Jianfeng Li
Jianfeng Li publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Aerospace Engineering, on topics such as Electronic Packaging and Soldering Technologies, Silicon Carbide Semiconductor Technologies and 3D IC and TSV technologies.
- World rank
- #434,108 of 1,633,909 ranked researchers
- Rank in United Kingdom
- #37,001 of 90,785
- Works
- 60
- Citations
- 176
- Citations per work
- 2.9
What does Jianfeng Li research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering28% of their works
- 2Mechanical Engineering20% of their works
- 3Aerospace Engineering8% of their works
- 4Materials Chemistry8% of their works
- 5Civil and Structural Engineering7% of their works
- 6Mechanics of Materials7% of their works
Research topics
- Electronic Packaging and Soldering Technologies
- Silicon Carbide Semiconductor Technologies
- 3D IC and TSV technologies
- Advanced materials and composites
- Electromagnetic Compatibility and Noise Suppression
- Advanced machining processes and optimization
- Bluetooth and Wireless Communication Technologies
- Antenna Design and Analysis
Which keywords describe Jianfeng Li's research?
The keywords of their largest research topics: High-Temperature Electronics, Thermal Management, Interfacial Reactions, Lead-free Solders, Cemented Carbides, Interconnect, Reliability and Sintering.
- Wireless Technology
- Bluetooth Low Energy
- Surface Integrity
- Electromagnetic Compatibility
- Wide Bandgap Semiconductors
- Sintering
- Interconnect
- Lead-free Solders
- Thermal Management
- High-Temperature Electronics
- Interfacial Reactions
- Cemented Carbides
- Reliability
- Through-Silicon Via
- EMI
- Machining
- Antenna
- Microstrip
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- High-Temperature Electronics92 topics
- Thermal Management82 topics
- Interfacial Reactions51 topic
- Lead-free Solders51 topic
- Cemented Carbides41 topic
- Interconnect41 topic
- Reliability41 topic
- Sintering41 topic
- Through-Silicon Via41 topic
- Wide Bandgap Semiconductors41 topic
- EMI31 topic
- Electromagnetic Compatibility31 topic
- Machining31 topic
- Surface Integrity31 topic
- Antenna21 topic
- Bluetooth Low Energy21 topic
- Microstrip21 topic
- Wireless Technology21 topic
Where does Jianfeng Li work?
Jianfeng Li's main affiliation in the publication record is University of Nottingham, United Kingdom.
How many publications and citations does Jianfeng Li have?
Science Explorer counts 60 works and 176 citations for Jianfeng Li, ranking #434,108 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named Jianfeng Li
- jianfeng-li-nanjing-university-of-aeronautics-and-astronautics
- jianfeng-li-university-of-electronic-science-and-technology-of-china
- jianfeng-li-shandong-university
- jianfeng-li-hong-kong-baptist-university
- jianfeng-li-sun-yat-sen-university
- jianfeng-li-shanxi-university
- jianfeng-li-hiroshima-city-university
- jianfeng-li-shandong-university-china
- jianfeng-li-lanzhou-jiaotong-university
- jianfeng-li-peking-university
- jianfeng-li-university-of-chinese-academy-of-sciences
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