Most cited papers in Copper Interconnects and Reliability
What are the most cited papers in Copper Interconnects and Reliability?
The most cited paper in Copper Interconnects and Reliability is "Enhanced magnetoresistance in layered magnetic structures with antiferromagnetic interlayer exchange" (G. Binasch, P. Grünberg, Frank Saurenbach et al., 1989), with 4,300 citations. Next come "Ultrahigh Strength and High Electrical Conductivity in Copper" (3,389) and ""Special points for Brillouin-zone integrations"—a reply" (3,336).
Showing 50 of 100 papers. Every paper with more than 411 citations is listed.
| # | Paper | ||
|---|---|---|---|
| 1 | Enhanced magnetoresistance in layered magnetic structures with antiferromagnetic interlayer exchange G. Binasch, P. Grünberg, Frank Saurenbach et al. · Physical review. B, Condensed matter | Mar 1989 | 4,300 |
| 2 | Ultrahigh Strength and High Electrical Conductivity in Copper Lei Lu, Y.F. Shen, Xianhua Chen et al. · Science | 22 Mar 2004 | 3,389 |
| 3 | "Special points for Brillouin-zone integrations"—a reply J.D. Pack, Hendrik J. Monkhorst · Physical review. B, Solid state | 15 Aug 1977 | 3,336 |
| 4 | The mean free path of electrons in metals E. H. Sondheimer · Advances In Physics | 1952 | 2,617 |
| 5 | Microscopic Theory of Superconductivity J. Bardeen, Leon N. Cooper, J. R. Schrieffer · Physical Review | Apr 1957 | 2,612 |
| 6 | Fracture Toughness Determinations by Indentation Anthony Glyn Evans, E.A. Charles · Journal of the American Ceramic Society | Jul 1976 | 2,344 |
| 7 | Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces A. F. Mayadas, Morris Shatzkes · Physical review. B, Solid state | 15 Feb 1970 | 2,212 |
| 8 | The temperature dependence of positron lifetimes in solid pivalic acid M. Eldrup, David Lightbody, John Neil Sherwood · Chemical Physics | Dec 1981 | 1,927 |
| 9 | Anisotropic magnetoresistance in ferromagnetic 3d alloys Thomas R. McGuire, Robert I. Potter · IEEE Transactions on Magnetics | Jul 1975 | 1,831 |
| 10 | Low dielectric constant materials for microelectronics Karen Maex, Mikhaı̈l R. Baklanov, Denis Shamiryan et al. · Journal of Applied Physics | 22 May 2003 | 1,635 |
| 11 | Thin Film Materials: Stress, Defect Formation and Surface Evolution L. B. Freund, S. Srinivasa Suresh | 2 Feb 2004 | 1,554 |
| 12 | Preparation of monocrystalline Pt microelectrodes and electrochemical study of the plane surfaces cut in the direction of the {111} and {110} planes Jean Clavilier, René Faure, G. Guinet et al. · Journal of Electroanalytical Chemistry | Feb 1980 | 1,505 |
| 13 | Electromigration—A brief survey and some recent results J. R. Black · IEEE Transactions on Electron Devices | Apr 1969 | 1,498 |
| 14 | Structural and electrical properties of granular metal films B. Abeles, Ping Sheng, Maurice D. Coutts et al. · Advances In Physics | May 1975 | 1,388 |
| 15 | Surface Plasmons in Thin Films Eleftherios N. Economou · Physical Review | 10 Jun 1969 | 1,367 |
| 16 | Six cases of reliability study of Pb-free solder joints in electronic packaging technology Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports | Jun 2002 | 1,367 |
| 17 | Damascene copper electroplating for chip interconnections Panayotis C. Andricacos, Cyprian E. Uzoh, John O. Dukovic et al. · IBM Journal of Research and Development | Sep 1998 | 1,226 |
| 18 | Stress-related effects in thin films John A. Thornton, David W. Hoffman · Thin Solid Films | Apr 1989 | 1,169 |
| 19 | Length-scale-dependent deformation mechanisms in incoherent metallic multilayered composites Amit Misra, J. P. Hirth, R.G. Hoagland · Acta Materialia | 25 Aug 2005 | 1,138 |
| 20 | Atomic Layer Deposition Chemistry: Recent Developments and Future Challenges Markku A. Leskelä, Mikko Ritala · Angewandte Chemie International Edition | 18 Nov 2003 | 1,105 |
| 21 | A novel pulsed magnetron sputter technique utilizing very high target power densities Vladimir M. Kouznetsov, Karol Macák, Jochen M. Schneider et al. · Surface and Coatings Technology | Dec 1999 | 1,076 |
| 22 | Recent advances on electromigration in very-large-scale-integration of interconnects K. N. Tu · Journal of Applied Physics | 24 Oct 2003 | 1,074 |
| 23 | Electron mean free path in elemental metals Daniel Gall · Journal of Applied Physics | 23 Feb 2016 | 1,047 |
| 24 | Revised structure zone model for thin film physical structure Russell F. Messier, Anupam Giri, R. Roy · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films | Apr 1984 | 965 |
| 25 | Long-Range Surface-Plasma Waves on Very Thin Metal Films Dror Sarid · Physical Review Letters | 28 Dec 1981 | 950 |
