H. Reichl
H. Reichl publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #382,826 of 1,633,909 ranked researchers
- Rank in Germany
- #22,852 of 86,443
- Works
- 147
- Citations
- 391
- Citations per work
- 2.7
What does H. Reichl research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering60% of their works
- 2Mechanical Engineering5% of their works
- 3Mechanics of Materials5% of their works
- 4Automotive Engineering4% of their works
- 5Industrial and Manufacturing Engineering3% of their works
- 6Industrial and Manufacturing Engineering3% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor Lasers and Optical Devices
- Adhesion, Friction, and Surface Interactions
- Additive Manufacturing and 3D Printing Technologies
- Recycling and Waste Management Techniques
- Integrated Circuits and Semiconductor Failure Analysis
Which keywords describe H. Reichl's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Electromagnetic Compatibility, EMI, Optical Interconnects and Semiconductor Lasers.
- Integrated Circuits
- Recycling
- Additive Manufacturing
- Gecko
- Semiconductor Lasers
- Electromagnetic Compatibility
- Lead-free Solders
- Through-Silicon Via
- Interconnect
- Interfacial Reactions
- EMI
- Optical Interconnects
- Adhesion
- 3D Printing
- E-Waste
- Failure Analysis
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 16 words, with their numbers
- Interconnect361 topic
- Through-Silicon Via361 topic
- Interfacial Reactions311 topic
- Lead-free Solders311 topic
- EMI131 topic
- Electromagnetic Compatibility131 topic
- Optical Interconnects81 topic
- Semiconductor Lasers81 topic
- Adhesion71 topic
- Gecko71 topic
- 3D Printing61 topic
- Additive Manufacturing61 topic
- E-Waste51 topic
- Recycling51 topic
- Failure Analysis41 topic
- Integrated Circuits41 topic
Where does H. Reichl work?
H. Reichl's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.
How many publications and citations does H. Reichl have?
Science Explorer counts 147 works and 391 citations for H. Reichl, ranking #382,826 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.