual Authentication Protocol Yu‐Jung Huang, Ching-Chien Yuan, Mingkun Chen et al. · IEEE Transactions on Industrial Electronics | 2 Dec 2009 | 61 |
| 34 | An evaluation of effects of molding compound properties on reliability of Cu wire components Peng Su, Hidetoshi Seki, Ping Chen et al. | May 2011 | 61 |
| 35 | Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing Jia-Hong Ke, Tsung‐Lin Yang, Yi‐Sheng Lai et al. · Acta Materialia | 2 Feb 2011 | 61 |
| 36 | Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration Fan-Yi Ouyang, K. N. Tu, Yi-Shao Lai et al. · Applied Physics Letters | 27 Nov 2006 | 61 |
| 37 | Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects Jenn‐Ming Song, Bo-Ron Huang, Cheng‐Yi Liu et al. · Materials Science and Engineering A | Dec 2011 | 60 |
| 38 | Local melting induced by electromigration in flip-chip solder joints Cheng‐Hsien Tsai, Y. L. Lin, Jang‐Zern Tsai et al. · Journal of Electronic Materials | May 2006 | 60 |
| 39 | Characteristics of current crowding in flip-chip solder bumps Yi‐Shao Lai, Chin-Li Kao · Microelectronics Reliability | 8 Apr 2005 | 59 |
| 40 | Multiscale simulation of nanoindentation on Ni (100) thin film Chung-Ting Wang, Sheng‐Rui Jian, J.S.C. Jang et al. · Applied Surface Science | 25 Sep 2008 | 59 |
| 41 | Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon Yen-Hung Lin, Tei-Chen Chen, Ping Yang et al. · Applied Surface Science | 18 Jul 2007 | 59 |
| 42 | Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration Chiung-Wen Lin, Chia-Pao Hsu, Hsueh-An Yang et al. · Journal of Micromechanics and Microengineering | 4 Jan 2008 | 57 |
| 43 | Evaluation of solder joint strengths under ball impact test Yi‐Shao Lai, Hsiao‐Chuan Chang, Chang-Lin Yeh · Microelectronics Reliability | 4 Jan 2007 | 57 |
| 44 | In situ observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints Fan-Yi Ouyang, Chin-Li Kao · Journal of Applied Physics | 15 Dec 2011 | 57 |
| 45 | Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding Jiunn Chen, Yi‐Shao Lai, Yi-Wun Wang et al. · Microelectronics Reliability | 18 Dec 2010 | 56 |
| 46 | Fine pitch copper wire bonding in high volume production Bernd K. Appelt, Andy Tseng, Chun‐Hsiung Chen et al. · Microelectronics Reliability | 7 Jul 2010 | 56 |
| 47 | A fit perspective approach in linking corporate image and intention-to-apply Yu‐Chen Wei, Chao‐Ching Chang, Liang-Yang Lin et al. · Journal of Business Research | 24 Dec 2015 | 55 |
| 48 | A study in flip-chip UBM/bump reliability with effects of SnPb solder composition J.D. Wu, P.J. Zheng, C.W. Lee et al. · Microelectronics Reliability | 18 Mar 2005 | 55 |
| 49 | Growth of CuAl intermetallic compounds in Cu and Cu(Pd) wire bonding Ying-Yu Lu, Y. W. Wang, Bernd K. Appelt et al. | May 2011 | 54 |
| 50 | Effect of current crowding on whisker growth at the anode in flip chip solder joints Fan-Yi Ouyang, Kai Siang Chen, K. N. Tu et al. · Applied Physics Letters | 3 Dec 2007 | 54 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for an institution when any of its authors gave it as an affiliation; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.