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Researcher · National Center for Advanced Packaging (China) · China

Tingyu Lin

Tingyu Lin publishes mostly in Electrical and Electronic Engineering, Aerospace Engineering and Mechanical Engineering, on topics such as Electronic Packaging and Soldering Technologies, 3D IC and TSV technologies and Silicon Carbide Semiconductor Technologies.

OpenAlex
World rank
#978,922
of 1,633,909 ranked researchers
Rank in China
#87,365
of 187,979
Works
17
Citations
37
Citations per work
2.2

What does Tingyu Lin research?

Electrical and Electronic Engineering: 58.3%Aerospace Engineering: 12.5%Mechanical Engineering: 4.2%Artificial Intelligence: 4.2%other fields: 20.8%58%top field
Electrical and Electronic Engineering58.3%Aerospace Engineering12.5%Mechanical Engineering4.2%Artificial Intelligence4.2%other fields20.8%

Shares of their own output, by the field each of their topics belongs to. The grey slice is everything not listed.

  1. 1Electrical and Electronic Engineering58% of their works
  2. 2Aerospace Engineering12% of their works
  3. 3Mechanical Engineering4% of their works
  4. 4Artificial Intelligence4% of their works
  5. 5Computer Networks and Communications4% of their works
  6. 6Automotive Engineering4% of their works

Research topics

Which keywords describe Tingyu Lin's research?

The keywords of their largest research topics: High-Temperature Electronics, Thermal Management, Interconnect, Interfacial Reactions, Lead-free Solders, Through-Silicon Via, Reliability and Wide Bandgap Semiconductors.

Size is their works in the topics tagged with each word, from their 8 largest topics. Each links to the topic it comes from most.

All 18 words, with their numbers
  1. High-Temperature Electronics62 topics
  2. Thermal Management62 topics
  3. Interconnect41 topic
  4. Interfacial Reactions41 topic
  5. Lead-free Solders41 topic
  6. Through-Silicon Via41 topic
  7. Reliability21 topic
  8. Wide Bandgap Semiconductors21 topic
  9. Air Force11 topic
  10. Antenna11 topic
  11. Antenna Arrays11 topic
  12. Extreme Learning Machine11 topic
  13. Feedforward Networks11 topic
  14. IEEE 802.1111 topic
  15. MAC Protocol11 topic
  16. Microstrip11 topic
  17. Modernization11 topic
  18. Optimization11 topic

Where does Tingyu Lin work?

Tingyu Lin's main affiliation in the publication record is National Center for Advanced Packaging (China), China.

How many publications and citations does Tingyu Lin have?

Science Explorer counts 17 works and 37 citations for Tingyu Lin, ranking #978,922 of 1,633,909 researchers worldwide on the composite score.

Ranked on field-normalised excellence (50%), output (30%) and citations (20%). Counts come from OpenAlex author records, which occasionally merge different people who share a name or split one person into several.

Other researchers named Tingyu Lin

Papers, co-authors, who cited this work and researchers on the nearest topics are in the interactive view on the map. Is this your page? Request a correction or removal.