Binhao Lian
Binhao Lian publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Industrial and Manufacturing Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #7,276,559 of 7,710,434 ranked researchers
- Rank in China
- #953,324 of 978,568
- Works
- 31
- Citations
- 93
- Citations per work
- 3.0
What does Binhao Lian research?
Binhao Lian's work is mostly in Engineering (92%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences2992.1%
- Engineering2992.1%
- Everything else27.9%
- 1Electrical and Electronic Engineering68% of their works
- 2Mechanical Engineering12% of their works
- 3Industrial and Manufacturing Engineering3% of their works
- 4Mechanics of Materials3% of their works
- 5Biomedical Engineering2% of their works
- 6Automotive Engineering2% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced Welding Techniques Analysis
- Manufacturing Process and Optimization
- Additive Manufacturing and 3D Printing Technologies
- Advanced Surface Polishing Techniques
- Nanomaterials and Printing Technologies
Which keywords describe Binhao Lian's research?
The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Electromagnetic Compatibility, EMI, Friction Stir Welding and Processing.
- Transparent Electrodes
- Inkjet Printing
- Additive Manufacturing
- Design for Manufacture
- Processing
- Electromagnetic Compatibility
- Through-Silicon Via
- Lead-free Solders
- Interfacial Reactions
- Interconnect
- EMI
- Friction Stir Welding
- Assembly Planning
- 3D Printing
- Chemical Mechanical Planarization
- Material Removal Mechanism
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interfacial Reactions241 topic
- Lead-free Solders241 topic
- Interconnect231 topic
- Through-Silicon Via231 topic
- EMI71 topic
- Electromagnetic Compatibility71 topic
- Friction Stir Welding61 topic
- Processing61 topic
- Assembly Planning31 topic
- Design for Manufacture31 topic
- 3D Printing21 topic
- Additive Manufacturing21 topic
- Chemical Mechanical Planarization21 topic
- Inkjet Printing21 topic
- Material Removal Mechanism21 topic
- Transparent Electrodes21 topic
Where does Binhao Lian work?
Binhao Lian's main affiliation in the publication record is Beijing Microelectronics Technology Institute, China.
How many publications and citations does Binhao Lian have?
OpenAlex counts 31 works and 93 citations for Binhao Lian, an h-index of 5, ranking #7,276,559 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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