| 26 | Oxidation of Polycrystalline Copper Thin Films at Ambient Conditions Ilia Platzman, Reuven Brener, Hossam Haick et al. · The Journal of Physical Chemistry C | 2008 | 924 |
| 27 | Ferromagnetic resonance of ultrathin metallic layers Michael Farle · Reports on Progress in Physics | Jul 1998 | 920 |
| 28 | Structure and properties of TiN coatings J.‐E. Sundgren · Thin Solid Films | Jun 1985 | 914 |
| 29 | Wettability and spreading kinetics of molten aluminum on copper-coated ceramics Carlos Alberto León-Patiño, Guillermo Mendoza-Suarez, Robin A. L. Drew · Journal of Materials Science | 17 Jul 2006 | 899 |
| 30 | Thin Film Processes John L. Vossen, W. Kern, Julius Klerer · Journal of The Electrochemical Society | May 1980 | 887 |
| 31 | Theory of giant magnetoresistance effects in magnetic layered structures with antiferromagnetic coupling R. E. Camley, J. Barnaś · Physical Review Letters | 7 Aug 1989 | 868 |
| 32 | Structure Evolution During Processing of Polycrystalline Films Carl V. Thompson · Annual Review of Materials Science | Aug 2000 | 847 |
| 33 | A 45nm Logic Technology with High-k+Metal Gate Transistors, Strained Silicon, 9 Cu Interconnect Layers, 193nm Dry Patterning, and 100% Pb-free Packaging K. Mistry et al. | Dec 2007 | 847 |
| 34 | Electromigration in metals Pui Shing Ho, T Kwok · Reports on Progress in Physics | Mar 1989 | 837 |
| 35 | Positron annihilation spectroscopy for chemical analysis: A novel probe for microstructural analysis of polymers Yanching C. Jean · Microchemical Journal | Aug 1990 | 798 |
| 36 | Low-Frequency Negative Resistance in Thin Anodic Oxide Films T. W. Hickmott · Journal of Applied Physics | Sep 1962 | 756 |
| 37 | Electrical Conduction Mechanism in Ultrathin, Evaporated Metal Films C. A. Neugebauer, Maurice B. Webb · Journal of Applied Physics | 1962 | 753 |
| 38 | Reactive-sputter-deposited TiN films on glass substrates Joshua Pelleg, Levy Zevin, S. Lungo et al. · Thin Solid Films | Mar 1991 | 751 |
| 39 | Fundamental structure forming phenomena of polycrystalline films and the structure zone models P.B. Barna, M. Adamik · Thin Solid Films | Apr 1998 | 747 |
| 40 | Electrical characterization of thin Al2O3 films grown by atomic layer deposition on silicon and various metal substrates Markus D. Groner, Jeffrey W. Elam, Francois H. Fabreguette et al. · Thin Solid Films | Jun 2002 | 743 |
| 41 | Stress evolution due to electromigration in confined metal lines Matt A. Korhonen, P. Bo rgesen, K. N. Tu et al. · Journal of Applied Physics | 15 Apr 1993 | 739 |
| 42 | Fundamental understanding and modeling of reactive sputtering processes S. Berg, Tomas Nyberg · Thin Solid Films | 8 Jan 2005 | 717 |
| 43 | Defects associated with the accommodation of misfit between crystals Janet W. Matthews · Journal of Vacuum Science and Technology | 1975 | 699 |
| 44 | Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization A. Grill, Deborah A. Neumayer · Journal of Applied Physics | 7 Nov 2003 | 696 |
| 45 | Sputter Deposition of BiSrCaCuO Thin Films Masao Fukutomi, Junichi Machida, Yoshiaki Tanaka et al. · Japanese Journal of Applied Physics | Apr 1988 | 692 |
| 46 | Epitaxial YBa 2 Cu 3 O 7 on Biaxially Textured Nickel (001): An Approach to Superconducting Tapes with High Critical Current Density D. P. Norton, Amit Kumar Goyal, J. D. Budai et al. · Science | Nov 1996 | 688 |
| 47 | Inhibition of copper corrosion by 1,2,3-benzotriazole: A review Matjaž Finšgar, Ingrid Milošev · Corrosion Science | 11 May 2010 | 688 |
| 48 | Tantalum pentoxide (Ta2O5) thin films for advanced dielectric applications C. Chaneliere, Jean‐Luc Autran, Roderick A. B. Devine et al. · Materials Science and Engineering R Reports | May 1998 | 681 |
| 49 | Electromigration failure modes in aluminum metallization for semiconductor devices J. R. Black · Proceedings of the IEEE | 1969 | 679 |
| 50 | A Handbook of Lattice Spacings and Structures of Metals and Alloys William B. Pearson, George H. Vineyard · Physics Today | Sep 1958 | 677 |
Citations are OpenAlex's own counts, from its 2026-09-23 snapshot, so the ranking can differ from Google Scholar or Web of Science. A paper is listed for a field when OpenAlex files it under one of the field's topics; retracted papers and papers whose citation count cannot be traced to citing works are left out, and a preprint and the article it became are shown once. Release dates are OpenAlex's: where a source gave only a month or a year, that is what is shown. How the lists are chosen.