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Researcher · Emerson (United States) · United States

Paul L. Morganelli

Paul L. Morganelli publishes mostly in Electrical and Electronic Engineering, Mechanical Engineering and Mechanics of Materials, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Epoxy Resin Curing Processes.

OpenAlex
World rank
#4,413,438
of 7,710,434 ranked researchers
Rank in United States
#1,179,316
of 1,627,098
Works
17
Citations
347
Citations per work
20.4
h-index
6
i10-index 6Top 82% in Electrical and Electronic Engineering
Paul L. Morganelli

What does Paul L. Morganelli research?

Paul L. Morganelli's work is mostly in Engineering (62%), Chemistry (9%), Materials Science (6%).

Physical Sciences: 13 works · 76.7% of their workEngineering: 10 works · 61.7% of their workElectrical and Electronic Engineering: 7 works · 38.3% of their workMechanical Engineering: 3 works · 14.9% of their workMechanics of Materials: 1 works · 8.5% of their workChemistry: 1 works · 8.6% of their workOrganic Chemistry: 1 works · 4.3% of their workPhysical and Theoretical Chemistry: 1 works · 4.3% of their workMaterials Science: 1 works · 6.4% of their workPolymers and Plastics: 1 works · 6.4% of their workEverything else: 4 works · 23.3% of their workTHEIR WORKPaul L.Morganelli17works
Physical Sciences77%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering1061.7%
    2. Chemistry18.6%
    3. Materials Science16.4%
  2. Everything else423.3%
  1. 1Electrical and Electronic Engineering38% of their works
  2. 2Mechanical Engineering15% of their works
  3. 3Mechanics of Materials8% of their works
  4. 4Polymers and Plastics6% of their works
  5. 5Organic Chemistry4% of their works
  6. 6Physical and Theoretical Chemistry4% of their works

Research topics

Which keywords describe Paul L. Morganelli's research?

The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Epoxy Resins, Fiber Networks, Paper Mechanics and Polybenzoxazines.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 16 words, with their numbers
  1. Interfacial Reactions81 topic
  2. Lead-free Solders81 topic
  3. Interconnect61 topic
  4. Through-Silicon Via61 topic
  5. Epoxy Resins31 topic
  6. Fiber Networks31 topic
  7. Paper Mechanics31 topic
  8. Polybenzoxazines31 topic
  9. Elemental Sulfur21 topic
  10. Injection Molding21 topic
  11. Inkjet Printing21 topic
  12. Molecular Electronics21 topic
  13. Optimization21 topic
  14. Polyimides21 topic
  15. Self-Assembled Monolayers21 topic
  16. Transparent Electrodes21 topic

Where does Paul L. Morganelli work?

Paul L. Morganelli's main affiliation in the publication record is Emerson (United States), United States.

How many publications and citations does Paul L. Morganelli have?

OpenAlex counts 17 works and 347 citations for Paul L. Morganelli, an h-index of 6, ranking #4,413,438 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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