Fei Qin
Fei Qin publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Advanced Surface Polishing Techniques.
- World rank
- #927,006 of 1,633,909 ranked researchers
- Rank in China
- #80,717 of 187,979
- Works
- 65
- Citations
- 90
- Citations per work
- 1.4
What does Fei Qin research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering38% of their works
- 2Mechanical Engineering20% of their works
- 3Mechanics of Materials9% of their works
- 4Biomedical Engineering7% of their works
- 5Aerospace Engineering4% of their works
- 6Computational Mechanics4% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced Surface Polishing Techniques
- Metal Forming Simulation Techniques
- Integrated Circuits and Semiconductor Failure Analysis
- Aluminum Alloys Composites Properties
- Military Technology and Strategies
- Advanced machining processes and optimization
Which keywords describe Fei Qin's research?
The keywords of their largest research topics: Nanoparticles, Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Tool Wear, Chemical Mechanical Planarization and Material Removal Mechanism.
- Surface Integrity
- Machining
- Reinforcement
- Integrated Circuits
- Sheet Metal Forming
- Material Removal Mechanism
- Tool Wear
- Interconnect
- Interfacial Reactions
- Nanoparticles
- Lead-free Solders
- Through-Silicon Via
- Chemical Mechanical Planarization
- Ductile Fracture
- Failure Analysis
- Metal Matrix Composites
- Air Force
- Modernization
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Nanoparticles192 topics
- Interfacial Reactions151 topic
- Lead-free Solders151 topic
- Interconnect101 topic
- Through-Silicon Via101 topic
- Tool Wear92 topics
- Chemical Mechanical Planarization61 topic
- Material Removal Mechanism61 topic
- Ductile Fracture51 topic
- Sheet Metal Forming51 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
- Metal Matrix Composites41 topic
- Reinforcement41 topic
- Air Force31 topic
- Machining31 topic
- Modernization31 topic
- Surface Integrity31 topic
Where does Fei Qin work?
Fei Qin's main affiliation in the publication record is Beijing University of Technology, China.
How many publications and citations does Fei Qin have?
Science Explorer counts 65 works and 90 citations for Fei Qin, ranking #927,006 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named Fei Qin
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