Copper Interconnects and Reliability

Copper Interconnects and Reliability is a research topic within Electronic, Optical and Magnetic Materials. Science Explorer counts 27k research works in it since 1950. 10.0% of them reached the world's top 10% most cited for their field and year.

This cluster of papers focuses on the development and characterization of low dielectric constant (low-k) materials for microelectronics, with an emphasis on their application in copper metallization and interconnect scaling. The papers cover topics such as electromigration, thin films, plasma processing, diffusion barriers, and the electrical resistivity of nanowires.

• Low-k Dielectrics
• Microelectronics
• Electromigration
• Copper Metallization
• Interconnect Scaling
• Thin Films
• Electrical Resistivity
• Plasma Processing
• Diffusion Barriers
• Nanowires