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Researcher · AT&S (Austria) · Austria

Thomas Krivec

Thomas Krivec publishes mostly in Electrical and Electronic Engineering, Mechanics of Materials and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Material Properties and Processing.

ORCID 0009-0006-8698-3416 OpenAlex
World rank
#7,172,752
of 7,710,434 ranked researchers
Rank in Austria
#41,391
of 43,330
Works
50
Citations
282
Citations per work
5.6
h-index
9
i10-index 5Top 59% in Electrical and Electronic Engineering
Thomas Krivec

What does Thomas Krivec research?

Thomas Krivec's work is mostly in Engineering (65%), Materials Science (8%).

Physical Sciences: 36 works · 72.8% of their workEngineering: 33 works · 65.1% of their workElectrical and Electronic Engineering: 17 works · 34.3% of their workMechanics of Materials: 7 works · 13.3% of their workMechanical Engineering: 4 works · 7.7% of their workComputational Mechanics: 3 works · 5.6% of their workIndustrial and Manufacturing Engineering: 2 works · 4.2% of their workMaterials Science: 4 works · 7.7% of their workMaterials Chemistry: 4 works · 7.7% of their workEverything else: 14 works · 27.2% of their workTHEIR WORKThomas Krivec50works
Physical Sciences73%

Their six largest subfields, inside their fields and domains; the grey slice is everything else they publish. The interactive view splits every one of their works down to single topics.

The fields and subfields, with their numbers
    1. Engineering3365.1%
    2. Materials Science47.7%
  2. Everything else1427.2%
  1. 1Electrical and Electronic Engineering34% of their works
  2. 2Mechanics of Materials13% of their works
  3. 3Mechanical Engineering8% of their works
  4. 4Materials Chemistry8% of their works
  5. 5Computational Mechanics6% of their works
  6. 6Industrial and Manufacturing Engineering4% of their works

Research topics

Which keywords describe Thomas Krivec's research?

The keywords of their largest research topics: Interfacial Reactions, Lead-free Solders, Interconnect, Through-Silicon Via, Fiber Networks, Paper Mechanics, Kinetic Analysis and Thermal Decomposition.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 16 words, with their numbers
  1. Interfacial Reactions211 topic
  2. Lead-free Solders211 topic
  3. Interconnect131 topic
  4. Through-Silicon Via131 topic
  5. Fiber Networks71 topic
  6. Paper Mechanics71 topic
  7. Kinetic Analysis61 topic
  8. Thermal Decomposition61 topic
  9. E-Waste51 topic
  10. EMI51 topic
  11. Electromagnetic Compatibility51 topic
  12. Recycling51 topic
  13. Fabric Defect Detection41 topic
  14. Femtosecond Laser41 topic
  15. Machine Vision41 topic
  16. Micromachining41 topic

Where does Thomas Krivec work?

Thomas Krivec's main affiliation in the publication record is AT&S (Austria), Austria.

How many publications and citations does Thomas Krivec have?

OpenAlex counts 50 works and 282 citations for Thomas Krivec, an h-index of 9, ranking #7,172,752 of 7,710,434 researchers worldwide on the quality score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Papers, co-authors, who cited this work and researchers on the nearest topics have tabs of their own, above. Is this your page? Claim it with your ORCID iD, or request a correction or removal.

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