Jackson Kong
Jackson Kong publishes mostly in Electrical and Electronic Engineering, Civil and Structural Engineering and Mechanics of Materials, on topics such as 3D IC and TSV technologies, Electromagnetic Compatibility and Noise Suppression and Structural Load-Bearing Analysis.
- World rank
- #1,395,884 of 1,633,909 ranked researchers
- Rank in Malaysia
- #5,789 of 7,538
- Works
- 16
- Citations
- 16
- Citations per work
- 1.0
What does Jackson Kong research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering62% of their works
- 2Civil and Structural Engineering14% of their works
- 3Mechanics of Materials10% of their works
- 4Mechanical Engineering5% of their works
- 5Astronomy and Astrophysics5% of their works
- 6Control and Systems Engineering5% of their works
Research topics
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Structural Load-Bearing Analysis
- Electronic Packaging and Soldering Technologies
- Composite Structure Analysis and Optimization
- Topology Optimization in Engineering
- Thermal Analysis in Power Transmission
- Semiconductor materials and devices
Which keywords describe Jackson Kong's research?
The keywords of their largest research topics: Buckling Behavior, Interconnect, Through-Silicon Via, Electromagnetic Compatibility, EMI, Finite Element Method, Composite Plates and Concrete-Filled Steel Tubes.
- Thermal Analysis
- Level Set Method
- Dynamic Line Rating
- Structural Engineering
- Interfacial Reactions
- Concrete-Filled Steel Tubes
- Finite Element Method
- EMI
- Interconnect
- Buckling Behavior
- Through-Silicon Via
- Electromagnetic Compatibility
- Composite Plates
- Functionally Graded Materials
- Lead-free Solders
- Atomic Layer Deposition
- High-k Dielectrics
- Sensitivity Analysis
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Buckling Behavior42 topics
- Interconnect41 topic
- Through-Silicon Via41 topic
- EMI31 topic
- Electromagnetic Compatibility31 topic
- Finite Element Method32 topics
- Composite Plates21 topic
- Concrete-Filled Steel Tubes21 topic
- Functionally Graded Materials21 topic
- Interfacial Reactions21 topic
- Lead-free Solders21 topic
- Structural Engineering21 topic
- Atomic Layer Deposition11 topic
- Dynamic Line Rating11 topic
- High-k Dielectrics11 topic
- Level Set Method11 topic
- Sensitivity Analysis11 topic
- Thermal Analysis11 topic
Where does Jackson Kong work?
Jackson Kong's main affiliation in the publication record is Intel (Malaysia), Malaysia.
How many publications and citations does Jackson Kong have?
Science Explorer counts 16 works and 16 citations for Jackson Kong, ranking #1,395,884 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.