R. Aschenbrenner
R. Aschenbrenner publishes mostly in Electrical and Electronic Engineering, Automotive Engineering and Industrial and Manufacturing Engineering, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Additive Manufacturing and 3D Printing Technologies.
- World rank
- #384,942 of 1,633,909 ranked researchers
- Rank in Germany
- #22,982 of 86,443
- Works
- 58
- Citations
- 148
- Citations per work
- 2.6
What does R. Aschenbrenner research?
Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.
- 1Electrical and Electronic Engineering59% of their works
- 2Automotive Engineering13% of their works
- 3Industrial and Manufacturing Engineering9% of their works
- 4Mechanics of Materials5% of their works
- 5Biomedical Engineering4% of their works
- 6Materials Chemistry1% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Additive Manufacturing and 3D Printing Technologies
- Flexible and Reconfigurable Manufacturing Systems
- Manufacturing Process and Optimization
- Microfluidic and Capillary Electrophoresis Applications
- Advanced MEMS and NEMS Technologies
- Material Properties and Processing
Which keywords describe R. Aschenbrenner's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Thermal Behavior, Interfacial Reactions, Lead-free Solders, 3D Printing, Additive Manufacturing and Materials.
- Silicon
- Paper Mechanics
- Lab-on-a-Chip
- Design for Manufacture
- Reconfigurable Manufacturing Systems
- Materials
- 3D Printing
- Interfacial Reactions
- Through-Silicon Via
- Interconnect
- Thermal Behavior
- Lead-free Solders
- Additive Manufacturing
- Flexible Automation
- Assembly Planning
- Fiber Networks
- MEMS
- Poly(dimethylsiloxane)
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.
All 18 words, with their numbers
- Interconnect221 topic
- Through-Silicon Via221 topic
- Thermal Behavior192 topics
- Interfacial Reactions171 topic
- Lead-free Solders171 topic
- 3D Printing122 topics
- Additive Manufacturing101 topic
- Materials101 topic
- Flexible Automation41 topic
- Reconfigurable Manufacturing Systems41 topic
- Assembly Planning31 topic
- Design for Manufacture31 topic
- Fiber Networks21 topic
- Lab-on-a-Chip21 topic
- MEMS21 topic
- Paper Mechanics21 topic
- Poly(dimethylsiloxane)21 topic
- Silicon21 topic
Where does R. Aschenbrenner work?
R. Aschenbrenner's main affiliation in the publication record is Fraunhofer Institute for Reliability and Microintegration, Germany.
How many publications and citations does R. Aschenbrenner have?
Science Explorer counts 58 works and 148 citations for R. Aschenbrenner, ranking #384,942 of 1,633,909 researchers worldwide on the composite score.
Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Other researchers named R. Aschenbrenner
Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.