Steven G. Rosser
Steven G. Rosser publishes mostly in Electrical and Electronic Engineering, Biomedical Engineering and Materials Chemistry, on topics such as 3D IC and TSV technologies, Electronic Packaging and Soldering Technologies and Electromagnetic Compatibility and Noise Suppression.
- World rank
- #7,042,729 of 7,710,434 ranked researchers
- Rank in United States
- #1,578,465 of 1,627,098
- Works
- 19
- Citations
- 91
- Citations per work
- 4.8
What does Steven G. Rosser research?
Steven G. Rosser's work is mostly in Engineering (91%), Materials Science (7%), Neuroscience (2%).
Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.
The fields and subfields, with their numbers
- Physical Sciences1998.3%
- Engineering1791.2%
- Materials Science17.1%
- Life Sciences01.8%
- Neuroscience01.8%
- 1Electrical and Electronic Engineering68% of their works
- 2Biomedical Engineering18% of their works
- 3Materials Chemistry5% of their works
- 4Automotive Engineering5% of their works
- 5Electronic, Optical and Magnetic Materials2% of their works
- 6Cellular and Molecular Neuroscience2% of their works
Research topics
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Advanced Sensor and Energy Harvesting Materials
- Dielectric materials and actuators
- Additive Manufacturing and 3D Printing Technologies
- Ferroelectric and Piezoelectric Materials
- Semiconductor materials and devices
Which keywords describe Steven G. Rosser's research?
The keywords of their largest research topics: Interconnect, Through-Silicon Via, Interfacial Reactions, Lead-free Solders, Electromagnetic Compatibility, EMI, Dielectric Elastomers and High Permittivity Polymer Composites.
- High-k Dielectrics
- Lead-free Piezoceramics
- Additive Manufacturing
- Wearable
- High Permittivity Polymer Composites
- Electromagnetic Compatibility
- Lead-free Solders
- Through-Silicon Via
- Interconnect
- Interfacial Reactions
- EMI
- Dielectric Elastomers
- Nanogenerators
- 3D Printing
- Ferroelectric Materials
- Atomic Layer Deposition
Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most. The words come from the keyword list OpenAlex gives each topic, not from the text of the papers, so a word can appear that none of the papers uses.
All 16 words, with their numbers
- Interconnect131 topic
- Through-Silicon Via131 topic
- Interfacial Reactions101 topic
- Lead-free Solders101 topic
- EMI81 topic
- Electromagnetic Compatibility81 topic
- Dielectric Elastomers51 topic
- High Permittivity Polymer Composites51 topic
- Nanogenerators51 topic
- Wearable51 topic
- 3D Printing31 topic
- Additive Manufacturing31 topic
- Ferroelectric Materials31 topic
- Lead-free Piezoceramics31 topic
- Atomic Layer Deposition21 topic
- High-k Dielectrics21 topic
Where does Steven G. Rosser work?
Steven G. Rosser's main affiliation in the publication record is Endicott College, United States.
How many publications and citations does Steven G. Rosser have?
OpenAlex counts 19 works and 91 citations for Steven G. Rosser, an h-index of 6, ranking #7,042,729 of 7,710,434 researchers worldwide on the quality score.
Ranked on field-normalised citation excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.
Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.
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