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Researcher · RTX (United States) · United States

T. E. Wong

T. E. Wong publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, Fatigue and fracture mechanics and 3D IC and TSV technologies.

OpenAlex
World rank
#3,631,342
of 7,710,434 ranked researchers
Rank in United States
#1,009,109
of 1,627,098
Works
29
Citations
285
Citations per work
9.8
h-index
8
i10-index 5Top 66% in Electrical and Electronic Engineering
T. E. Wong

What does T. E. Wong research?

T. E. Wong's work is mostly in Engineering (77%), Materials Science (3%).

Physical Sciences: 23 works · 79.7% of their workEngineering: 22 works · 77.2% of their workElectrical and Electronic Engineering: 8 works · 29.1% of their workMechanics of Materials: 7 works · 24.1% of their workMechanical Engineering: 5 works · 17.7% of their workBiomedical Engineering: 1 works · 3.8% of their workCivil and Structural Engineering: 1 works · 2.5% of their workMaterials Science: 1 works · 2.5% of their workMaterials Chemistry: 1 works · 2.5% of their workEverything else: 6 works · 20.3% of their workTHEIR WORKT. E. Wong29works
Physical Sciences80%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering2277.2%
    2. Materials Science12.5%
  2. Everything else620.3%
  1. 1Electrical and Electronic Engineering29% of their works
  2. 2Mechanics of Materials24% of their works
  3. 3Mechanical Engineering18% of their works
  4. 4Biomedical Engineering4% of their works
  5. 5Materials Chemistry2% of their works
  6. 6Civil and Structural Engineering2% of their works

Research topics

Which keywords describe T. E. Wong's research?

The keywords of their largest research topics: Nanoparticles, Interfacial Reactions, Lead-free Solders, Fatigue Crack Closure, Fracture Toughness Testing, Interconnect, Through-Silicon Via and Guided Lamb Waves.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 17 words, with their numbers
  1. Nanoparticles172 topics
  2. Interfacial Reactions151 topic
  3. Lead-free Solders151 topic
  4. Fatigue Crack Closure71 topic
  5. Fracture Toughness Testing71 topic
  6. Interconnect61 topic
  7. Through-Silicon Via61 topic
  8. Guided Lamb Waves51 topic
  9. Piezoelectric Impedance-Based Health Monitoring51 topic
  10. Ductile Fracture31 topic
  11. Dynamic Recrystallization31 topic
  12. Hot Deformation31 topic
  13. Sheet Metal Forming31 topic
  14. Metal Matrix Composites21 topic
  15. Reinforcement21 topic
  16. Vibration-based Damage Identification21 topic
  17. Wireless Sensors21 topic

Where does T. E. Wong work?

T. E. Wong's main affiliation in the publication record is RTX (United States), United States.

How many publications and citations does T. E. Wong have?

OpenAlex counts 29 works and 285 citations for T. E. Wong, an h-index of 8, ranking #3,631,342 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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